KR900700302A - Ic카드 및 그 제조방법 - Google Patents

Ic카드 및 그 제조방법

Info

Publication number
KR900700302A
KR900700302A KR1019890702399A KR890702399A KR900700302A KR 900700302 A KR900700302 A KR 900700302A KR 1019890702399 A KR1019890702399 A KR 1019890702399A KR 890702399 A KR890702399 A KR 890702399A KR 900700302 A KR900700302 A KR 900700302A
Authority
KR
South Korea
Prior art keywords
recess
module
card
card according
inner bottom
Prior art date
Application number
KR1019890702399A
Other languages
English (en)
Other versions
KR920006339B1 (ko
Inventor
미쯔아끼 우에니시
요시히사 다까세
다까시 후지이
Original Assignee
다니이 아끼오
마쓰시다 덴기 산교 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63097076A external-priority patent/JPH01267098A/ja
Priority claimed from JP63097071A external-priority patent/JPH01267097A/ja
Priority claimed from JP63098661A external-priority patent/JPH01269597A/ja
Priority claimed from PCT/JP1988/000418 external-priority patent/WO1988008561A1/ja
Application filed by 다니이 아끼오, 마쓰시다 덴기 산교 가부시기가이샤 filed Critical 다니이 아끼오
Publication of KR900700302A publication Critical patent/KR900700302A/ko
Application granted granted Critical
Publication of KR920006339B1 publication Critical patent/KR920006339B1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D15/00—Printed matter of special format or style not otherwise provided for
    • B42D15/02—Postcards; Greeting, menu, business or like cards; Letter cards or letter-sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • B42D25/465—Associating two or more layers using chemicals or adhesives
    • B42D25/47—Associating two or more layers using chemicals or adhesives using adhesives
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • B42D2033/46—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/324—Reliefs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/475—Cutting cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

내용 없음

Description

IC카드 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도 (a), (b)는 본 발명의 일실시예를 나타낸 IC카드의 평면도와, 제1도 (a)의 A-A'선의 단면도,
제2도는 본 발명의 일실시예를 IC카드에 사용하는 IC모듈의 단면도.

Claims (20)

  1. 카드기체와, 이 카드기체에 형성된 제 1의 요부 내에 설치한 IC모듈과, 이 IC모듈을 상기 제1의 요부의 내저면주에 접착한 접착제를 구비하고, 상기 제1의 요부의 내측면과 상기 IC모듈의 외측면과의 사이에는, 제 1의 요부의 내상부가 넓고, 제1의 요부의 내하부가 좁은 간극을 설치한 IC카드
  2. 청구의 범위 제 1항에 있어서, IC모듈의 외측면은 하측으로 향하여 외측으로 넓어지는 경사를 설치한 IC카드
  3. 청구의 범위 제 1항에 있어서, IC모듈의 저면부에는 철부를 형성한 IC카드
  4. 청구의 범위 제 1항에 있어서, 제 1의 요부의 내저면부에는 제 2의 요부를 형성한 IC카드.
  5. 청구의 범위 제4항에 있어서, IC모듈의 저면부에는, 제2의 요부 내에 돌입하는 철부를 형성한 IC카드.
  6. 카드기체와, 이 카드기체에 형성한 제 1의 요부내에 설치한 IC모듈과, 이 IC모듈을 상기 제 1의 요부의 내저면부에 접착한 접착제를 구비하고, 상기 제1 의 요부의 내측면과 상기 IC모듈의 외측면과의 사이에는, 제 1의 요부의 내상부로 부터 내하부로 향하여, 이들 제 1의 요부의 내측면과 IC모듈의 외측면과의 사이가 서서히 좁아지는 간극을 설치한 IC카드.
  7. 청구의 범위 제 6항에 있어서, 제 1의 요부의 내저면부에는, 제 2의 요부를 형성한 IC카드.
  8. 청구의 범위 제 7항에 있어서, IC모듈의 내저면부에는, 제 2의 요부내에 돌입하는 철부를 형성한 IC카드.
  9. 카드기체와, 이 카드기체에 형성한 제 1의 요부내에 설치한 IC모듈과, 이 IC모듈을 상기 제 1의 요부의 내저면부에 접착한 접착제를 구비하고, 상기 제 1의 요부의 내측면은, 이 제 1의 요부의 내저면으로 향하여 안쪽으로 경사시킨 IC카드.
  10. 청구의 범위 제 9항에 있어서, IC모듈의 외측면은, 아래쪽으로 향하여 바깥쪽으로 넓어지는 경사를 설치한 IC카드.
  11. 청구의 범위 제 9항에 있어서, IC모듈의 저면에는 철부를 형성한 IC카드.
  12. 청구의 범위 제 9항에 있어서, 제 1의 요부의 내저면부에는 제 2의 요부를 형성한 IC카드.
  13. 청구의 범위 제 12항에 있어서, IC모듈의 저면부에는 제 2의 요부내에 돌입하는 철부를 형성한 IC카드.
  14. 카드기체와, 이 카드기체에 형성한 제 1의 요부내에 설치한 IC모듈과, 이 IC모듈을 상기 제 1의 요부의 내저면부에 접착한 탄성을 가지는 접착제를 구비하고, 상기 제 1의 요부의 내측면과 상기 IC모듈의 외측면과의 사이에는, 제 1의 요부의 내상부로 부터 내하부로 향하여 이들의 제 1의 요부의 내측면과 IC모듈의 외측면과의 사이가 서서히 좁아지는 간극을 설치한 IC카드.
  15. 청구의 범위 제 14항에 있어서, 접착제로서, 실리콘의 변성 폴리머를 주성분으로 하는 접착제를 사용한 IC카드.
  16. 청구의 범위 제 14항에 있어서, 제 1의 요부의 내저면부에는 제 2의 요부를 형성한 IC카드.
  17. 청구의 범위 제 16항에 있어서, IC모듈의 저면부에는, 제 2의 요부내에 돌입하는 철부를 형성한 IC카드.
  18. 카드기체의 소정 부분에, 내측면이 아래쪽으로 향하여 내측으로 경사진 제 1의 요부를 형성하고, 다음에 이 제 1의 요부의 내저면상에 접착제를 설치하고, 그다음 이 접착제상에, IC모듈을 얹고, 다음에 이 IC모듈을 제 1의 요부의 내저면으로 향하여 가압하고, 그후 상기 접착제를 경화시키는 IC카드의 제조방법.
  19. 청구의 범위 제 18항에 있어서, 제 1의 요부의 내저면에는 제 2의 요부를 형성하는 IC카드의 제조방법.
  20. 청구의 범위 제 19항에 있어서, 제2의 요부내에는 IC모듈의 저면에 형성한 돌출부를 설치한 IC카드의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890702399A 1988-04-20 1989-04-19 Ic카드 KR920006339B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP88-97071 1988-04-20
JP88-97076 1988-04-20
JP63097076A JPH01267098A (ja) 1988-04-20 1988-04-20 Ｉｃカードおよびその製造方法
JP63097071A JPH01267097A (ja) 1988-04-20 1988-04-20 Ｉｃカードおよびその製造方法
JP88-98661 1988-04-21
JP63098661A JPH01269597A (ja) 1988-04-21 1988-04-21 Ｉｃカードの製造方法
PCT/JP1988/000418 WO1988008561A1 (en) 1987-04-30 1988-04-27 Robot controller

Publications (2)

Publication Number Publication Date
KR900700302A true KR900700302A (ko) 1990-08-13
KR920006339B1 KR920006339B1 (ko) 1992-08-03

Family

ID=27308316

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890702399A KR920006339B1 (ko) 1988-04-20 1989-04-19 Ic카드

Country Status (4)

Country Link
EP (1) EP0370114B1 (ko)
KR (1) KR920006339B1 (ko)
DE (1) DE68923686T2 (ko)
WO (1) WO1989010269A1 (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9014545D0 (en) * 1990-06-29 1990-08-22 Gec Avery Ltd Circuit substrate for flexible card
CA2051836C (en) * 1990-11-30 1996-07-23 Richard Michael Flynn Personal data card construction
GB2250474B (en) * 1990-12-04 1994-04-20 Portals Ltd Security articles
DE69317180T2 (de) * 1992-08-28 1998-10-08 Citizen Watch Co Ltd Verfahren zur Herstellung von IC-Karten
NL9301764A (nl) * 1993-10-12 1995-05-01 Datacard B V Werkwijze voor het maken van een kaart met een venster voor het opnemen van een gegevens-bevattende inrichting, alsmede aldus verkregen kaart.
DE4344297A1 (de) * 1993-12-23 1995-06-29 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Ausweiskarten
EP0694873B1 (en) * 1994-07-25 2003-01-22 Dai Nippon Printing Co., Ltd. Optical card
FR2735256A1 (fr) * 1995-06-09 1996-12-13 Solaic Sa Carte a circuit integre
FR2775099B1 (fr) * 1998-02-13 2000-03-31 Schlumberger Ind Sa Procede de fabrication d'une carte a circuit integre
FR2833801B1 (fr) * 2001-12-19 2005-07-01 Oberthur Card Syst Sa Procede de realisation d'une carte a microcircuit
US7823777B2 (en) * 2003-01-03 2010-11-02 American Express Travel Related Services Company, Inc. Metal-containing transaction card and method of making same
DE102007022865A1 (de) * 2007-05-15 2008-11-20 Thermo Tex Nagel Gmbh Transponder zur Kennzeichnung von Wäscheteilen
KR101359466B1 (ko) * 2012-07-11 2014-03-12 (주)하이컨셉카드랩 절연체가 구비된 금속 포함 스마트 카드
DE102016121225A1 (de) * 2016-11-07 2018-05-09 Schreiner Group Gmbh & Co. Kg RFID-Etikett zum Kennzeichnen eines Wäschestücks
US10115047B2 (en) * 2016-12-09 2018-10-30 Capital One Services, Llc Transaction card with secured magnetic strip and method for making the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3122981A1 (de) * 1981-06-10 1983-01-05 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Verfahren zum einbau von ic-bausteinen in ausweiskarten
JPS58135656A (ja) * 1982-02-08 1983-08-12 Dainippon Printing Co Ltd Ｉｃモジユ−ル
JPS62103195A (ja) * 1985-10-30 1987-05-13 株式会社東芝 携帯可能記憶媒体
JPS62214998A (ja) * 1986-03-17 1987-09-21 三菱電機株式会社 薄型半導体カ−ド
JPS62240594A (ja) * 1986-04-11 1987-10-21 富士写真フイルム株式会社 Ｉｃカ−ド

Also Published As

Publication number Publication date
DE68923686T2 (de) 1996-01-25
EP0370114A1 (en) 1990-05-30
EP0370114B1 (en) 1995-08-02
EP0370114A4 (en) 1991-07-24
DE68923686D1 (de) 1995-09-07
WO1989010269A1 (en) 1989-11-02
KR920006339B1 (ko) 1992-08-03

Similar Documents

Publication Publication Date Title
KR900700302A (ko) Ic카드 및 그 제조방법
KR900008701A (ko) 반도체 장치의 제조방법
ES2106906T3 (es) Componente con circuitos integrados.
KR940003002A (ko) 집적회로
EP0788157A3 (en) Resin molded package with excellent high frequency characteristics
SE8202276L (sv) Identitetskort med ic-komponent
KR920005811A (ko) 정전 척
TW329565B (en) The semiconductor component & its manufacturing method
KR890010740A (ko) 메모리 카드용 전자 부품 지지부 및 그것을 이용한 메모리 카드
KR920008954A (ko) 반도체 장치
ES2074139T5 (es) Tarjeta de c.i. que tiene un modulo de circuito integrado.
KR910015034A (ko) 반도체장치의 수지봉지장치
KR890005859A (ko) 집적회로 칩 조립품
KR850001642A (ko) 증폭기 회로
KR910001917A (ko) 반도체장치
KR880009364A (ko) 카세트 리일
KR920007509A (ko) 박형 메모리 모듈
KR830003144A (ko) 램프장치의 필라덴트 조립체 설치용 부재
KR860002865A (ko) 열발산장치가 일체로 부착된 집적회로 패키지
EP0271267A3 (en) Piezo-electric signalling device
KR920013757A (ko) 멀티 에미터 트랜지스터 구조
KR850005168A (ko) 쌍방성 제너 다이오우드
KR970028583A (ko) 큐.에프.피용 테스트 소켓
KR910007099A (ko) 개선된 리드 프레임
KR970024054A (ko) 인너 리드를 이용해 칩 마운팅하는 패키지 제조방법

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 19960719

Year of fee payment: 5

LAPS Lapse due to unpaid annual fee