SE8202276L - Identitetskort med ic-komponent - Google Patents

Identitetskort med ic-komponent

Info

Publication number
SE8202276L
SE8202276L SE8202276A SE8202276A SE8202276L SE 8202276 L SE8202276 L SE 8202276L SE 8202276 A SE8202276 A SE 8202276A SE 8202276 A SE8202276 A SE 8202276A SE 8202276 L SE8202276 L SE 8202276L
Authority
SE
Sweden
Prior art keywords
anchoring element
carrier
card
identification card
component
Prior art date
Application number
SE8202276A
Other languages
English (en)
Other versions
SE458563B (sv
Inventor
J Hoppe
Y Haghiri-Tehrani
Original Assignee
Gao Ges Automation Org
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25792684&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SE8202276(L) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Gao Ges Automation Org filed Critical Gao Ges Automation Org
Publication of SE8202276L publication Critical patent/SE8202276L/sv
Publication of SE458563B publication Critical patent/SE458563B/sv

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
    • B42D2033/22—
    • B42D2033/30—
    • B42D2033/46—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S283/00—Printed matter
    • Y10S283/904—Credit card

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Financial Or Insurance-Related Operations Such As Payment And Settlement (AREA)
SE8202276A 1981-04-14 1982-04-08 Identitetskort med ic-komponent, anordnad med ett foerankringselement SE458563B (sv)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3115045 1981-04-14
DE3131216A DE3131216C3 (de) 1981-04-14 1981-08-06 Ausweiskarte mit IC-Baustein

Publications (2)

Publication Number Publication Date
SE8202276L true SE8202276L (sv) 1982-10-15
SE458563B SE458563B (sv) 1989-04-10

Family

ID=25792684

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8202276A SE458563B (sv) 1981-04-14 1982-04-08 Identitetskort med ic-komponent, anordnad med ett foerankringselement

Country Status (10)

Country Link
US (1) US4463971A (sv)
JP (1) JPS5812082A (sv)
BE (1) BE892726A (sv)
CH (1) CH656239A5 (sv)
DE (3) DE3153769C2 (sv)
FR (1) FR2503902B1 (sv)
GB (1) GB2096541B (sv)
IT (1) IT1151713B (sv)
NL (1) NL194215C (sv)
SE (1) SE458563B (sv)

Families Citing this family (93)

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US4285760A (en) * 1979-10-25 1981-08-25 Hughes Aircraft Company Zone purification of cylindrical ingots
DE3123198C2 (de) * 1980-12-08 1993-10-07 Gao Ges Automation Org Trägerelemente für einen IC-Baustein
FR2527036A1 (fr) * 1982-05-14 1983-11-18 Radiotechnique Compelec Procede pour connecter un semiconducteur a des elements d'un support, notamment d'une carte portative
JPS5983285A (ja) * 1982-11-04 1984-05-14 Toppan Printing Co Ltd カ−ド製造法
JPS59103163A (ja) * 1982-12-03 1984-06-14 Casio Comput Co Ltd シ−ト状小型電子機器
DE3248385A1 (de) * 1982-12-28 1984-06-28 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit integriertem schaltkreis
JPS59229686A (ja) * 1983-06-09 1984-12-24 Toshiba Corp Ｉｃカ−ド
EP0128822B1 (fr) * 1983-06-09 1987-09-09 Flonic S.A. Procédé de fabrication de cartes à mémoire et cartes obtenues suivant ce procédé
JPS6082359U (ja) * 1983-06-27 1985-06-07 凸版印刷株式会社 集積回路内蔵カード
JPS6015786A (ja) * 1983-07-06 1985-01-26 Dainippon Printing Co Ltd Ｉｃカ−ドおよびその製造法
JPS6062252A (ja) * 1983-09-16 1985-04-10 Toshiba Corp 暗号回路内蔵カード及びそのサービスセンター
JPS60126863U (ja) * 1984-01-30 1985-08-26 共同印刷株式会社 Ｉｃカ−ド
JPS60189587A (ja) * 1984-03-09 1985-09-27 Dainippon Printing Co Ltd Ｉｃカ−ド
FR2564622B1 (fr) * 1984-05-21 1988-08-26 Calvados Hubert Procede et dispositif de realisation de tous documents nominatifs et documents obtenus
JPS60252992A (ja) * 1984-05-30 1985-12-13 Toshiba Corp Ｉｃカ−ド
US4677528A (en) * 1984-05-31 1987-06-30 Motorola, Inc. Flexible printed circuit board having integrated circuit die or the like affixed thereto
JPS6191790A (ja) * 1984-10-12 1986-05-09 カシオ計算機株式会社 カ−ド照合装置
JPH0616506B2 (ja) * 1984-12-26 1994-03-02 株式会社半導体エネルギー研究所 積層体の側周辺に選択的に被膜を形成する方法
CH661808A5 (fr) * 1985-01-21 1987-08-14 Lupa Finances Carte munie d'un microprocesseur et/ou d'au moins une memoire electronique.
JPS61201390A (ja) * 1985-03-04 1986-09-06 Casio Comput Co Ltd Ｉｃカ−ド
FR2579799B1 (fr) * 1985-03-28 1990-06-22 Flonic Sa Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede
FR2580416B1 (fr) * 1985-04-12 1987-06-05 Radiotechnique Compelec Procede et dispositif pour fabriquer une carte d'identification electronique
FR2584235B1 (fr) * 1985-06-26 1988-04-22 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
JPS6255195A (ja) * 1985-09-05 1987-03-10 大日本印刷株式会社 Ｉｃカ−ド
JPH0745270B2 (ja) * 1986-03-04 1995-05-17 大日本印刷株式会社 Ｉｃカ−ド
JPH0655555B2 (ja) * 1985-07-27 1994-07-27 大日本印刷株式会社 Ｉｃカ−ドおよびｉｃモジュール
DE3689094T2 (de) * 1985-07-27 1994-03-10 Dainippon Printing Co Ltd IC-Karte.
DE3528687A1 (de) * 1985-08-09 1987-02-12 Oldenbourg Graphik R Verfahren und herstellen einer ausweiskarte und ausweiskarte
JPH0679878B2 (ja) * 1985-09-24 1994-10-12 カシオ計算機株式会社 Ｉｃカ−ド
FR2588695B1 (fr) * 1985-10-11 1988-07-29 Eurotechnique Sa Procede de fabrication d'un microboitier, microboitier a contacts effleurants et application aux cartes contenant des composants
JPH0439026Y2 (sv) * 1985-11-29 1992-09-11
US4755661A (en) * 1986-01-10 1988-07-05 Ruebsam Herrn H Connection of electronic components in a card
JPS62179994A (ja) * 1986-02-04 1987-08-07 カシオ計算機株式会社 電子カ−ド
JPH0696356B2 (ja) * 1986-03-17 1994-11-30 三菱電機株式会社 薄型半導体カード
JPS62214998A (ja) * 1986-03-17 1987-09-21 三菱電機株式会社 薄型半導体カ−ド
JPS62218196A (ja) * 1986-03-20 1987-09-25 日立マクセル株式会社 Ｉｃカ−ド
US4742215A (en) * 1986-05-07 1988-05-03 Personal Computer Card Corporation IC card system
FR2599165A1 (fr) * 1986-05-21 1987-11-27 Michot Gerard Objet associe a un element electronique et procede d'obtention
JPS62199367U (sv) * 1986-06-10 1987-12-18
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
JPH0696357B2 (ja) * 1986-12-11 1994-11-30 三菱電機株式会社 Ｉｃカードの製造方法
FR2620586A1 (fr) * 1987-09-14 1989-03-17 Em Microelectronic Marin Sa Procede de fabrication de modules electroniques, notamment pour cartes a microcircuits
JPH02598A (ja) * 1987-10-09 1990-01-05 De La Rue Co Plc:The 集積回路カード
JP2578443B2 (ja) * 1987-10-13 1997-02-05 大日本印刷株式会社 Ｉｃカードおよびｉｃカード用ｉｃモジュール
FR2625000B1 (fr) * 1987-12-22 1991-08-16 Sgs Thomson Microelectronics Structure de carte a puce
US4943708A (en) * 1988-02-01 1990-07-24 Motorola, Inc. Data device module having locking groove
US4961893A (en) * 1988-04-28 1990-10-09 Schlumberger Industries Method for manufacturing memory cards
FR2630843B1 (fr) * 1988-04-28 1990-08-03 Schlumberger Ind Sa Procede de realisation de cartes comportant des elements graphiques et cartes obtenues par ledit procede
GB8901189D0 (en) * 1989-01-19 1989-03-15 Avery W & T Limited Portable electronic token
JPH0271676U (sv) * 1988-11-21 1990-05-31
JPH04219688A (ja) * 1990-05-16 1992-08-10 Seiko Epson Corp Ｉｃカード
FR2662000A1 (fr) * 1990-05-11 1991-11-15 Philips Composants Carte a microcircuit.
FR2665281B1 (fr) * 1990-07-30 1993-11-19 Gemplus Card International Procede de fabrication d'une carte a microcircuit et carte obtenue par ce procede.
DE9100665U1 (sv) * 1991-01-21 1992-07-16 Telbus Gesellschaft Fuer Elektronische Kommunikations-Systeme Mbh, 8057 Eching, De
JP3290986B2 (ja) * 1991-05-10 2002-06-10 ゲーアーオー ゲゼルシャフト フュア アウトマツィオーン ウント オルガニザツィオーン ミット ベシュレンクテル ハフツング 壁面の厚さを部分的に薄くしたプラスチック成形物の製造方法及び製造装置
FR2684471B1 (fr) * 1991-12-02 1994-03-04 Solaic Procede de fabrication d'une carte a memoire et carte a memoire ainsi obtenue.
US5350945A (en) * 1991-12-18 1994-09-27 Casio Computer Co., Ltd. Coin-shaped integrated circuit memory device
JP3173171B2 (ja) * 1991-12-19 2001-06-04 カシオ計算機株式会社 情報転送システム
DE4223371A1 (de) * 1992-07-16 1994-01-20 Thomson Brandt Gmbh Verfahren und Platine zur Montage von Bauelementen
US5689136A (en) 1993-08-04 1997-11-18 Hitachi, Ltd. Semiconductor device and fabrication method
US7137011B1 (en) 1993-09-01 2006-11-14 Sandisk Corporation Removable mother/daughter peripheral card
DE4345473B4 (de) * 1993-11-06 2006-03-23 Ods Landis & Gyr Gmbh & Co. Kg Kontaktlose Chipkarte mit Antennenspule
US6819916B1 (en) 1993-11-23 2004-11-16 Bellsouth Intellectual Property Corporation Memory device for a cellular telephone
TW249877B (sv) * 1993-11-23 1995-06-21 Bellsouth Int Inc
US5581445A (en) * 1994-02-14 1996-12-03 Us3, Inc. Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module
US5451763A (en) * 1994-07-05 1995-09-19 Alto Corporation Personal medical IC card and read/write unit
DE4443767A1 (de) * 1994-12-08 1996-06-13 Giesecke & Devrient Gmbh Elektronisches Modul und Datenträger mit elektrischem Modul
US5703350A (en) * 1995-10-31 1997-12-30 Lucent Technologies Inc. Data carriers having an integrated circuit unit
DE19654902C2 (de) * 1996-03-15 2000-02-03 David Finn Chipkarte
DE19701163C2 (de) * 1997-01-15 2001-12-06 Siemens Ag Elektrische Schaltung insbesondere für eine Chipkarte
WO1998059317A1 (fr) * 1997-06-23 1998-12-30 Rohm Co., Ltd. Module pour carte a circuit integre, carte a circuit integre, et procede de fabrication d'un tel module
DE19735387A1 (de) * 1997-08-14 1999-02-18 Siemens Ag Trägerkarte und Halbleitermodul für eine derartige Trägerkarte
US6040622A (en) * 1998-06-11 2000-03-21 Sandisk Corporation Semiconductor package using terminals formed on a conductive layer of a circuit board
US6179210B1 (en) * 1999-02-09 2001-01-30 Motorola, Inc. Punch out pattern for hot melt tape used in smartcards
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US6221545B1 (en) 1999-09-09 2001-04-24 Imation Corp. Adhesives for preparing a multilayer laminate featuring an ink-bearing surface bonded to a second surface
JP4580525B2 (ja) * 2000-09-13 2010-11-17 大日本印刷株式会社 補強部材搭載ｉｃカード
JP3931330B2 (ja) * 2001-09-14 2007-06-13 ソニー株式会社 熱プレス用プレートおよびカード製造装置
US7140540B2 (en) * 2002-05-08 2006-11-28 Lasercard Corporation Method of making secure personal data card
US6956482B2 (en) * 2002-08-08 2005-10-18 B&G Plastics, Inc. Electronic article surveillance marker assembly and method for making the same
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US8267327B2 (en) * 2007-02-17 2012-09-18 Qsecure, Inc. Payment card manufacturing technology
FR2915009B1 (fr) * 2007-04-10 2009-06-05 Smart Packaging Solutions Sps Module d'identification radiofrequence, et document de securite l'incorporant, notamment passeport electronique
US7980477B2 (en) * 2007-05-17 2011-07-19 Féinics Amatech Teoranta Dual interface inlays
TW200905753A (en) * 2007-07-18 2009-02-01 Yuen Foong Yu Paper Mfg Co Ltd Flexible and super-thin smart card and packaging method thereof
JP5487609B2 (ja) * 2007-12-28 2014-05-07 株式会社リコー 可逆性感熱記録媒体
EP2369904A1 (fr) * 2010-03-16 2011-09-28 Gemalto SA Module électronique à contacts latéraux, dispositif le comportant et procédé de fabrication d'un tel module
US8789762B2 (en) 2010-08-12 2014-07-29 Feinics Amatech Teoranta RFID antenna modules and methods of making
US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
USD729808S1 (en) * 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
USD780763S1 (en) * 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
WO2019173455A1 (en) * 2018-03-07 2019-09-12 X-Card Holdings, Llc Metal card

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3702464A (en) * 1971-05-04 1972-11-07 Ibm Information card
US4017834A (en) * 1973-05-04 1977-04-12 Cuttill William E Credit card construction for automatic vending equipment and credit purchase systems
FR2337381A1 (fr) * 1975-12-31 1977-07-29 Honeywell Bull Soc Ind Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte
US4222516A (en) * 1975-12-31 1980-09-16 Compagnie Internationale Pour L'informatique Cii-Honeywell Bull Standardized information card
FR2439438A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux
DE2920012B1 (de) * 1979-05-17 1980-11-20 Gao Ges Automation Org Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte
FR2486685B1 (fr) * 1980-07-09 1985-10-31 Labo Electronique Physique Carte de paiement electronique et procede de realisation
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
DE3123198C2 (de) * 1980-12-08 1993-10-07 Gao Ges Automation Org Trägerelemente für einen IC-Baustein
DE3111516A1 (de) * 1981-03-24 1982-12-23 GAO Gesellschaft für Automation und Organisation mbH, 8000 München "ausweiskarte mit ic-baustein"

Also Published As

Publication number Publication date
NL194215C (nl) 2001-09-04
IT8220701A0 (it) 1982-04-13
CH656239A5 (de) 1986-06-13
NL8201141A (nl) 1982-11-01
US4463971A (en) 1984-08-07
JPS5812082A (ja) 1983-01-24
IT1151713B (it) 1986-12-24
GB2096541A (en) 1982-10-20
DE3153769C2 (de) 1995-10-26
DE3131216C2 (sv) 1994-09-01
BE892726A (fr) 1982-08-02
NL194215B (nl) 2001-05-01
DE3153768C2 (de) 1995-11-09
FR2503902B1 (fr) 1986-02-28
GB2096541B (en) 1984-10-17
DE3131216C3 (de) 1994-09-01
DE3131216A1 (de) 1982-11-04
JPS6315638B2 (sv) 1988-04-05
FR2503902A1 (fr) 1982-10-15
SE458563B (sv) 1989-04-10

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