IT8220701A0 - Carta di identificazione includente un modulo a circuito integrato per l'elaborazione di segnali elettrici resistente ad intense sollecitazioni meccaniche. - Google Patents

Carta di identificazione includente un modulo a circuito integrato per l'elaborazione di segnali elettrici resistente ad intense sollecitazioni meccaniche.

Info

Publication number
IT8220701A0
IT8220701A0 IT8220701A IT2070182A IT8220701A0 IT 8220701 A0 IT8220701 A0 IT 8220701A0 IT 8220701 A IT8220701 A IT 8220701A IT 2070182 A IT2070182 A IT 2070182A IT 8220701 A0 IT8220701 A0 IT 8220701A0
Authority
IT
Italy
Prior art keywords
integrated circuit
signal processing
electrical signal
circuit module
mechanical stress
Prior art date
Application number
IT8220701A
Other languages
English (en)
Other versions
IT1151713B (it
Inventor
Joachim Hoppe
Yahya Haghiri Tehrani
Original Assignee
Gao Ges Automation Org
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25792684&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=IT8220701(A0) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Gao Ges Automation Org filed Critical Gao Ges Automation Org
Publication of IT8220701A0 publication Critical patent/IT8220701A0/it
Application granted granted Critical
Publication of IT1151713B publication Critical patent/IT1151713B/it

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42DBOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40Manufacture
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42DBOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • G06K19/07728Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5388Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
    • B42D2033/22
    • B42D2033/30
    • B42D2033/46
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S283/00Printed matter
    • Y10S283/904Credit card

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Financial Or Insurance-Related Operations Such As Payment And Settlement (AREA)
IT20701/82A 1981-04-14 1982-04-13 Carta di identificazione includente un modulo a circuito integrato per l'elaborazione di segnali elettrici resistente ad intense sollecitazioni meccaniche IT1151713B (it)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3115045 1981-04-14
DE3131216A DE3131216C3 (de) 1981-04-14 1981-08-06 Ausweiskarte mit IC-Baustein

Publications (2)

Publication Number Publication Date
IT8220701A0 true IT8220701A0 (it) 1982-04-13
IT1151713B IT1151713B (it) 1986-12-24

Family

ID=25792684

Family Applications (1)

Application Number Title Priority Date Filing Date
IT20701/82A IT1151713B (it) 1981-04-14 1982-04-13 Carta di identificazione includente un modulo a circuito integrato per l'elaborazione di segnali elettrici resistente ad intense sollecitazioni meccaniche

Country Status (10)

Country Link
US (1) US4463971A (it)
JP (1) JPS5812082A (it)
BE (1) BE892726A (it)
CH (1) CH656239A5 (it)
DE (3) DE3153769C2 (it)
FR (1) FR2503902B1 (it)
GB (1) GB2096541B (it)
IT (1) IT1151713B (it)
NL (1) NL194215C (it)
SE (1) SE458563B (it)

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DE3111516A1 (de) * 1981-03-24 1982-12-23 GAO Gesellschaft für Automation und Organisation mbH, 8000 München "ausweiskarte mit ic-baustein"

Also Published As

Publication number Publication date
FR2503902B1 (fr) 1986-02-28
SE458563B (sv) 1989-04-10
NL194215C (nl) 2001-09-04
GB2096541B (en) 1984-10-17
US4463971A (en) 1984-08-07
DE3131216C3 (de) 1994-09-01
DE3153769C2 (de) 1995-10-26
DE3131216C2 (it) 1994-09-01
NL194215B (nl) 2001-05-01
DE3153768C2 (de) 1995-11-09
FR2503902A1 (fr) 1982-10-15
SE8202276L (sv) 1982-10-15
BE892726A (fr) 1982-08-02
JPS5812082A (ja) 1983-01-24
JPS6315638B2 (it) 1988-04-05
DE3131216A1 (de) 1982-11-04
GB2096541A (en) 1982-10-20
NL8201141A (nl) 1982-11-01
IT1151713B (it) 1986-12-24
CH656239A5 (de) 1986-06-13

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