FR2439438A1 - Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux - Google Patents

Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux

Info

Publication number
FR2439438A1
FR2439438A1 FR7829846A FR7829846A FR2439438A1 FR 2439438 A1 FR2439438 A1 FR 2439438A1 FR 7829846 A FR7829846 A FR 7829846A FR 7829846 A FR7829846 A FR 7829846A FR 2439438 A1 FR2439438 A1 FR 2439438A1
Authority
FR
France
Prior art keywords
signal processing
manufacturing
application
tape
carrying electric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7829846A
Other languages
English (en)
Other versions
FR2439438B1 (fr
Inventor
Patrick Courant
Louis Delorme
Robert Chikli Pariente
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bull SA
Original Assignee
Bull SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bull SA filed Critical Bull SA
Priority to FR7829846A priority Critical patent/FR2439438A1/fr
Priority to NL7905298A priority patent/NL7905298A/nl
Priority to SE7906961A priority patent/SE7906961L/xx
Priority to GB7929905A priority patent/GB2047474A/en
Priority to JP13007579A priority patent/JPS5556639A/ja
Priority to DE19792942397 priority patent/DE2942397A1/de
Priority to IT7926626A priority patent/IT7926626A0/it
Publication of FR2439438A1 publication Critical patent/FR2439438A1/fr
Application granted granted Critical
Publication of FR2439438B1 publication Critical patent/FR2439438B1/fr
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4839—Assembly of a flat lead with an insulating support, e.g. for TAB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Abstract

L'INVENTION SE RAPPORTE A UN RUBAN 10 COMPOSE D'UN FILM ISOLANT CINEMATOGRAPHIQUE 19 ET DE DISPOSITIFS A CIRCUITS INTEGRES 11 POURVUS DE CONDUCTEURS DE SORTIE 16 DONT LES EXTREMITES SONT FIXEES A DES PLAGES DE CONNEXION 21 DE ZONES CONDUCTRICES 20 REGULIEREMENT REPARTIES LE LONG DU FILM 19. DU RUBAN 10 PEUVENT AINSI ETRE PRELEVEES DES PASTILLES 22 POUVANT ETRE INCORPOREES DANS DES ENSEMBLES COMPLEXES OU CONSTITUER DIRECTEMENT DES BOITIERS POUR DISPOSITIFS A CIRCUITS INTEGRES. L'INVENTION DECRIT AUSSI UN PROCEDE DE FABRICATION DU RUBAN 10 A PARTIR D'UN RUBAN 12 DE LA TECHNIQUE ANTERIEURE. L'INVENTION S'APPLIQUE NOTAMMENT AUX CARTES DE CREDIT.
FR7829846A 1978-10-19 1978-10-19 Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux Granted FR2439438A1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR7829846A FR2439438A1 (fr) 1978-10-19 1978-10-19 Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux
NL7905298A NL7905298A (nl) 1978-10-19 1979-07-06 Draagband voor inrichtingen voor het verwerken van elektrische signalen, werkwijze voor het vervaardigen daarvan en toepassing van de band bij een element voor het verwerken van signalen.
SE7906961A SE7906961L (sv) 1978-10-19 1979-08-21 Isolerande berorgan
GB7929905A GB2047474A (en) 1978-10-19 1979-08-29 A strip carrying devices for processing electrical signals, and a method of producing the strip
JP13007579A JPS5556639A (en) 1978-10-19 1979-10-11 Strip for carrying device for processing electric signal and method of manufacturing same
DE19792942397 DE2942397A1 (de) 1978-10-19 1979-10-19 Traegerband fuer elektronische schaltkreiselemente, verfahren zu seiner herstellung und anwendung bei einer signalverarbeitungseinrichtung
IT7926626A IT7926626A0 (it) 1978-10-19 1979-10-19 Nastro di supporto di dispositivi di trattamento di segnali elettrici, procedimento di fabbricazione dello stesso, e applicazione di tale nastro ad un elemento di trattamento di segnali.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7829846A FR2439438A1 (fr) 1978-10-19 1978-10-19 Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux

Publications (2)

Publication Number Publication Date
FR2439438A1 true FR2439438A1 (fr) 1980-05-16
FR2439438B1 FR2439438B1 (fr) 1981-04-17

Family

ID=9213944

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7829846A Granted FR2439438A1 (fr) 1978-10-19 1978-10-19 Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux

Country Status (7)

Country Link
JP (1) JPS5556639A (fr)
DE (1) DE2942397A1 (fr)
FR (1) FR2439438A1 (fr)
GB (1) GB2047474A (fr)
IT (1) IT7926626A0 (fr)
NL (1) NL7905298A (fr)
SE (1) SE7906961L (fr)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2496341A1 (fr) * 1980-12-12 1982-06-18 Thomson Csf Composant d'interconnexion topologique
EP0058068A2 (fr) * 1981-02-09 1982-08-18 BRITISH TELECOMMUNICATIONS public limited company Support pour puce de circuit intégré
FR2511544A1 (fr) * 1981-08-14 1983-02-18 Dassault Electronique Module electronique pour carte de transactions automatiques et carte equipee d'un tel module
FR2512990A1 (fr) * 1981-09-11 1983-03-18 Radiotechnique Compelec Procede pour fabriquer une carte de paiement electronique, et carte realisee selon ce procede
FR2520541A1 (fr) * 1982-01-22 1983-07-29 Flonic Sa Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede
FR2583574A1 (fr) * 1985-06-14 1986-12-19 Eurotechnique Sa Micromodule a contacts enterres et carte contenant des circuits comportant un tel micromodule.
FR2584236A1 (fr) * 1985-06-26 1987-01-02 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
EP0231937A2 (fr) * 1986-02-06 1987-08-12 Hitachi Maxell Ltd. Agencement d'un dispositif semi-conducteur pour l'utilisation dans une carte
US4701236A (en) * 1985-04-12 1987-10-20 U.S. Philips Corporation Method of manufacturing an electronic identification card
FR2601477A1 (fr) * 1986-07-11 1988-01-15 Bull Cp8 Procede de montage d'un circuit integre dans une carte a microcircuits electroniques, et carte en resultant
EP0254640A1 (fr) * 1986-07-24 1988-01-27 Schlumberger Industries, Sa Procédé de réalisation d'une carte à mémoire électronique et carte telle qu'obtenue par ce procédé
US4774633A (en) * 1985-06-26 1988-09-27 Bull S.A. Method for assembling an integrated circuit with raised contacts on a substrate, device thereby produced and an electronic microcircuit card incorporating said device
US4810865A (en) * 1985-11-08 1989-03-07 Eurotechnique Method for recycling a card having an incorporated component, and a card designed to permit recycling
FR2620586A1 (fr) * 1987-09-14 1989-03-17 Em Microelectronic Marin Sa Procede de fabrication de modules electroniques, notamment pour cartes a microcircuits
US4822988A (en) * 1985-11-08 1989-04-18 Eurotechnique Card containing a component and a micromodule having side contacts
WO1990008365A1 (fr) * 1989-01-19 1990-07-26 W. & T. Avery Limited Jeton electronique portatif
FR2673017A1 (fr) * 1991-02-18 1992-08-21 Schlumberger Ind Sa Procede de fabrication d'un module electronique pour carte a memoire et module electronique ainsi obtenu.
EP0674346A2 (fr) * 1994-03-22 1995-09-27 Kabushiki Kaisha Toshiba Extrémité de connexion pour dispositif à semi-conducteur
EP0688051A1 (fr) 1994-06-15 1995-12-20 Philips Cartes Et Systemes Procédé de fabrication et d'assemblage de carte à circuit intégré et carte ainsi obtenue
US6166431A (en) * 1995-08-25 2000-12-26 Kabushiki Kaisha Tishiba Semiconductor device with a thickness of 1 MM or less
EP1930843A1 (fr) * 2006-12-07 2008-06-11 Axalto SA Film-support adapté a la prévention de décharge électrostatique de module électronique et procédé de fabrication de module mettant en oeuvre le film-support

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2920012B1 (de) * 1979-05-17 1980-11-20 Gao Ges Automation Org Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
JPS57145354A (en) * 1980-11-21 1982-09-08 Gao Ges Automation Org Carrier element for ic module
DE3123198C2 (de) * 1980-12-08 1993-10-07 Gao Ges Automation Org Trägerelemente für einen IC-Baustein
DE3153769C2 (de) * 1981-04-14 1995-10-26 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
FR2505091A1 (fr) * 1981-04-30 1982-11-05 Cii Honeywell Bull Dispositif de protection des circuits electroniques tels que des circuits integres a l'encontre des charges electrostatiques
US4483067A (en) * 1981-09-11 1984-11-20 U.S. Philips Corporation Method of manufacturing an identification card and an identification manufactured, for example, by this method
JPS5892597A (ja) * 1981-11-28 1983-06-01 大日本印刷株式会社 Ｉｃカ−ドの製造方法
JPS58118297A (ja) * 1981-12-31 1983-07-14 共同印刷株式会社 識別カ−ドの製造方法
JPS58134456A (ja) * 1982-02-04 1983-08-10 Dainippon Printing Co Ltd Ｉｃカ−ド
JPS58155058U (ja) * 1982-04-09 1983-10-17 共同印刷株式会社 メモリ−カ−ド
JPS58221478A (ja) * 1982-06-16 1983-12-23 Kyodo Printing Co Ltd Ｉｃカ−ド
JPS5948984A (ja) * 1982-09-13 1984-03-21 大日本印刷株式会社 Ｉｃカ−ドの製造方法
GB2129223A (en) * 1982-10-09 1984-05-10 Welwyn Electronics Ltd Printed circuit boards
JPS59193596A (ja) * 1983-04-18 1984-11-02 Kyodo Printing Co Ltd Ｉｃカ−ド用ｉｃモジユ−ル
JPS6082359U (ja) * 1983-06-27 1985-06-07 凸版印刷株式会社 集積回路内蔵カード
US5008656A (en) * 1984-12-20 1991-04-16 Raytheon Company Flexible cable assembly
CA1237817A (fr) * 1984-12-20 1988-06-07 Raytheon Co Ensemble a cable souple
JPS61203695A (ja) * 1985-03-06 1986-09-09 シャープ株式会社 片面配線基板の部品実装方式
JPH07115553B2 (ja) * 1985-07-10 1995-12-13 カシオ計算機株式会社 Ｉｃカードの製造方法
JPH0829628B2 (ja) * 1985-10-09 1996-03-27 松下電器産業株式会社 Ｉｃカ−ド
JPS62152193A (ja) * 1985-12-25 1987-07-07 イビデン株式会社 Ｉｃカ−ド用プリント配線板
JPS6334196A (ja) * 1986-07-29 1988-02-13 イビデン株式会社 Ｉｃカ−ド用プリント配線板
JPS6351195A (ja) * 1986-08-20 1988-03-04 イビデン株式会社 Ｉｃカ−ド用プリント配線板
JP2562476B2 (ja) * 1987-06-11 1996-12-11 大日本印刷株式会社 １ｃカードの製造方法
JPH0753988Y2 (ja) * 1987-09-14 1995-12-13 凸版印刷株式会社 Ｉｃカード
DE3905657A1 (de) * 1989-02-24 1990-08-30 Telefunken Electronic Gmbh Flexible traegerfolie
FR2645680B1 (fr) * 1989-04-07 1994-04-29 Thomson Microelectronics Sa Sg Encapsulation de modules electroniques et procede de fabrication
US5250470A (en) * 1989-12-22 1993-10-05 Oki Electric Industry Co., Ltd. Method for manufacturing a semiconductor device with corrosion resistant leads
JP2875562B2 (ja) * 1989-12-22 1999-03-31 沖電気工業株式会社 半導体装置及びその製造方法
JPH07164787A (ja) * 1992-03-26 1995-06-27 Dainippon Printing Co Ltd Ｉｃカードの製造方法
FR2736740A1 (fr) * 1995-07-11 1997-01-17 Trt Telecom Radio Electr Procede de production et d'assemblage de carte a circuit integre et carte ainsi obtenue
EP1102316A1 (fr) * 1999-11-16 2001-05-23 Infineon Technologies AG Carte à circuits intégrés comportant une structure de bus
DE102007019795B4 (de) * 2007-04-26 2012-10-04 Infineon Technologies Ag Chipmodul und Verfahren zum Herstellen dieses Chipmoduls
WO2018172525A1 (fr) * 2017-03-24 2018-09-27 Cardlab Aps Assemblage d'un support et d'une pluralité de circuits électriques fixés à celui-ci, et son procédé de fabrication

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2177106A1 (fr) * 1972-03-23 1973-11-02 Bosch Gmbh Robert
US3868724A (en) * 1973-11-21 1975-02-25 Fairchild Camera Instr Co Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier
DE2810054A1 (de) * 1977-03-08 1978-09-14 Matsushita Electric Ind Co Ltd Elektronische schaltungsvorrichtung und verfahren zu deren herstellung

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2177106A1 (fr) * 1972-03-23 1973-11-02 Bosch Gmbh Robert
US3868724A (en) * 1973-11-21 1975-02-25 Fairchild Camera Instr Co Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier
DE2810054A1 (de) * 1977-03-08 1978-09-14 Matsushita Electric Ind Co Ltd Elektronische schaltungsvorrichtung und verfahren zu deren herstellung

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2496341A1 (fr) * 1980-12-12 1982-06-18 Thomson Csf Composant d'interconnexion topologique
EP0058068A2 (fr) * 1981-02-09 1982-08-18 BRITISH TELECOMMUNICATIONS public limited company Support pour puce de circuit intégré
EP0058068A3 (en) * 1981-02-09 1982-09-08 British Telecommunications Integrated circuit chip carrier
FR2511544A1 (fr) * 1981-08-14 1983-02-18 Dassault Electronique Module electronique pour carte de transactions automatiques et carte equipee d'un tel module
EP0072759A2 (fr) * 1981-08-14 1983-02-23 Electronique Serge Dassault Module électronique pour carte de transactions automatiques et carte équipée d'un tel module
EP0072759A3 (en) * 1981-08-14 1983-03-16 Electronique Serge Dassault Electronic module for an automatic-transaction card, and card comprising such a module
FR2512990A1 (fr) * 1981-09-11 1983-03-18 Radiotechnique Compelec Procede pour fabriquer une carte de paiement electronique, et carte realisee selon ce procede
EP0075351A1 (fr) * 1981-09-11 1983-03-30 Rtc-Compelec Procédé pour fabriquer une carte d'identification et carte d'identification produite, par exemple au moyen de ce procédé
FR2520541A1 (fr) * 1982-01-22 1983-07-29 Flonic Sa Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede
US4701236A (en) * 1985-04-12 1987-10-20 U.S. Philips Corporation Method of manufacturing an electronic identification card
EP0201952B1 (fr) * 1985-04-12 1990-09-19 Philips Composants Procédé et dispositif pour fabriquer une carte d'identification électronique
FR2583574A1 (fr) * 1985-06-14 1986-12-19 Eurotechnique Sa Micromodule a contacts enterres et carte contenant des circuits comportant un tel micromodule.
EP0213974A1 (fr) * 1985-06-14 1987-03-11 Sgs-Thomson Microelectronics S.A. Micromodule à contacts enterrés et carte contenant des circuits comportant un tel micromodule
EP0207852A1 (fr) * 1985-06-26 1987-01-07 Bull S.A. Procédé de montage d'un circuit intégré sur un support, dispositif en résultant et son application à une carte à microcircuits électroniques
US4774633A (en) * 1985-06-26 1988-09-27 Bull S.A. Method for assembling an integrated circuit with raised contacts on a substrate, device thereby produced and an electronic microcircuit card incorporating said device
FR2584236A1 (fr) * 1985-06-26 1987-01-02 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
US4822988A (en) * 1985-11-08 1989-04-18 Eurotechnique Card containing a component and a micromodule having side contacts
US4810865A (en) * 1985-11-08 1989-03-07 Eurotechnique Method for recycling a card having an incorporated component, and a card designed to permit recycling
EP0231937A2 (fr) * 1986-02-06 1987-08-12 Hitachi Maxell Ltd. Agencement d'un dispositif semi-conducteur pour l'utilisation dans une carte
EP0231937A3 (en) * 1986-02-06 1989-03-22 Hitachi Maxell Ltd. An arrangement of a semiconductor device for use in a card
FR2601477A1 (fr) * 1986-07-11 1988-01-15 Bull Cp8 Procede de montage d'un circuit integre dans une carte a microcircuits electroniques, et carte en resultant
EP0254640A1 (fr) * 1986-07-24 1988-01-27 Schlumberger Industries, Sa Procédé de réalisation d'une carte à mémoire électronique et carte telle qu'obtenue par ce procédé
JPS6399996A (ja) * 1986-07-24 1988-05-02 シュラムバーガー　アンデュストリエ 電子メモリを有するカ−ドの製造方法及びこの方法により形成されたカ−ド
US4835846A (en) * 1987-09-14 1989-06-06 Em Microelectronic Marin Sa Method of manufacture of electronic modules for cards with microcircuits
EP0307773A1 (fr) * 1987-09-14 1989-03-22 EM Microelectronic-Marin SA Procédé de fabrication de modules électroniques, notamment pour cartes à microcircuits
FR2620586A1 (fr) * 1987-09-14 1989-03-17 Em Microelectronic Marin Sa Procede de fabrication de modules electroniques, notamment pour cartes a microcircuits
WO1990008365A1 (fr) * 1989-01-19 1990-07-26 W. & T. Avery Limited Jeton electronique portatif
EP0383435A1 (fr) * 1989-01-19 1990-08-22 Gec Avery Limited Etiquette électronique portable
FR2673017A1 (fr) * 1991-02-18 1992-08-21 Schlumberger Ind Sa Procede de fabrication d'un module electronique pour carte a memoire et module electronique ainsi obtenu.
EP0500168A1 (fr) * 1991-02-18 1992-08-26 Schlumberger Industries Procédé de fabrication d'un module électronique pour carte à mémoire et module électronique ainsi obtenu
EP0674346A2 (fr) * 1994-03-22 1995-09-27 Kabushiki Kaisha Toshiba Extrémité de connexion pour dispositif à semi-conducteur
EP0674346A3 (fr) * 1994-03-22 1997-02-05 Toshiba Kk Extrémité de connexion pour dispositif à semi-conducteur.
EP0688051A1 (fr) 1994-06-15 1995-12-20 Philips Cartes Et Systemes Procédé de fabrication et d'assemblage de carte à circuit intégré et carte ainsi obtenue
US6166431A (en) * 1995-08-25 2000-12-26 Kabushiki Kaisha Tishiba Semiconductor device with a thickness of 1 MM or less
US6333212B1 (en) 1995-08-25 2001-12-25 Kabushiki Kaisha Toshiba Semiconductor device and manufacturing method thereof
EP1930843A1 (fr) * 2006-12-07 2008-06-11 Axalto SA Film-support adapté a la prévention de décharge électrostatique de module électronique et procédé de fabrication de module mettant en oeuvre le film-support
WO2008068163A2 (fr) * 2006-12-07 2008-06-12 Axalto S.A. Film-support adapte a la prevention de decharge electrostatique de module electronique et procede de fabrication de module mettant en oeuvre le film-support
WO2008068163A3 (fr) * 2006-12-07 2008-09-12 Axalto Sa Film-support adapte a la prevention de decharge electrostatique de module electronique et procede de fabrication de module mettant en oeuvre le film-support

Also Published As

Publication number Publication date
SE7906961L (sv) 1980-04-20
NL7905298A (nl) 1980-04-22
JPS5556639A (en) 1980-04-25
FR2439438B1 (fr) 1981-04-17
DE2942397A1 (de) 1980-04-30
GB2047474A (en) 1980-11-26
IT7926626A0 (it) 1979-10-19

Similar Documents

Publication Publication Date Title
FR2439438A1 (fr) Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux
FR2337381A1 (fr) Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte
BR7703148A (pt) Conetor eletrico e processo de fabricacao do mesmo
JPH02500231A (ja) 電子モジユール回路用テープの生産方法とこの方法によつて得られるテープ
DE69325784D1 (de) Optische Verarbeitungsvorrichtung für elektrische Signale
FR2340619A1 (fr) Perfectionnement au procede de fabrication de dispositifs semiconducteurs et dispositifs ainsi obtenus
BR8403468A (pt) Dispositivo com semicondutor de dois terminais e processo para sua fabricacao
IT7922105A0 (it) Processo per fabbricare contatti conduttivi in dispositivi semiconduttori.
FR2497411B1 (fr) Connecteur electrique pour cable multiconducteur plat et son procede de fabrication
JPS5334484A (en) Forming method for multi layer wiring
JPS5578577A (en) Method of fabricating field effect transistor utilizing one conductivity semiconductor substrate
FR2353936A1 (fr) Procede et installation pour fabriquer des cables ou conducteurs pour courants forts comportant plusieurs brins a cablage alterne
FR2552596B1 (fr) Circuit multiplicateur de tension et son procede de fabrication
US3805129A (en) Field effect transistor having two gates for functioning at extremely high frequencies
PT75974B (fr) Procede de fabrication de dispositifs semi-conducteurs et dispositifs semi-conducteurs ainsi obtenus
BE852341A (fr) Composant a semiconducteurs comportant des contacts electriques et procede pour la fabrication de tels contacts
JPS5691406A (en) Thin film coil
BE856504A (fr) Procede de fabrication d'un interrupteur electrique et l'interrupteur ainsi obtenu
JPS57154863A (en) Manufacture of resin sealing type electronic parts
BE819838A (fr) Perfectionnements aux cosses pour conducteurs electriques et procede de fabrication d'une telle cosse
JPS5756950A (en) Manufacture of insulated gate tupe semiconductor integrated ciucuit device
JPS6164020A (ja) 透明導電シ−トの製造方法
FR2273879A2 (fr) Procede de fabrication d'un materiau composite conducteur de l'electricite, et materiau composite ainsi obtenu
JPS5364757A (en) Method of taping electronic parts having lead wire terminals arranged in same direction
BE748546A (fr) Procede et appareil pour la fabrication de contacts electriquesmetallises selectivement

Legal Events

Date Code Title Description
ST Notification of lapse