ES2030800T3 - Elemento de soporte incorporable a tarjetas de identidad. - Google Patents
Elemento de soporte incorporable a tarjetas de identidad.Info
- Publication number
- ES2030800T3 ES2030800T3 ES198888111437T ES88111437T ES2030800T3 ES 2030800 T3 ES2030800 T3 ES 2030800T3 ES 198888111437 T ES198888111437 T ES 198888111437T ES 88111437 T ES88111437 T ES 88111437T ES 2030800 T3 ES2030800 T3 ES 2030800T3
- Authority
- ES
- Spain
- Prior art keywords
- substrate
- recess
- adhesive layer
- conductor tracks
- casting compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Road Signs Or Road Markings (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
Abstract
SE DESCRIBE UN ELEMENTO PORTADOR CON UNO O VARIOS IC PARA INSTALACION EN UNA TARJETA DE IDENTIDAD O CARTA DE CREDITO. EL ELEMENTO PORTADOR SE COMPONE DE UN SUBSTRATO, EN CUYA SUPERFICIE SE COLOCAN VARIAS SUPERFICIES DE CONTACTO QUE SE CONECTAN POR VIAS CONDUCTORAS ESTA PROTEGIDO DE CIERRE CORRESPONDIENTES AL IC COLOCADO EN EL SUBSTRATO. EL IC CON INCLUSION DE LAS CONEXIONES PARA LAS VIAS CONDUCTORAS ESTA PROTEGIDO POR UNA MASA DE FUNDICION ENDURECIDA DE CARGAS MECANICAS. PARA EVITAR UN DERRAMAMIENTO INDESEADO AL APLICAR LA MASA DE FUNDICION, SE PREVE UNA ESCOTADURA EN LA CAPA ADHESIVA CALIENTE LLEVADA EN UNA PARTE DEL SUBSTRATO, QUE SE MANTIENE AL APLICAR LA RESINA LIQUIDA Y ACTUA COMO BASTIDOR LIMITADOR. LA ESCOTADURA EN LA CAPA ADHESIVA SE ENCUENTRA AL MENOS DONDE SE COLOCA EL IC.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3723547A DE3723547C2 (de) | 1987-07-16 | 1987-07-16 | Trägerelement zum Einbau in Ausweiskarten |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2030800T3 true ES2030800T3 (es) | 1992-11-16 |
Family
ID=6331714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES198888111437T Expired - Lifetime ES2030800T3 (es) | 1987-07-16 | 1988-07-15 | Elemento de soporte incorporable a tarjetas de identidad. |
Country Status (7)
Country | Link |
---|---|
US (1) | US5027190A (es) |
EP (1) | EP0299530B1 (es) |
JP (1) | JP2676619B2 (es) |
AT (1) | ATE73945T1 (es) |
DE (2) | DE3723547C2 (es) |
ES (1) | ES2030800T3 (es) |
HK (1) | HK54295A (es) |
Families Citing this family (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4040770C2 (de) * | 1990-12-19 | 1999-11-11 | Gao Ges Automation Org | Datenträger mit integriertem Schaltkreis |
FR2670930A1 (fr) * | 1990-12-21 | 1992-06-26 | Bull Cp8 | Procede de realisation du module electronique d'un objet portatif tel qu'une carte a microcircuits, module et cartes obtenus par la mise en óoeuvre du procede. |
DE9100665U1 (de) * | 1991-01-21 | 1992-07-16 | TELBUS Gesellschaft für elektronische Kommunikations-Systeme mbH, 85391 Allershausen | Trägerelement für integrierte Halbleiter-Schaltkreise, insbesondere zum Einbau in Chip-Karten |
DE4105869C2 (de) * | 1991-02-25 | 2000-05-18 | Edgar Schneider | IC-Karte und Verfahren zu ihrer Herstellung |
DE4122049A1 (de) * | 1991-07-03 | 1993-01-07 | Gao Ges Automation Org | Verfahren zum einbau eines traegerelements |
DE4126874C2 (de) * | 1991-08-14 | 1997-05-22 | Orga Kartensysteme Gmbh | Datenträger mit integriertem Schaltkreis |
DE4209184C1 (es) * | 1992-03-21 | 1993-05-19 | Orga Kartensysteme Gmbh, 6072 Dreieich, De | |
US5796164A (en) * | 1993-05-11 | 1998-08-18 | Micromodule Systems, Inc. | Packaging and interconnect system for integrated circuits |
JPH0737049A (ja) * | 1993-07-23 | 1995-02-07 | Toshiba Corp | 外部記憶装置 |
DE4326816A1 (de) * | 1993-08-10 | 1995-02-16 | Giesecke & Devrient Gmbh | Elektronisches Modul für Karten und Herstellung eines solchen Moduls |
DE4340847A1 (de) * | 1993-11-26 | 1995-06-01 | Optosys Gmbh Berlin | Chipmodul und Verfahren zur Herstellung eines Chipmoduls |
FR2721732B1 (fr) * | 1994-06-22 | 1996-08-30 | Solaic Sa | Carte à mémoire sans contact dont le circuit électronique comporte un module. |
DE4423575A1 (de) | 1994-07-05 | 1996-01-11 | Giesecke & Devrient Gmbh | Datenträger mit einem Modul mit integriertem Schaltkreis |
DE4427802C1 (de) * | 1994-08-05 | 1995-10-26 | Beiersdorf Ag | Thermoaktivierbare Klebfolie zur Herstellung eines Datenträgers |
DE4443767A1 (de) * | 1994-12-08 | 1996-06-13 | Giesecke & Devrient Gmbh | Elektronisches Modul und Datenträger mit elektrischem Modul |
DE19502157B4 (de) * | 1995-01-25 | 2011-07-21 | Sagem Orga GmbH, 33106 | Trägerelement für einen IC-Baustein zum Einbau in Chipkarten |
DE19512725C1 (de) * | 1995-04-05 | 1996-09-12 | Orga Kartensysteme Gmbh | Ausweiskarte o.dgl. in Form einer Chipkarte |
US5975420A (en) * | 1995-04-13 | 1999-11-02 | Dai Nippon Printing Co., Ltd. | Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module |
US5677521A (en) * | 1995-06-29 | 1997-10-14 | Garrou; Elizabeth B. | Personal identification and credit information system and method of performing transaction |
DE29510947U1 (de) * | 1995-07-06 | 1995-09-14 | Stocko Metallwarenfabriken Henkels Und Sohn Gmbh & Co, 42327 Wuppertal | Kontaktfeldbaugruppe zur Anordnung auf einer Kontaktiereinheit |
DE19539181C2 (de) * | 1995-10-20 | 1998-05-14 | Ods Gmbh & Co Kg | Chipkartenmodul sowie entsprechendes Herstellungsverfahren |
AU3944597A (en) * | 1996-08-02 | 1998-02-25 | Solaic | Integrated circuit card with two connection modes |
DE19632813C2 (de) * | 1996-08-14 | 2000-11-02 | Siemens Ag | Verfahren zur Herstellung eines Chipkarten-Moduls, unter Verwendung dieses Verfahrens hergestellter Chipkarten-Modul und diesen Chipkarten-Modul enthaltende Kombi-Chipkarte |
US5847445A (en) * | 1996-11-04 | 1998-12-08 | Micron Technology, Inc. | Die assemblies using suspended bond wires, carrier substrates and dice having wire suspension structures, and methods of fabricating same |
DE19703990A1 (de) * | 1997-02-03 | 1998-08-06 | Giesecke & Devrient Gmbh | Modular aufgebauter, elektronischer Datenträger |
KR100431501B1 (ko) * | 1997-06-05 | 2004-10-02 | 삼성전자주식회사 | 고전력 패키지 구조 및 제조 방법 |
JP3883652B2 (ja) | 1997-06-23 | 2007-02-21 | 大日本印刷株式会社 | 板状枠体付きicキャリアとその製造方法 |
CN1110770C (zh) * | 1997-06-23 | 2003-06-04 | 罗姆股份有限公司 | 智能卡用模块、智能卡及智能卡用模块的制造方法 |
FR2769110B1 (fr) * | 1997-09-26 | 1999-12-03 | Gemplus Card Int | Procede de fabrication d'un module ou etiquette electronique, module ou etiquette obtenue et support comportant un tel module ou etiquette |
ES2359149T3 (es) * | 1997-09-26 | 2011-05-18 | Gemalto Sa | Procedimiento de fabricación de un módulo o etiqueta electrónica, módulo o etiqueta obtenido y medios que contienen dicho módulo o etiqueta. |
FR2769130B1 (fr) * | 1997-09-30 | 2001-06-08 | Thomson Csf | Procede d'enrobage d'une puce electronique et carte electronique comportant au moins une puce enrobee selon ce procede |
FR2769390B1 (fr) * | 1997-10-08 | 2003-02-14 | Gemplus Card Int | Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact |
US6241153B1 (en) | 1998-03-17 | 2001-06-05 | Cardxx, Inc. | Method for making tamper-preventing, contact-type, smart cards |
FR2785072B1 (fr) * | 1998-10-23 | 2001-01-19 | St Microelectronics Sa | Circuit electronique autocollant |
US6179210B1 (en) * | 1999-02-09 | 2001-01-30 | Motorola, Inc. | Punch out pattern for hot melt tape used in smartcards |
FR2793331B1 (fr) * | 1999-05-06 | 2001-08-10 | Oberthur Card Systems Sas | Procede de fabrication d'une carte a microcircuit |
DE10024376A1 (de) * | 2000-05-17 | 2001-12-06 | Infineon Technologies Ag | Halbleiterbauelement und Verfahren zu dessen Herstellung |
DE20100158U1 (de) | 2001-01-05 | 2002-05-08 | Bundesdruckerei GmbH, 10969 Berlin | Identifikations- und Sicherheitskarte aus laminierten und/oder gespritzten Kunststoffen |
EP1615166A1 (en) * | 2004-07-07 | 2006-01-11 | Axalto S.A. | Carrier tape for chip modules and method of manufacturing a chip card |
BRPI0520452A2 (pt) * | 2005-03-23 | 2009-05-12 | Cardxx Inc | método para fabricar um cartão inteligente avançado ou dispositivo similar |
JP2007133802A (ja) * | 2005-11-14 | 2007-05-31 | Dainippon Printing Co Ltd | Icカードおよびicカード用icモジュール |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
USD703208S1 (en) | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
US9888283B2 (en) | 2013-03-13 | 2018-02-06 | Nagrastar Llc | Systems and methods for performing transport I/O |
USD758372S1 (en) * | 2013-03-13 | 2016-06-07 | Nagrastar Llc | Smart card interface |
US9647997B2 (en) | 2013-03-13 | 2017-05-09 | Nagrastar, Llc | USB interface for performing transport I/O |
USD729808S1 (en) * | 2013-03-13 | 2015-05-19 | Nagrastar Llc | Smart card interface |
USD759022S1 (en) * | 2013-03-13 | 2016-06-14 | Nagrastar Llc | Smart card interface |
USD780763S1 (en) | 2015-03-20 | 2017-03-07 | Nagrastar Llc | Smart card interface |
USD864968S1 (en) | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
JP1647728S (es) | 2018-02-01 | 2019-12-09 | ||
USD930000S1 (en) | 2018-10-12 | 2021-09-07 | Huawei Technologies Co., Ltd. | Memory card |
USD983261S1 (en) | 2019-12-20 | 2023-04-11 | Capital One Services, Llc | Vented laminated card |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2337381A1 (fr) * | 1975-12-31 | 1977-07-29 | Honeywell Bull Soc Ind | Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte |
US4216577A (en) * | 1975-12-31 | 1980-08-12 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) | Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card |
US4222516A (en) * | 1975-12-31 | 1980-09-16 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull | Standardized information card |
JPS57207357A (en) * | 1981-06-17 | 1982-12-20 | Asahi Glass Co Ltd | Component part holder |
FR2520541A1 (fr) * | 1982-01-22 | 1983-07-29 | Flonic Sa | Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede |
DE3235650A1 (de) * | 1982-09-27 | 1984-03-29 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Informationskarte und verfahren zu ihrer herstellung |
FR2548857B1 (fr) * | 1983-07-04 | 1987-11-27 | Cortaillod Cables Sa | Procede de fabrication en continu d'une carte imprimee |
FR2580416B1 (fr) * | 1985-04-12 | 1987-06-05 | Radiotechnique Compelec | Procede et dispositif pour fabriquer une carte d'identification electronique |
DE3639630A1 (de) * | 1986-11-20 | 1988-06-01 | Gao Ges Automation Org | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
-
1987
- 1987-07-16 DE DE3723547A patent/DE3723547C2/de not_active Expired - Fee Related
-
1988
- 1988-07-15 JP JP63176870A patent/JP2676619B2/ja not_active Expired - Fee Related
- 1988-07-15 AT AT88111437T patent/ATE73945T1/de not_active IP Right Cessation
- 1988-07-15 EP EP88111437A patent/EP0299530B1/de not_active Expired - Lifetime
- 1988-07-15 DE DE8888111437T patent/DE3869248D1/de not_active Expired - Fee Related
- 1988-07-15 ES ES198888111437T patent/ES2030800T3/es not_active Expired - Lifetime
-
1990
- 1990-09-12 US US07/581,394 patent/US5027190A/en not_active Expired - Lifetime
-
1995
- 1995-04-11 HK HK54295A patent/HK54295A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2676619B2 (ja) | 1997-11-17 |
US5027190A (en) | 1991-06-25 |
JPS6436496A (en) | 1989-02-07 |
EP0299530B1 (de) | 1992-03-18 |
HK54295A (en) | 1995-04-21 |
ATE73945T1 (de) | 1992-04-15 |
EP0299530A1 (de) | 1989-01-18 |
DE3723547C2 (de) | 1996-09-26 |
DE3869248D1 (de) | 1992-04-23 |
DE3723547A1 (de) | 1989-01-26 |
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Legal Events
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FG2A | Definitive protection |
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