KR900702568A - 하이브리드 마이크로칩 접착제품 - Google Patents

하이브리드 마이크로칩 접착제품

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Publication number
KR900702568A
KR900702568A KR1019900701136A KR900701136A KR900702568A KR 900702568 A KR900702568 A KR 900702568A KR 1019900701136 A KR1019900701136 A KR 1019900701136A KR 900701136 A KR900701136 A KR 900701136A KR 900702568 A KR900702568 A KR 900702568A
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South Korea
Prior art keywords
article
carrier sheet
tubular
microcircuit
sheet
Prior art date
Application number
KR1019900701136A
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English (en)
Inventor
죠셉 루든 마이클
나이홀름 피터
Original Assignee
원본미기재
레이켐 리미티드
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Priority claimed from GB888823057A external-priority patent/GB8823057D0/en
Priority claimed from GB888828245A external-priority patent/GB8828245D0/en
Application filed by 원본미기재, 레이켐 리미티드 filed Critical 원본미기재
Publication of KR900702568A publication Critical patent/KR900702568A/ko

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    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
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    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
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    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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    • B23K2101/00—Articles made by soldering, welding or cutting
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Abstract

내용 없음

Description

하이브리드 마이크로칩 접착제품
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (9)

  1. 마이크로회로에 접착될 수 있도록 배열된 단부를 갖는 적어도 하나의 전기전도성 트랙어레이를 보유지지하는 캐리어 시이트를 포함하며, 상기 각각의 접착 가능한 트랙단부는 상기 트랙을 보유지지하지 않는 상기 캐리어재의 표면구역에, 200 마이크로 미터 미만의 직경을 갖는 적어도 하나의 접속구멍내에 제공된 전기전도성 물질의 관형 구조물에 의해서 접속되는 테이프-자동 접착 제품.
  2. 제1항에 있어서, 상기 접속구멍 또는 구멍들내의 상기 관형전도성 물질은 상기 마이크로 회로에 대한 접착이 용이하도록 상기 표면구역 이상으로 돌출하는 제품.
  3. 제1 또는 2항에 있어서, 박층 구조내에서 둘이상의 레벨에 전도성 트랙을 갖는 제품.
  4. 선행항들 중의 어느 한 항에 있어서, 상기 마이크로회로에 접착될 상기 관형구조물들중의 적어도 몇개의 단부에 또는 단부내에, 상기 관형구조물의 용융온도보다 낮은 용융온도에서 녹아 접착을 이룰 수 있는 가용성의 전기전도성 접착재를 갖는 제품.
  5. 제4항에 있어서, 상기 가용재는 땝납 또는 이와 유사한 저융점 금속 합금인 제품.
  6. 선행항들 중의 어느 한 항에 있어서, 상기 캐리어 시이트는 ASTM D882에 따라 4일 동안 온도가 100℃이고 pH가 10인 수중에 침지시킨 후에도 본래의 신장율의 적어도 50%를 보유할 수 있는 실질적으로 완전하게 환화된 폴리이미드를 포함하는 제품.
  7. 선행항들 중의 어느 한 항에 있어서, 상기 캐리어 시이트에 레이저로 구멍을 뚫은 후에 상기 구멍의 내면에 적어도 하나의 금속으로 된 적어도 하나의 층을 도금하여 형성한 제품.
  8. 선행항들 중의 어느 한 항에 있어서, 적어도 하나의 가용재층이 상기 캐리어 시이트의 적어도 일 표면으로부터 제거되어 상기 관형구조물이 상기 표면으로 부터 돌출되게한 제품.
  9. 선행항들 중의 어느 한 항에 있어서, 상기 전기전도성 트랙어레이는 상기 캐리어 시이트 내에 상기 관형 구조물의 제공후에 상기 시이트에 적용되는 제품.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900701136A 1988-09-30 1989-09-29 하이브리드 마이크로칩 접착제품 KR900702568A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB888823057A GB8823057D0 (en) 1988-09-30 1988-09-30 Hybrid microchip bonding article
GB8823057.8 1988-09-30
GB888828245A GB8828245D0 (en) 1988-12-02 1988-12-02 Anisotropically electrically conductive articles
PCT/GB1989/001158 WO1990003662A1 (en) 1988-09-30 1989-09-29 Hybrid microchip bonding article

Publications (1)

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KR900702568A true KR900702568A (ko) 1990-12-07

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US (1) US5254811A (ko)
EP (2) EP0361985B1 (ko)
JP (1) JP2873032B2 (ko)
KR (1) KR900702568A (ko)
AT (1) ATE115335T1 (ko)
DE (1) DE68919792T2 (ko)
WO (1) WO1990003662A1 (ko)

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US5130783A (en) * 1991-03-04 1992-07-14 Texas Instruments Incorporated Flexible film semiconductor package
US5455390A (en) * 1994-02-01 1995-10-03 Tessera, Inc. Microelectronics unit mounting with multiple lead bonding
US6828668B2 (en) * 1994-07-07 2004-12-07 Tessera, Inc. Flexible lead structures and methods of making same
US5518964A (en) * 1994-07-07 1996-05-21 Tessera, Inc. Microelectronic mounting with multiple lead deformation and bonding
US6429112B1 (en) 1994-07-07 2002-08-06 Tessera, Inc. Multi-layer substrates and fabrication processes
US6117694A (en) * 1994-07-07 2000-09-12 Tessera, Inc. Flexible lead structures and methods of making same
US5688716A (en) 1994-07-07 1997-11-18 Tessera, Inc. Fan-out semiconductor chip assembly
US5830782A (en) * 1994-07-07 1998-11-03 Tessera, Inc. Microelectronic element bonding with deformation of leads in rows
US5798286A (en) * 1995-09-22 1998-08-25 Tessera, Inc. Connecting multiple microelectronic elements with lead deformation
FR2730657B1 (fr) * 1995-02-22 1997-03-28 Solaic Sa Procede et installation pour realiser des trous dans le film isolant d'une bande support pour modules de cartes electroniques
DE69637994D1 (de) 1995-04-26 2009-09-24 Minnesota Mining & Mfg Ablationsverfahren durch laser-darstellung
US6133072A (en) * 1996-12-13 2000-10-17 Tessera, Inc. Microelectronic connector with planar elastomer sockets
US6735387B1 (en) 2001-01-10 2004-05-11 Tim Schnell Motion detector camera

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FR2404990A1 (fr) * 1977-10-03 1979-04-27 Cii Honeywell Bull Substrat d'interconnexion de composants electroniques a circuits integres, muni d'un dispositif de reparation
US4540226A (en) * 1983-01-03 1985-09-10 Texas Instruments Incorporated Intelligent electronic connection socket
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JP2641869B2 (ja) * 1987-07-24 1997-08-20 三菱電機株式会社 半導体装置の製造方法
FR2620586A1 (fr) * 1987-09-14 1989-03-17 Em Microelectronic Marin Sa Procede de fabrication de modules electroniques, notamment pour cartes a microcircuits

Also Published As

Publication number Publication date
ATE115335T1 (de) 1994-12-15
EP0436652A1 (en) 1991-07-17
EP0361985B1 (en) 1994-12-07
US5254811A (en) 1993-10-19
DE68919792T2 (de) 1995-08-03
DE68919792D1 (de) 1995-01-19
JP2873032B2 (ja) 1999-03-24
WO1990003662A1 (en) 1990-04-05
JPH04501486A (ja) 1992-03-12
EP0361985A1 (en) 1990-04-04

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