FR2404990A1 - Substrat d'interconnexion de composants electroniques a circuits integres, muni d'un dispositif de reparation - Google Patents

Substrat d'interconnexion de composants electroniques a circuits integres, muni d'un dispositif de reparation

Info

Publication number
FR2404990A1
FR2404990A1 FR7729687A FR7729687A FR2404990A1 FR 2404990 A1 FR2404990 A1 FR 2404990A1 FR 7729687 A FR7729687 A FR 7729687A FR 7729687 A FR7729687 A FR 7729687A FR 2404990 A1 FR2404990 A1 FR 2404990A1
Authority
FR
France
Prior art keywords
substrate
interconnection
repair device
electronic components
integrated circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7729687A
Other languages
English (en)
Other versions
FR2404990B1 (fr
Inventor
Bernard Badet
Karel Kurzweil
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bull SA
Original Assignee
Bull SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bull SA filed Critical Bull SA
Priority to FR7729687A priority Critical patent/FR2404990A1/fr
Priority to GB7835939A priority patent/GB2009516B/en
Priority to NL7809276A priority patent/NL7809276A/xx
Priority to IT28018/78A priority patent/IT1159117B/it
Priority to BE190797A priority patent/BE870879A/fr
Priority to SE7810314A priority patent/SE441880B/sv
Priority to JP12124178A priority patent/JPS5461669A/ja
Priority to CH1028178A priority patent/CH627877A5/fr
Priority to DE19782843144 priority patent/DE2843144A1/de
Priority to CA312,619A priority patent/CA1115853A/fr
Publication of FR2404990A1 publication Critical patent/FR2404990A1/fr
Application granted granted Critical
Publication of FR2404990B1 publication Critical patent/FR2404990B1/fr
Priority to US06/296,835 priority patent/US4371744A/en
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
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    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding

Abstract

L'invention concerne un substrat d'interconnexion 10 pourvu d'un ensemble de couches conductrices 19a-C et isolantes 20a, b alternées et superposées; des plots formés sur la couche isolante supérieure 20a et bordant au moins un domaine 13 destiné à un composant 11 dont les conducteurs de sortie 12 sont à connecter aux plots 14; et des traversées 21 comprenant au moins une traversée intérieure au domaine 13. L'invention présente un dispositif de réparation comprenant un moyen conducteur de dérivation 28a, b, 26a, b relié au plot 14 connecté à la traversée intérieure 21 et présentant au moins une plage de connexion auxiliaire 30 extérieure au domaine 13. L'invention permet de réparer le substrat sans avoir à enlever le composant il et s'applique à tout substrat porteur de pastilles de circuits intégrés.
FR7729687A 1977-10-03 1977-10-03 Substrat d'interconnexion de composants electroniques a circuits integres, muni d'un dispositif de reparation Granted FR2404990A1 (fr)

Priority Applications (11)

Application Number Priority Date Filing Date Title
FR7729687A FR2404990A1 (fr) 1977-10-03 1977-10-03 Substrat d'interconnexion de composants electroniques a circuits integres, muni d'un dispositif de reparation
GB7835939A GB2009516B (en) 1977-10-03 1978-09-07 Substrate for interconnecting electronic integrated circuit which is provided with a repair arrangement
NL7809276A NL7809276A (nl) 1977-10-03 1978-09-12 Verbindingssubstraat van elektrische componenten van geintregeerde ketens voorzien van een herstelinrichting
IT28018/78A IT1159117B (it) 1977-10-03 1978-09-25 Substrato di interconnessione di componenti elettronici a circuiti integrati munito di un dispositivo di riparazione
BE190797A BE870879A (fr) 1977-10-03 1978-09-29 Substrat d'interconnexion de composants electroniques a circuits integres, muni d'un dispositif de reparation
SE7810314A SE441880B (sv) 1977-10-03 1978-10-02 Substrat for hopkoppling av komponenter
JP12124178A JPS5461669A (en) 1977-10-03 1978-10-03 Substrate of mutually connecting integrated circuit element provided with variable structure
CH1028178A CH627877A5 (fr) 1977-10-03 1978-10-03 Substrat d'interconnexion de composants electroniques a circuits integres.
DE19782843144 DE2843144A1 (de) 1977-10-03 1978-10-03 Verbindungssubstrat
CA312,619A CA1115853A (fr) 1977-10-03 1978-10-03 Circuit integre comportant un dispositif of reparation
US06/296,835 US4371744A (en) 1977-10-03 1981-08-27 Substrate for interconnecting electronic integrated circuit components having a repair arrangement enabling modification of connections to a mounted chip device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7729687A FR2404990A1 (fr) 1977-10-03 1977-10-03 Substrat d'interconnexion de composants electroniques a circuits integres, muni d'un dispositif de reparation

Publications (2)

Publication Number Publication Date
FR2404990A1 true FR2404990A1 (fr) 1979-04-27
FR2404990B1 FR2404990B1 (fr) 1980-02-15

Family

ID=9196039

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7729687A Granted FR2404990A1 (fr) 1977-10-03 1977-10-03 Substrat d'interconnexion de composants electroniques a circuits integres, muni d'un dispositif de reparation

Country Status (11)

Country Link
US (1) US4371744A (fr)
JP (1) JPS5461669A (fr)
BE (1) BE870879A (fr)
CA (1) CA1115853A (fr)
CH (1) CH627877A5 (fr)
DE (1) DE2843144A1 (fr)
FR (1) FR2404990A1 (fr)
GB (1) GB2009516B (fr)
IT (1) IT1159117B (fr)
NL (1) NL7809276A (fr)
SE (1) SE441880B (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2496341A1 (fr) * 1980-12-12 1982-06-18 Thomson Csf Composant d'interconnexion topologique
FR2531302A1 (fr) * 1982-07-30 1984-02-03 Xerox Corp Procedes de formation d'un circuit electrique a haute densite et d'elements d'interconnexion pour le circuit
FR2549641A1 (fr) * 1983-07-19 1985-01-25 Nec Corp Ensemble a integration a grande echelle comportant un substrat en ceramique multicouche
EP0166401A2 (fr) * 1984-06-29 1986-01-02 International Business Machines Corporation Circuit électrique à module
EP0203203A1 (fr) * 1984-11-29 1986-12-03 Fujitsu Limited Substrat milticouche pour circuits imprimes
EP0206337A2 (fr) * 1985-06-25 1986-12-30 Nec Corporation Substrat pour des connexions multicouches comprenant des plages de câblage de rechange
FR2586885A1 (fr) * 1985-08-31 1987-03-06 Nec Corp Substrat de cablage a couches multiples.
EP0219627A1 (fr) * 1985-09-24 1987-04-29 Oerlikon-Contraves AG Panneau de circuit imprimé à multicouches

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4489364A (en) * 1981-12-31 1984-12-18 International Business Machines Corporation Chip carrier with embedded engineering change lines with severable periodically spaced bridging connectors on the chip supporting surface
US4682414A (en) * 1982-08-30 1987-07-28 Olin Corporation Multi-layer circuitry
JPS5946740A (ja) * 1982-09-09 1984-03-16 Ricoh Co Ltd 光書込デバイス
JPS59193596A (ja) * 1983-04-18 1984-11-02 Kyodo Printing Co Ltd Ｉｃカ−ド用ｉｃモジユ−ル
EP0166762A4 (fr) * 1983-12-15 1986-05-16 Laserpath Corp Circuiterie électrique.
US4584625A (en) * 1984-09-11 1986-04-22 Kellogg Nelson R Capacitive tactile sensor
JPS61131498A (ja) * 1984-11-29 1986-06-19 富士通株式会社 終端回路配線構造
FR2575331B1 (fr) * 1984-12-21 1987-06-05 Labo Electronique Physique Boitier pour composant electronique
US4789760A (en) * 1985-04-30 1988-12-06 Advanced Micro Devices, Inc. Via in a planarized dielectric and process for producing same
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NL7809276A (nl) 1979-04-05
CA1115853A (fr) 1982-01-05
BE870879A (fr) 1979-01-15
IT7828018A0 (it) 1978-09-25
IT1159117B (it) 1987-02-25
DE2843144A1 (de) 1979-04-12
DE2843144C2 (fr) 1989-07-13
FR2404990B1 (fr) 1980-02-15
GB2009516A (en) 1979-06-13
US4371744A (en) 1983-02-01
SE7810314L (sv) 1979-04-04
CH627877A5 (fr) 1982-01-29
SE441880B (sv) 1985-11-11
JPS5461669A (en) 1979-05-18
GB2009516B (en) 1982-03-24

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