FR2379909A1 - Procede et appareil de montage de dispositifs sur un substrat - Google Patents
Procede et appareil de montage de dispositifs sur un substratInfo
- Publication number
- FR2379909A1 FR2379909A1 FR7703271A FR7703271A FR2379909A1 FR 2379909 A1 FR2379909 A1 FR 2379909A1 FR 7703271 A FR7703271 A FR 7703271A FR 7703271 A FR7703271 A FR 7703271A FR 2379909 A1 FR2379909 A1 FR 2379909A1
- Authority
- FR
- France
- Prior art keywords
- substrate
- controlled
- machine
- relates
- mounting devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01025—Manganese [Mn]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01039—Yttrium [Y]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01051—Antimony [Sb]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01056—Barium [Ba]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01067—Holmium [Ho]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01075—Rhenium [Re]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
- Y10T29/5136—Separate tool stations for selective or successive operation on work
- Y10T29/5137—Separate tool stations for selective or successive operation on work including assembling or disassembling station
- Y10T29/5142—Separate tool stations for selective or successive operation on work including assembling or disassembling station and means to sever work from supply
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53004—Means to assemble or disassemble with means to regulate operation by use of templet, tape, card or other replaceable information supply
- Y10T29/53017—Web or strand-carried information supply
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
- Y10T29/53048—Multiple station assembly or disassembly apparatus
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53261—Means to align and advance work part
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/081—With randomly actuated stopping means
- Y10T83/088—Responsive to tool detector or work-feed-means detector
- Y10T83/089—Responsive to tool characteristic
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
- Control Of Position Or Direction (AREA)
- Drilling And Boring (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
L'invention concerne un appareil 40 destiné à équiper un substrat de connexion 56 de dispositifs à circuits intégrés de différents types montés sur des films 22. L'appareil 40 comprend une machine 42 comprenant des têtes de découpe 48 associées chacune à un film 22, et des têtes de soudage 50. Le substrat 56 est monté sur un plateau 54 déplaçable sur une table 52 suivant une direction perpendiculaire au mouvement de la table fait suivant la tige filetée 56 entraînée par le moteur 60. Le fonctionnement de la machine 42 est contrôlé et commandé par une unité 44 tel qu'un calculateur. L'invention concerne aussi un procédé pour l'equipement du substrat. L'invention s'applique notamment à l'équipement de substrats destinés à des ensembles de traitement de l'information.
Priority Applications (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7703271A FR2379909A1 (fr) | 1977-02-04 | 1977-02-04 | Procede et appareil de montage de dispositifs sur un substrat |
BE178667A BE855977A (fr) | 1977-02-04 | 1977-06-22 | Procede et appareil de montage de dispositifs sur un substrat |
CH768177A CH628196A5 (fr) | 1977-02-04 | 1977-06-22 | Procede et appareil de montage de dispositifs sur un substrat. |
CA282,128A CA1091818A (fr) | 1977-02-04 | 1977-07-06 | Procede et appareil de montage de dispositifs sur un substrat |
SE7709735A SE422868B (sv) | 1977-02-04 | 1977-08-30 | Sett och anordning for montering av organ pa ett substrat |
GB38210/77A GB1590545A (en) | 1977-02-04 | 1977-09-13 | Method and apparatus for mounting integrated circuit semiconductor devices on a substrate |
NL7712371A NL185966C (nl) | 1977-02-04 | 1977-11-10 | Apparaat voor het bevestigen van inrichtingen op voorafbepaalde posities op een verbindingssubstraat. |
JP15183977A JPS5397369A (en) | 1977-02-04 | 1977-12-19 | Method of and device for mounting device on substrate |
US05/874,652 US4236306A (en) | 1977-02-04 | 1978-02-02 | Method for mounting devices on a substrate |
DE19782804693 DE2804693A1 (de) | 1977-02-04 | 1978-02-03 | Verfahren und vorrichtung zum bestuecken von traegerplatten mit halbleiterbauteilen |
US05/966,318 US4236301A (en) | 1977-02-04 | 1978-12-04 | Apparatus for mounting devices on a substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7703271A FR2379909A1 (fr) | 1977-02-04 | 1977-02-04 | Procede et appareil de montage de dispositifs sur un substrat |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2379909A1 true FR2379909A1 (fr) | 1978-09-01 |
FR2379909B1 FR2379909B1 (fr) | 1980-06-13 |
Family
ID=9186345
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7703271A Granted FR2379909A1 (fr) | 1977-02-04 | 1977-02-04 | Procede et appareil de montage de dispositifs sur un substrat |
Country Status (10)
Country | Link |
---|---|
US (2) | US4236306A (fr) |
JP (1) | JPS5397369A (fr) |
BE (1) | BE855977A (fr) |
CA (1) | CA1091818A (fr) |
CH (1) | CH628196A5 (fr) |
DE (1) | DE2804693A1 (fr) |
FR (1) | FR2379909A1 (fr) |
GB (1) | GB1590545A (fr) |
NL (1) | NL185966C (fr) |
SE (1) | SE422868B (fr) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2843144A1 (de) * | 1977-10-03 | 1979-04-12 | Cii Honeywell Bull | Verbindungssubstrat |
FR2476963A1 (fr) * | 1980-02-25 | 1981-08-28 | Philips Nv | Dispositif de montage sur un substrat de composants electroniques en forme de plaquettes ou de paves depourvus de fils de connexion |
EP0036826A1 (fr) * | 1980-03-25 | 1981-09-30 | Eurosoft Robotique | Machine automatique de câblage de circuits électroniques hybrides |
EP0041041A1 (fr) * | 1980-05-19 | 1981-12-02 | Les Fabriques d'Assortiments Réunies | Procédé et dispositif de report d'un composant électronique sur un substrat |
EP0130498A1 (fr) * | 1983-06-30 | 1985-01-09 | International Business Machines Corporation | Connexion de bande universelle hautement intégrée pour plaquettes semi-conductrices |
EP0239381A2 (fr) * | 1986-03-26 | 1987-09-30 | Emhart Inc. | Commande de niveau de vapeur pour système de traitement par vapeur |
FR2733553A1 (fr) * | 1995-04-25 | 1996-10-31 | Pem Sa Protection Electrolytiq | Dispositif de contre-collage pour la solidarisation d'une bande metallique et d'une bande de materiau isolant |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0020832A1 (fr) * | 1979-06-26 | 1981-01-07 | Excellon Industries | Système de reconnaissance de formes et procédé utilisant ce système |
FR2495836A1 (fr) * | 1980-12-05 | 1982-06-11 | Cii Honeywell Bull | Machine automatique de cambrage des pattes de connexion de plaquettes de circuits integres |
JPS5718392A (en) * | 1980-12-29 | 1982-01-30 | Ikegami Tsushinki Kk | Position detector |
JPS57128175U (fr) * | 1981-02-03 | 1982-08-10 | ||
US4460421A (en) * | 1982-11-29 | 1984-07-17 | At&T Technologies, Inc. | Methods of and apparatus for indexing a repetitively patterned strip past a plurality of work stations |
SE454439B (sv) * | 1983-07-06 | 1988-05-02 | Tetra Pak Ab | Sett och anordning att med fotoelektriska medel detektera och behorighetskontrollera gjorda styrmarkeringar pa en med tryck dekorerad lopande materialbana |
US4868978A (en) * | 1985-11-12 | 1989-09-26 | Siemens Aktiengesellschaft | Method and apparatus for equipping substrates with micropacks |
EP0222401B1 (fr) * | 1985-11-13 | 1994-02-16 | Fujitsu Limited | Presse pour découper des bandes de circuits intégrés |
US4787143A (en) * | 1985-12-04 | 1988-11-29 | Tdk Corporation | Method for detecting and correcting failure in mounting of electronic parts on substrate and apparatus therefor |
US4731923A (en) * | 1986-03-15 | 1988-03-22 | Tdk Corporation | Apparatus and method for mounting circuit element on printed circuit board |
JPH0636393B2 (ja) * | 1987-04-15 | 1994-05-11 | 松下電器産業株式会社 | 電子部品の製造方法 |
US5251372A (en) * | 1988-08-03 | 1993-10-12 | Houghton Jon C | Method and apparatus for framing a film mounted integrated circuit |
US5084962A (en) * | 1988-08-24 | 1992-02-04 | Tdk Corporation | Apparatus for and method of automatically mounting electronic component on printed circuit board |
JPH02303100A (ja) * | 1989-05-17 | 1990-12-17 | Matsushita Electric Ind Co Ltd | 部品装着方法 |
US5113565A (en) * | 1990-07-06 | 1992-05-19 | International Business Machines Corp. | Apparatus and method for inspection and alignment of semiconductor chips and conductive lead frames |
US5410124A (en) * | 1993-04-01 | 1995-04-25 | Micron Technology, Inc. | Tracking sensor fixture and method for tracking reference locations on a moving semiconductor leadframe strip |
US5503895A (en) * | 1993-09-20 | 1996-04-02 | Bi-Link Metal Specialties | Supply feedstock for workpiece finishing machine |
EP0665706A1 (fr) * | 1994-01-28 | 1995-08-02 | Molex Incorporated | Procédé de fabrication de circuits souples plats |
US6405430B1 (en) * | 1996-02-07 | 2002-06-18 | Micron Technology, Inc. | Workpiece moving methods |
JP3422645B2 (ja) * | 1997-02-14 | 2003-06-30 | 富士通株式会社 | 回路素子配置装置 |
TW396474B (en) * | 1997-07-11 | 2000-07-01 | Hitachi Ltd | Method for forming bump bondings |
KR100319198B1 (ko) * | 1999-11-17 | 2001-12-29 | 윤종용 | 반도체 모듈에 히트 싱크를 조립하는 설비 및 그 조립 방법 |
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KR100490700B1 (ko) * | 2002-09-26 | 2005-05-19 | 주식회사 풍산마이크로텍 | 전자부품 조립용 리벳팅 머신. |
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GB801232A (en) * | 1956-04-05 | 1958-09-10 | Gen Electric Co Ltd | Improvements in or relating to automatic machines for performing a sequence of operations on a plurality of articles |
DE1453097A1 (de) * | 1964-06-10 | 1969-01-02 | Rheinische Nadelfab Gmbh | Fussbodenpflege- und -reinigungsmaschine |
US3412451A (en) * | 1966-02-10 | 1968-11-26 | Amp Inc | Force limiting tool |
US3508315A (en) * | 1967-07-26 | 1970-04-28 | Essington Metal Works Inc | Apparatus for inserting and for securing preformed electronic components to printed circuit boards |
US3597824A (en) * | 1968-03-19 | 1971-08-10 | Matsushita Electric Ind Co Ltd | Full-automatic electric part mounting apparatus |
US3744361A (en) * | 1971-02-08 | 1973-07-10 | Lummus Industries | Process and apparatus for cutting elongated material |
US3710479A (en) * | 1971-03-01 | 1973-01-16 | Ibm | Component insertion apparatus |
US3735911A (en) * | 1971-04-30 | 1973-05-29 | Ibm | Integrated circuit chip repair tool |
US3777350A (en) * | 1971-07-26 | 1973-12-11 | Matsushita Electric Ind Co Ltd | Component mounting apparatus |
US3742574A (en) * | 1971-12-03 | 1973-07-03 | Gte Automatic Electric Lab Inc | Wire braid forming apparatus |
US3765075A (en) * | 1972-01-03 | 1973-10-16 | Honeywell Inf Systems | Method and apparatus for inserting pins into a circuit board |
US3783488A (en) * | 1972-07-05 | 1974-01-08 | Universal Instruments Corp | Film mounted electronic component insertion machine |
FR2205800B1 (fr) * | 1972-11-09 | 1976-08-20 | Honeywell Bull Soc Ind | |
FR2225977A5 (en) * | 1973-04-13 | 1974-11-08 | Honeywell Bull Soc Ind | Feeding mechanism for perforated flexible strip - claws feed strip intermittently under control of double slide mechanism |
FR2238247B1 (fr) * | 1973-06-27 | 1976-11-12 | Honeywell Bull Soc Ind | |
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GB1521782A (en) * | 1975-04-07 | 1978-08-16 | Matsushita Electric Ind Co Ltd | Printed circuit board electrical component mounting method and apparatus |
JPS51116968A (en) * | 1975-04-07 | 1976-10-14 | Matsushita Electric Ind Co Ltd | Device for inserting electric parts |
US4080730A (en) * | 1976-09-07 | 1978-03-28 | Usm Corporation | Machine for assembling components |
-
1977
- 1977-02-04 FR FR7703271A patent/FR2379909A1/fr active Granted
- 1977-06-22 CH CH768177A patent/CH628196A5/fr not_active IP Right Cessation
- 1977-06-22 BE BE178667A patent/BE855977A/fr not_active IP Right Cessation
- 1977-07-06 CA CA282,128A patent/CA1091818A/fr not_active Expired
- 1977-08-30 SE SE7709735A patent/SE422868B/xx not_active IP Right Cessation
- 1977-09-13 GB GB38210/77A patent/GB1590545A/en not_active Expired
- 1977-11-10 NL NL7712371A patent/NL185966C/xx not_active IP Right Cessation
- 1977-12-19 JP JP15183977A patent/JPS5397369A/ja active Granted
-
1978
- 1978-02-02 US US05/874,652 patent/US4236306A/en not_active Expired - Lifetime
- 1978-02-03 DE DE19782804693 patent/DE2804693A1/de active Granted
- 1978-12-04 US US05/966,318 patent/US4236301A/en not_active Expired - Lifetime
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2843144A1 (de) * | 1977-10-03 | 1979-04-12 | Cii Honeywell Bull | Verbindungssubstrat |
FR2476963A1 (fr) * | 1980-02-25 | 1981-08-28 | Philips Nv | Dispositif de montage sur un substrat de composants electroniques en forme de plaquettes ou de paves depourvus de fils de connexion |
EP0036826A1 (fr) * | 1980-03-25 | 1981-09-30 | Eurosoft Robotique | Machine automatique de câblage de circuits électroniques hybrides |
EP0041041A1 (fr) * | 1980-05-19 | 1981-12-02 | Les Fabriques d'Assortiments Réunies | Procédé et dispositif de report d'un composant électronique sur un substrat |
EP0130498A1 (fr) * | 1983-06-30 | 1985-01-09 | International Business Machines Corporation | Connexion de bande universelle hautement intégrée pour plaquettes semi-conductrices |
EP0239381A2 (fr) * | 1986-03-26 | 1987-09-30 | Emhart Inc. | Commande de niveau de vapeur pour système de traitement par vapeur |
EP0239381A3 (fr) * | 1986-03-26 | 1989-05-24 | Emhart Inc. | Commande de niveau de vapeur pour système de traitement par vapeur |
FR2733553A1 (fr) * | 1995-04-25 | 1996-10-31 | Pem Sa Protection Electrolytiq | Dispositif de contre-collage pour la solidarisation d'une bande metallique et d'une bande de materiau isolant |
WO1996034361A2 (fr) * | 1995-04-25 | 1996-10-31 | Pem S.A. - Protection Electrolytique Des Metaux | Dispositif de contre-collage pour la solidarisation d'une bande metallique et d'une bande de materiau isolant |
WO1996034361A3 (fr) * | 1995-04-25 | 1996-11-28 | Pem S A Protection Electrolyti | Dispositif de contre-collage pour la solidarisation d'une bande metallique et d'une bande de materiau isolant |
US6066231A (en) * | 1995-04-25 | 2000-05-23 | Pem S.A. Protection Electrolytique Des Metaux | Laminating device for joining a metal strip and an insulating material strip |
Also Published As
Publication number | Publication date |
---|---|
NL7712371A (nl) | 1978-08-08 |
DE2804693A1 (de) | 1978-08-10 |
BE855977A (fr) | 1977-10-17 |
SE422868B (sv) | 1982-03-29 |
NL185966B (nl) | 1990-03-16 |
JPS6337520B2 (fr) | 1988-07-26 |
CA1091818A (fr) | 1980-12-16 |
US4236301A (en) | 1980-12-02 |
DE2804693C2 (fr) | 1992-05-21 |
NL185966C (nl) | 1990-08-16 |
GB1590545A (en) | 1981-06-03 |
JPS5397369A (en) | 1978-08-25 |
FR2379909B1 (fr) | 1980-06-13 |
CH628196A5 (fr) | 1982-02-15 |
SE7709735L (sv) | 1978-08-05 |
US4236306A (en) | 1980-12-02 |
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