FR2238247B1 - - Google Patents

Info

Publication number
FR2238247B1
FR2238247B1 FR7323502A FR7323502A FR2238247B1 FR 2238247 B1 FR2238247 B1 FR 2238247B1 FR 7323502 A FR7323502 A FR 7323502A FR 7323502 A FR7323502 A FR 7323502A FR 2238247 B1 FR2238247 B1 FR 2238247B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7323502A
Other versions
FR2238247A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bull SA
Original Assignee
Societe Industrielle Honeywell Bull
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Societe Industrielle Honeywell Bull filed Critical Societe Industrielle Honeywell Bull
Priority to FR7323502A priority Critical patent/FR2238247B1/fr
Priority to JP49071972A priority patent/JPS5039068A/ja
Priority to NL7416624A priority patent/NL7416624A/xx
Priority to DE19752500180 priority patent/DE2500180A1/de
Priority to GB117875A priority patent/GB1475831A/en
Publication of FR2238247A1 publication Critical patent/FR2238247A1/fr
Application granted granted Critical
Publication of FR2238247B1 publication Critical patent/FR2238247B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
FR7323502A 1973-06-27 1973-06-27 Expired FR2238247B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR7323502A FR2238247B1 (fr) 1973-06-27 1973-06-27
JP49071972A JPS5039068A (fr) 1973-06-27 1974-06-25
NL7416624A NL7416624A (nl) 1973-06-27 1974-12-20 Werkwijze voor het gereed maken van micro- plaatjes met geintegreerde circuits.
DE19752500180 DE2500180A1 (de) 1973-06-27 1975-01-03 Verfahren und vorrichtung zum verarbeiten von ic-chips
GB117875A GB1475831A (en) 1973-06-27 1975-01-10 Method and apparatus for processing semi-conductor integrated circuit chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7323502A FR2238247B1 (fr) 1973-06-27 1973-06-27

Publications (2)

Publication Number Publication Date
FR2238247A1 FR2238247A1 (fr) 1975-02-14
FR2238247B1 true FR2238247B1 (fr) 1976-11-12

Family

ID=9121656

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7323502A Expired FR2238247B1 (fr) 1973-06-27 1973-06-27

Country Status (5)

Country Link
JP (1) JPS5039068A (fr)
DE (1) DE2500180A1 (fr)
FR (1) FR2238247B1 (fr)
GB (1) GB1475831A (fr)
NL (1) NL7416624A (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2299724A1 (fr) * 1975-01-29 1976-08-27 Honeywell Bull Soc Ind Perfectionnements aux supports de conditionnement de micro-plaquettes de circuits integres
FR2379909A1 (fr) * 1977-02-04 1978-09-01 Cii Honeywell Bull Procede et appareil de montage de dispositifs sur un substrat
DE3019207A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-chip
JPS57193203A (en) * 1981-05-26 1982-11-27 Nippon Kokan Kk <Nkk> Rolling method for h-steel
EP0087796B1 (fr) * 1982-03-02 1989-05-17 Siemens Aktiengesellschaft Film de support pour une configuration de conducteurs électriques
FR2571923B1 (fr) * 1984-10-16 1987-02-20 Farco Sa Procede de soudage d'un composant electrique a un ensemble de pattes de connexion ainsi que machine et ruban pour la mise en oeuvre de ce procede
EP0208916A3 (fr) * 1985-06-13 1987-08-12 Matsushita Electric Industrial Co., Ltd. Appareil pour fabriquer une connexion permanente entre conducteurs électriques
JPS62151214A (ja) * 1985-12-25 1987-07-06 Kawasaki Steel Corp Ｈ形鋼の厚み制御方法
US4845335A (en) * 1988-01-28 1989-07-04 Microelectronics And Computer Technology Corporation Laser Bonding apparatus and method
EP0456388A1 (fr) * 1990-05-08 1991-11-13 International Business Machines Corporation Traitement de substrats de circuit haute densité et conteneur destiné à ce traitement
CN112390011B (zh) * 2020-10-29 2022-11-04 苏州华兴源创科技股份有限公司 压紧机构

Also Published As

Publication number Publication date
JPS5039068A (fr) 1975-04-10
DE2500180A1 (de) 1976-07-08
NL7416624A (nl) 1976-06-22
FR2238247A1 (fr) 1975-02-14
GB1475831A (en) 1977-06-10

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Legal Events

Date Code Title Description
ST Notification of lapse