SE8504431D0 - Integrerad krets med dislokationsfritt substrat - Google Patents

Integrerad krets med dislokationsfritt substrat

Info

Publication number
SE8504431D0
SE8504431D0 SE8504431A SE8504431A SE8504431D0 SE 8504431 D0 SE8504431 D0 SE 8504431D0 SE 8504431 A SE8504431 A SE 8504431A SE 8504431 A SE8504431 A SE 8504431A SE 8504431 D0 SE8504431 D0 SE 8504431D0
Authority
SE
Sweden
Prior art keywords
atoms
host
alloyed
integrated circuit
dislocation
Prior art date
Application number
SE8504431A
Other languages
English (en)
Other versions
SE8504431L (sv
Inventor
A Sher
Original Assignee
Stanford Res Inst Int
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanford Res Inst Int filed Critical Stanford Res Inst Int
Publication of SE8504431L publication Critical patent/SE8504431L/sv
Publication of SE8504431D0 publication Critical patent/SE8504431D0/sv

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
    • H10D62/854Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs further characterised by the dopants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/82Heterojunctions
    • H10D62/826Heterojunctions comprising only Group II-VI materials heterojunctions, e.g. CdTe/HgTe heterojunctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/834Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge further characterised by the dopants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
    • H10D62/852Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs being Group III-V materials comprising three or more elements, e.g. AlGaN or InAsSbP
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/86Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group II-VI materials, e.g. ZnO
    • H10D62/862Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group II-VI materials, e.g. ZnO being Group II-VI materials comprising three or more elements, e.g. CdZnTe
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/93Ternary or quaternary semiconductor comprised of elements from three different groups, e.g. I-III-V

Landscapes

  • Recrystallisation Techniques (AREA)
  • Bipolar Transistors (AREA)
SE8504431A 1984-02-02 1985-09-25 Integrerad krets med dislokationsfritt substrat SE8504431D0 (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/576,728 US4697202A (en) 1984-02-02 1984-02-02 Integrated circuit having dislocation free substrate

Publications (2)

Publication Number Publication Date
SE8504431L SE8504431L (sv) 1985-09-25
SE8504431D0 true SE8504431D0 (sv) 1985-09-25

Family

ID=24305733

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8504431A SE8504431D0 (sv) 1984-02-02 1985-09-25 Integrerad krets med dislokationsfritt substrat

Country Status (9)

Country Link
US (1) US4697202A (sv)
EP (1) EP0172176A1 (sv)
JP (1) JPS61501234A (sv)
CA (1) CA1237826A (sv)
DE (1) DE3590003T1 (sv)
GB (4) GB2163003B (sv)
NL (1) NL8520001A (sv)
SE (1) SE8504431D0 (sv)
WO (1) WO1985003598A1 (sv)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4697202A (en) * 1984-02-02 1987-09-29 Sri International Integrated circuit having dislocation free substrate
US4835583A (en) * 1985-08-30 1989-05-30 Hitachi, Ltd. Semiconductor device having strained superlattice buffer layers with In-doped GaAs substrate
US4769341A (en) * 1986-12-29 1988-09-06 American Telephone And Telegraph Company, At&T Bell Laboratories Method of fabricating non-silicon materials on silicon substrate using an alloy of Sb and Group IV semiconductors
KR900001062B1 (ko) * 1987-09-15 1990-02-26 강진구 반도체 바이 씨 모오스 장치의 제조방법
US5300793A (en) * 1987-12-11 1994-04-05 Hitachi, Ltd. Hetero crystalline structure and semiconductor device using it
GB2215514A (en) * 1988-03-04 1989-09-20 Plessey Co Plc Terminating dislocations in semiconductor epitaxial layers
US4916088A (en) * 1988-04-29 1990-04-10 Sri International Method of making a low dislocation density semiconductor device
US5063166A (en) * 1988-04-29 1991-11-05 Sri International Method of forming a low dislocation density semiconductor device
US5068695A (en) * 1988-04-29 1991-11-26 Sri International Low dislocation density semiconductor device
GB8821116D0 (en) * 1988-09-08 1989-11-08 Barr & Stroud Ltd Infra-red transmitting optical components and optical coatings therefor
DE3901551A1 (de) * 1989-01-20 1990-07-26 Lohmann Therapie Syst Lts Superfizielles therapeutisches system mit einem gehalt an einem antineoplastischen wirkstoff, insbesondere 5-fluoruracil
DE68919408T2 (de) * 1989-01-13 1995-04-20 Toshiba Kawasaki Kk Verbindungshalbleiter, denselben anwendendes Halbleiter-Bauelement und Herstellungsverfahren des Halbleiter-Bauelementes.
US4992840A (en) * 1989-09-21 1991-02-12 Hewlett-Packard Company Carbon doping MOSFET substrate to suppress hit electron trapping
US5247201A (en) * 1990-02-15 1993-09-21 Siemens Aktiengesellschaft Input protection structure for integrated circuits
US5043773A (en) * 1990-06-04 1991-08-27 Advanced Technology Materials, Inc. Wafer base for silicon carbide semiconductor devices, incorporating alloy substrates
US5190890A (en) * 1990-06-04 1993-03-02 Advanced Technology Materials, Inc. Wafer base for silicon carbide semiconductor devices, incorporating alloy substrates, and method of making the same
US5173751A (en) * 1991-01-21 1992-12-22 Pioneer Electronic Corporation Semiconductor light emitting device
KR940009357B1 (ko) * 1991-04-09 1994-10-07 삼성전자주식회사 반도체 장치 및 그 제조방법
AU6097294A (en) * 1993-02-17 1994-09-14 Ameritech Services, Inc. Universal tv interface and related method
US6043548A (en) * 1993-04-14 2000-03-28 Yeda Research And Development Co., Ltd. Semiconductor device with stabilized junction
DE19640003B4 (de) 1996-09-27 2005-07-07 Siemens Ag Halbleitervorrichtung und Verfahren zu dessen Herstellung
US5998235A (en) * 1997-06-26 1999-12-07 Lockheed Martin Corporation Method of fabrication for mercury-based quaternary alloys of infrared sensitive materials
US6780735B2 (en) * 2001-04-30 2004-08-24 International Business Machines Corporation Method to increase carbon and boron doping concentrations in Si and SiGe films
US8343825B2 (en) 2011-01-19 2013-01-01 International Business Machines Corporation Reducing dislocation formation in semiconductor devices through targeted carbon implantation
CN110359218A (zh) * 2018-04-10 2019-10-22 青岛海尔洗衣机有限公司 一种定频洗衣机的脱水时间的控制方法及定频洗衣机

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2032439A (en) * 1933-04-13 1936-03-03 Ruben Rectifier Corp Electric current rectifier
BE466591A (sv) * 1945-07-13
NL252729A (sv) * 1959-06-18
US3147412A (en) * 1960-10-27 1964-09-01 Monsanto Co Junction rectifier of boron phosphide having boron-to-phosphorus atomic ratio of 6 to 100
US3261726A (en) * 1961-10-09 1966-07-19 Monsanto Co Production of epitaxial films
US3218203A (en) * 1961-10-09 1965-11-16 Monsanto Co Altering proportions in vapor deposition process to form a mixed crystal graded energy gap
US3218204A (en) * 1962-07-13 1965-11-16 Monsanto Co Use of hydrogen halide as a carrier gas in forming ii-vi compound from a crude ii-vicompound
GB1123371A (en) * 1965-02-08 1968-08-14 Mini Of Technology Improvements in or relating to crystalline materials
US3496118A (en) * 1966-04-19 1970-02-17 Bell & Howell Co Iiib-vb compounds
US3454370A (en) * 1966-05-26 1969-07-08 American Cyanamid Co Novel ternary semiconducting materials
US3617820A (en) * 1966-11-18 1971-11-02 Monsanto Co Injection-luminescent diodes
US3648120A (en) * 1969-01-16 1972-03-07 Bell Telephone Labor Inc Indium aluminum phosphide and electroluminescent device using same
US3629018A (en) * 1969-01-23 1971-12-21 Texas Instruments Inc Process for the fabrication of light-emitting semiconductor diodes
GB1288029A (sv) * 1970-02-07 1972-09-06
US3721583A (en) * 1970-12-08 1973-03-20 Ibm Vapor phase epitaxial deposition process for forming superlattice structure
JPS4866384A (sv) * 1971-12-14 1973-09-11
US3862859A (en) * 1972-01-10 1975-01-28 Rca Corp Method of making a semiconductor device
JPS4888027A (sv) * 1972-02-25 1973-11-19
US3821033A (en) * 1972-08-03 1974-06-28 Ibm Method for producing flat composite semiconductor substrates
JPS5234755B2 (sv) * 1972-11-20 1977-09-05
FR2225207B1 (sv) * 1973-04-16 1978-04-21 Ibm
US3947840A (en) * 1974-08-16 1976-03-30 Monsanto Company Integrated semiconductor light-emitting display array
US3963538A (en) * 1974-12-17 1976-06-15 International Business Machines Corporation Two stage heteroepitaxial deposition process for GaP/Si
US3963539A (en) * 1974-12-17 1976-06-15 International Business Machines Corporation Two stage heteroepitaxial deposition process for GaAsP/Si LED's
US3978360A (en) * 1974-12-27 1976-08-31 Nasa III-V photocathode with nitrogen doping for increased quantum efficiency
US4019082A (en) * 1975-03-24 1977-04-19 Rca Corporation Electron emitting device and method of making the same
US4188244A (en) * 1975-04-10 1980-02-12 Matsushita Electric Industrial Co., Ltd. Method of making a semiconductor light-emitting device utilizing low-temperature vapor-phase deposition
DE2601652C3 (de) * 1976-01-17 1979-11-08 Metallurgie Hoboken-Overpelt, Bruessel Verfahren zur epitaxialen Abscheidung einer Am. Bv Halbleiterschicht auf einem Germaniumsubstrat mit einer (100)-Orientierong
US4400244A (en) * 1976-06-08 1983-08-23 Monosolar, Inc. Photo-voltaic power generating means and methods
JPS5811370B2 (ja) * 1977-03-14 1983-03-02 箕村 茂 金属間化合物の金属的変態物質とその製造法
US4165471A (en) * 1977-07-25 1979-08-21 Eastman Kodak Company Optical sensor apparatus
US4116733A (en) * 1977-10-06 1978-09-26 Rca Corporation Vapor phase growth technique of III-V compounds utilizing a preheating step
FR2428921A1 (fr) * 1978-06-12 1980-01-11 Commissariat Energie Atomique Procede de realisation de diodes electroluminescentes et/ou photodetectrices
US4179308A (en) * 1978-06-23 1979-12-18 Rca Corporation Low cost high efficiency gallium arsenide homojunction solar cell incorporating a layer of indium gallium phosphide
JPS5511310A (en) * 1978-07-10 1980-01-26 Hitachi Ltd Semiconductor laser element
US4213781A (en) * 1978-11-20 1980-07-22 Westinghouse Electric Corp. Deposition of solid semiconductor compositions and novel semiconductor materials
US4257057A (en) * 1979-05-07 1981-03-17 Rockwell International Corporation Self-multiplexed monolithic intrinsic infrared detector
US4319069A (en) * 1980-07-25 1982-03-09 Eastman Kodak Company Semiconductor devices having improved low-resistance contacts to p-type CdTe, and method of preparation
US4445965A (en) * 1980-12-01 1984-05-01 Carnegie-Mellon University Method for making thin film cadmium telluride and related semiconductors for solar cells
JPS5914440B2 (ja) * 1981-09-18 1984-04-04 住友電気工業株式会社 CaAs単結晶への硼素のド−ピング方法
CA1189173A (en) * 1981-11-20 1985-06-18 Alice W.L. Lin Elements and methods of preparing elements containing low-resistance contact electrodes for cdte semiconductor materials
JPS58181799A (ja) * 1982-04-16 1983-10-24 Nippon Telegr & Teleph Corp <Ntt> 硼素を添加したGaAs単結晶の製造方法
JPS58192044A (ja) * 1982-05-06 1983-11-09 Konishiroku Photo Ind Co Ltd 感光体
US4697202A (en) * 1984-02-02 1987-09-29 Sri International Integrated circuit having dislocation free substrate
JPS60200900A (ja) * 1984-03-26 1985-10-11 Sumitomo Electric Ind Ltd 低転位密度の3−5化合物半導体単結晶

Also Published As

Publication number Publication date
GB2200251A (en) 1988-07-27
US4697202A (en) 1987-09-29
SE8504431L (sv) 1985-09-25
GB8804297D0 (en) 1988-03-23
GB8521397D0 (en) 1985-10-02
GB2200250A (en) 1988-07-27
GB2200249A (en) 1988-07-27
DE3590003T1 (de) 1985-11-28
GB8804296D0 (en) 1988-03-23
GB8804298D0 (en) 1988-03-23
NL8520001A (nl) 1986-01-02
GB2163003A (en) 1986-02-12
EP0172176A1 (en) 1986-02-26
GB2200250B (en) 1989-01-05
JPS61501234A (ja) 1986-06-19
WO1985003598A1 (en) 1985-08-15
GB2200249B (en) 1989-01-05
GB2163003B (en) 1989-01-11
GB2200251B (en) 1989-01-05
CA1237826A (en) 1988-06-07

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Effective date: 19890524