KR950035551A - 전자 디바이스 접속 방법 - Google Patents
전자 디바이스 접속 방법 Download PDFInfo
- Publication number
- KR950035551A KR950035551A KR1019950014011A KR19950014011A KR950035551A KR 950035551 A KR950035551 A KR 950035551A KR 1019950014011 A KR1019950014011 A KR 1019950014011A KR 19950014011 A KR19950014011 A KR 19950014011A KR 950035551 A KR950035551 A KR 950035551A
- Authority
- KR
- South Korea
- Prior art keywords
- solder
- carrier sheet
- electronic device
- soluble
- array
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 claims abstract description 19
- 239000002245 particle Substances 0.000 claims abstract description 9
- 239000000696 magnetic material Substances 0.000 claims abstract 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract 3
- 239000002195 soluble material Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 238000001035 drying Methods 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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Abstract
본 발명에 따라, 하나 이상의 접촉 패드를 가진 전자 디바이스가 제거가능한 캐리어 시트상의 전송가능한 땜납 입자들의 어레이에 부착된다. 이 캐리어는 녹임으로써 제거되며 접촉 패드에 선택적으로 부착된 땜납이 남는다. 양호한 실시예에서 땜납-이송 매체는 물에 잘 녹으며, 땜납 입자들은 자성체 코팅된 땜납을 포함한다. 상기 매체를 건조시키거나 가공하는 동안 자성 물질을 인가하면 코팅된 땜납 입자들이 규칙적으로 배열한다. 이 방법을 사용하여 종래의 접촉 구조체보다 더 작은 구조체를 가진 디바이스들이 용이하게 상호접속할 수 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도는 제1의 공정에서 사용되는 양호한 땜납 이송 매체를 나타낸 단면도, 제4도는 전자 디바이스에 접촉되도록 다가가는 제3도의 구조체, 제5도는 캐리어 매체와 부가되지 않은 땜납 입자들이 제거된 후의 전자 디바이스 도시도, 제6도는 패드에 접속되도록 전자 디바이스에 접촉하여 다가가는 전자 디바이스의 땜납을 포함하는 패드 도시도.
Claims (10)
- 하나 이상의 전기적 접촉 패드를 가진 전자 디바이스를 제2디바이스에 접속하는 방법에 있어서, 하나 이상의 접촉 패드를 가지는 전자 디바이스를 제공하는 단계와:상기 디바이스를 제거가능한 캐리어 시트상에 배치된 땜납 입자들의 어레이에 접촉시키는 단계와:상기 어레이로부터 상기 접촉 패드로 땜납을 선택적으로 부착시키는 단계와:상기 접촉 패드상에 땜납을 남겨두면서 상기 유연성 있는 캐리어 매체를 제거하는 단계 및:땜납 이송 패드를 상기 제2디바이스 접촉시키는 단계를 포함하는 것을 특징으로 하는 전자 디바이스 제조 방법.
- 제1항에 있어서, 상기 땜납 입자들을 열을 가함으로써 상기 접속 패드에 부착되는 것을 특징으로 하는 디바이스 제조방법.
- 제1항에 있어서, 상기 제거가능한 캐리어 시트는 녹는 물질을 포함하며 용매에 용해됨으로써 제거되는 것을 특징으로 하는 전자 디바이스 제조방법.
- 제1항에 있어서, 상기 제거가능한 캐리어 시트는 물에 녹는 물질을 포함하는 것을 특징으로 하는 전자 디바이스 제조방법.
- 제1항에 있어서, 상기 땜납 입자들의 어레이는 자성체로 코팅된 땝납의 어레이를 포함하는 것을 특징으로 하는 전자 디바이스 제조방법.
- 전기적 접촉 패드의 표면에 땜납을 적용하기 위한 땜납-이송 캐리어 시트에 있어서, 가용성 캐리어 매체층과:상기 가용성 매체에 적어도 부분적으로 심어져 있으며 상기 매체 표면으로부터 돌출해 있는 땜납 입자들의 어레이를 포함하는 것을 특징으로 하는 땜납-이송 캐리어 시트.
- 제6항에 있어서, 상기 가용성 캐리어 매체는 물에 잘 녹는 것을 특징으로 하는 땜납-이송 캐리어 시트.
- 제6항에 있어서, 상기 땜납 입자들은 땜납에 코팅된 자성체를 포함하는 것을 특징으로 하는 땜납-이송 캐리어 시트.
- 제6항에 있어서, 상기 가용성 캐리어 매체의 층에 부착된 지원층을 더 포함하는 것을 특징으로 하는 땜납-이송 캐리어 시트.
- 제1항, 2항, 3항, 4항 또는 5항의 공정에 따라 하나 이상의 전기적 접속 패드를 가진 전자 디바이스를 제2의 디바이스에 접속하는 것을 특징으로 하는 전자 디바이스.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US251,547 | 1994-05-31 | ||
US08/251,547 US5591037A (en) | 1994-05-31 | 1994-05-31 | Method for interconnecting an electronic device using a removable solder carrying medium |
Publications (1)
Publication Number | Publication Date |
---|---|
KR950035551A true KR950035551A (ko) | 1995-12-30 |
Family
ID=22952433
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950014011A KR950035551A (ko) | 1994-05-31 | 1995-05-31 | 전자 디바이스 접속 방법 |
Country Status (7)
Country | Link |
---|---|
US (1) | US5591037A (ko) |
EP (1) | EP0685880B1 (ko) |
JP (2) | JP3946786B2 (ko) |
KR (1) | KR950035551A (ko) |
DE (1) | DE69518120T2 (ko) |
ES (1) | ES2149927T3 (ko) |
TW (1) | TW267251B (ko) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
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US6099935A (en) * | 1995-12-15 | 2000-08-08 | International Business Machines Corporation | Apparatus for providing solder interconnections to semiconductor and electronic packaging devices |
KR100542552B1 (ko) * | 2003-08-21 | 2006-01-11 | 삼성전자주식회사 | 인쇄회로기판, 및 이 인쇄회로기판을 갖는 화상기록장치 |
US20050221635A1 (en) | 2004-03-30 | 2005-10-06 | International Business Machines Corporation | Micro-bumps to enhance lga interconnections |
DE102004025279B4 (de) * | 2004-05-19 | 2011-04-28 | Infineon Technologies Ag | Anlage für ein Bestücken von Substraten mit Kugelkontakten und Verfahren zum Bestücken von Substraten mit Kugelkontakten |
EP1829639A4 (en) * | 2004-12-20 | 2008-12-03 | Senju Metal Industry Co | PRELIMINARY COATING METHOD FOR WELDING AND WORKING FOR ELECTRONIC COMPONENT |
DE112008000327T5 (de) * | 2007-02-06 | 2009-12-31 | World Properties, Inc., Lincolnwood | Leitfähige Polymerschäume, Herstellungsverfahren und Anwendungen derselben |
US20090226696A1 (en) * | 2008-02-06 | 2009-09-10 | World Properties, Inc. | Conductive Polymer Foams, Method of Manufacture, And Uses Thereof |
US8623265B2 (en) * | 2007-02-06 | 2014-01-07 | World Properties, Inc. | Conductive polymer foams, method of manufacture, and articles thereof |
US7790597B2 (en) * | 2007-07-11 | 2010-09-07 | Texas Instruments Incorporated | Solder cap application process on copper bump using solder powder film |
TWI462676B (zh) | 2009-02-13 | 2014-11-21 | Senju Metal Industry Co | The solder bumps for the circuit substrate are formed using the transfer sheet |
WO2011082058A1 (en) * | 2009-12-29 | 2011-07-07 | Rogers Corporation | Conductive polymer foams, method of manufacture, and uses thereof |
DE102010002252A1 (de) * | 2010-02-23 | 2011-08-25 | JENOPTIK Laser GmbH, 07745 | Verfahren zum Aufbringen von Weichlot auf eine Montagefläche eines Bauelementes |
JP2011189390A (ja) * | 2010-03-16 | 2011-09-29 | shuan-sheng Wang | 鉄粉を含有する錫基の複合はんだ合金ボール、及び、それを利用したフリップチップのバンプ形成方法 |
US9027822B2 (en) | 2010-11-08 | 2015-05-12 | Panasonic Intellectual Property Management Co., Ltd. | Manufacturing method of solder transfer substrate, solder precoating method, and solder transfer substrate |
JP5647335B2 (ja) * | 2011-03-29 | 2014-12-24 | パナソニックIpマネジメント株式会社 | はんだ転写基材、はんだ転写基材の製造方法、及びはんだ転写方法 |
TWI612591B (zh) * | 2011-10-26 | 2018-01-21 | 日立化成股份有限公司 | 迴焊薄膜、焊料凸塊形成方法、焊料接合的形成方法及半導體裝置 |
JP2013093471A (ja) * | 2011-10-26 | 2013-05-16 | Hitachi Chemical Co Ltd | はんだプリコート及びその形成方法、並びにはんだプリコート付き基板 |
JP6009350B2 (ja) * | 2012-12-28 | 2016-10-19 | 花王株式会社 | 電子部品が接合した回路基板の製造方法 |
JP2013229635A (ja) * | 2013-08-01 | 2013-11-07 | Senju Metal Ind Co Ltd | はんだプリコート法 |
DE102016123180A1 (de) * | 2016-11-30 | 2018-05-30 | Gottfried Wilhelm Leibniz Universität Hannover | Verfahren zum Verbinden eines Halbleiterbauelements mit einem Gegenstück sowie Anordnung mit einem Halbleiterbauelement |
CN113948624B (zh) * | 2020-07-16 | 2023-10-24 | 重庆康佳光电技术研究院有限公司 | Led焊料涂布方法、发光装置和显示装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US4655382A (en) * | 1985-11-12 | 1987-04-07 | Raychem Corp. | Materials for use in forming electronic interconnect |
US4737112A (en) * | 1986-09-05 | 1988-04-12 | American Telephone And Telegraph Company, At&T Bell Laboratories | Anisotropically conductive composite medium |
US4820376A (en) * | 1987-11-05 | 1989-04-11 | American Telephone And Telegraph Company At&T Bell Laboratories | Fabrication of CPI layers |
US4902857A (en) * | 1988-12-27 | 1990-02-20 | American Telephone And Telegraph Company, At&T Bell Laboratories | Polymer interconnect structure |
JPH0695462B2 (ja) * | 1989-05-19 | 1994-11-24 | シャープ株式会社 | 電極上への導電性粒子の配置方法 |
US5323947A (en) * | 1993-05-03 | 1994-06-28 | Motorola, Inc. | Method and apparatus for use in forming pre-positioned solder bumps on a pad arrangement |
-
1994
- 1994-05-31 US US08/251,547 patent/US5591037A/en not_active Expired - Lifetime
- 1994-10-28 TW TW083109979A patent/TW267251B/zh not_active IP Right Cessation
-
1995
- 1995-05-24 ES ES95303496T patent/ES2149927T3/es not_active Expired - Lifetime
- 1995-05-24 EP EP95303496A patent/EP0685880B1/en not_active Expired - Lifetime
- 1995-05-24 DE DE69518120T patent/DE69518120T2/de not_active Expired - Fee Related
- 1995-05-31 JP JP13250195A patent/JP3946786B2/ja not_active Expired - Fee Related
- 1995-05-31 KR KR1019950014011A patent/KR950035551A/ko active IP Right Grant
-
2006
- 2006-12-26 JP JP2006349097A patent/JP4065457B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP3946786B2 (ja) | 2007-07-18 |
US5591037A (en) | 1997-01-07 |
JP2007110158A (ja) | 2007-04-26 |
DE69518120T2 (de) | 2000-12-21 |
ES2149927T3 (es) | 2000-11-16 |
JPH07336033A (ja) | 1995-12-22 |
JP4065457B2 (ja) | 2008-03-26 |
EP0685880B1 (en) | 2000-07-26 |
DE69518120D1 (de) | 2000-08-31 |
TW267251B (ko) | 1996-01-01 |
EP0685880A1 (en) | 1995-12-06 |
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