KR950035552A - 전자 디바이스 접속 방법 - Google Patents

전자 디바이스 접속 방법 Download PDF

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Publication number
KR950035552A
KR950035552A KR1019950014012A KR19950014012A KR950035552A KR 950035552 A KR950035552 A KR 950035552A KR 1019950014012 A KR1019950014012 A KR 1019950014012A KR 19950014012 A KR19950014012 A KR 19950014012A KR 950035552 A KR950035552 A KR 950035552A
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KR
South Korea
Prior art keywords
solder
electronic device
carrier sheet
contact pad
carrier
Prior art date
Application number
KR1019950014012A
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English (en)
Inventor
진 성호
토마스 맥코맥 마크
Original Assignee
글렌 이. 북스
에이 티 앤드 티 코포레이션
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Application filed by 글렌 이. 북스, 에이 티 앤드 티 코포레이션 filed Critical 글렌 이. 북스
Publication of KR950035552A publication Critical patent/KR950035552A/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y10T156/1093—All laminae planar and face to face with covering of discrete laminae with additional lamina

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

본 발명에 따라 하나 이상의 접촉 패드를 가진 전자 디바이스는 전송가능한 땜납 입자들의 배열을 지탱하는 캐리어 시트와 접촉하여 위치한다. 땜납이 접촉 패드에 부착하도록 열을 가하여 땜납은 접촉 패드에 선택적으로 전송된다. 양호한 실시예에 있어서, 땜납-이송 매체는 중합체 물질을 포함하며 땜납 입자들은 자성체로 조정된 땜납을 포함한다. 중합체를 가공하는 동안 자계를 걸어주면 땜납 코팅된 입자들이 규칙적으로 배열한다. 이 방법을 사용하여, 종래의 접촉 구조체 보다 더 작은 디바이스들이 용이하게 접속할 수 있다.

Description

전자 디바이스 접속 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 고밀도 접속 단계를 도시한 블럭도, 제2도는 전도 접촉 패드를 가진 전자 디바이스 개략도, 제3도는 제1도의 디바이스가 캐리어 매체상에 배치된 전송가능 땜납 입자 어레이와의 접촉에 대한 개략도, 제8도는 전자 디바이스와 맞상대 디바이스와의 접속에 대한 도시도, 제9도는 땜납을 매체로 이동시키는 한 방법에 대한 개략도.

Claims (10)

  1. 하나 이상의 전기적 접촉 패드를 가진 전자 디바이스를 제2의 디바이스에 접속하는 방법에 있어서, 하나 이상의 접촉 패드를 가진 상기 전자 디바이스를 제공하는 단계와:상기 디바이스를 캐리어 시트상에 전송가능하게 배치된 땜납 입자들의 배열에 부착하는 단계와:상기 부착된 땜납 입자들을 상기 접촉 패드에 전송하는 단계 및:상기 제2의 디바이스에 접촉하여 땜납-이송 패드를 위치시키는 단계를 포함하는 것을 특징으로 하는 전자 디바이스 접속 방법.
  2. 제1항에 있어서, 상기 땜납 입자들은 열을 가하여 상기 접촉 패드에 부착되는 것을 특징으로 하는 전자 디바이스 접속 방법.
  3. 제1항에 있어서, 상기 캐리어 시트는 유연성이 있으며 상기 부착된 땜납은 상기 전자 디바이스로부터 상기 캐리어 시트를 떼어냄으로써 전송되는 것을 특징으로 하는 전자 디바이스 접속 방법.
  4. 제1항에 있어서, 상기 캐리어 시트는 중합체 물질로 된 층을 포함하는 것을 특징으로 하는 전자 디바이스 접속 방법.
  5. 제1항에 있어서, 상기 땜납 입자들의 배열은 자성체로 코팅된 땜납의 어레이를 포함하는 것을 특징으로 하는 전자 디바이스 접속 방법.
  6. 전기적 접촉 패드의 표면에 땜납을 적용하기 위한 땜납-이송 캐리어 시트에 있어서, 유연성 있는 캐리어 매체 시트:및 상기 캐리어 매체에 부착되어 있으며 또한 상기 캐리어 매체의 표면으로부터 돌출한 땜납 입자들의 배열을 포함하는 것을 특징으로 하는 땜납-이송 캐리어 시트.
  7. 제6항에 있어서, 상기 유연성 있는 캐리어 매체의 층은 상기 땜납 입자들이 부분적으로 심어진 중합체 물질의 층을 포함하는 것을 특징으로 하는 땜납-이송 캐리어 시트.
  8. 제6항에 있어서, 상기 땜납 입자들은 땜납으로 코팅된 자성체를 포함하는 것을 특징으로 하는 땜납-이송 캐리어 시트.
  9. 제6항에 있어서, 상기 유연성 있는 캐리어 매체 층에 부착된 지지층을 더 포함하는 것을 특징으로 하는 땜납-이송 캐리어 시트.
  10. 제1항, 2항, 3항, 4항 또는 5항의 공정에 따라 하나 이상의 전기적 접촉 패드를 가진 전자 디바이스를 제2의 디바이스에 접속되는 것을 특징으로 하는 전자 디바이스.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950014012A 1994-05-31 1995-05-31 전자 디바이스 접속 방법 KR950035552A (ko)

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EP0685879A1 (en) 1995-12-06
TW250620B (en) 1995-07-01
US5846366A (en) 1998-12-08

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