DE60107519D1 - Anisotropisches leitfähiges Verbindungsblatt, Herstellungsverfahren dafür und Produkt davon - Google Patents

Anisotropisches leitfähiges Verbindungsblatt, Herstellungsverfahren dafür und Produkt davon

Info

Publication number
DE60107519D1
DE60107519D1 DE60107519T DE60107519T DE60107519D1 DE 60107519 D1 DE60107519 D1 DE 60107519D1 DE 60107519 T DE60107519 T DE 60107519T DE 60107519 T DE60107519 T DE 60107519T DE 60107519 D1 DE60107519 D1 DE 60107519D1
Authority
DE
Germany
Prior art keywords
layer
conductive particles
lubricant
sheet
production process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60107519T
Other languages
English (en)
Other versions
DE60107519T2 (de
Inventor
Kiyoshi Kimura
Sugiro Shimoda
Naoshi Yasudo
Daisuke Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Application granted granted Critical
Publication of DE60107519D1 publication Critical patent/DE60107519D1/de
Publication of DE60107519T2 publication Critical patent/DE60107519T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49204Contact or terminal manufacturing
    • Y10T29/49208Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49222Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
DE60107519T 2000-09-25 2001-09-24 Anisotropisches leitfähiges Verbindungsblatt, Herstellungsverfahren dafür und Produkt davon Expired - Lifetime DE60107519T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000289804 2000-09-25
JP2000289804 2000-09-25

Publications (2)

Publication Number Publication Date
DE60107519D1 true DE60107519D1 (de) 2005-01-05
DE60107519T2 DE60107519T2 (de) 2005-12-15

Family

ID=18773137

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60107519T Expired - Lifetime DE60107519T2 (de) 2000-09-25 2001-09-24 Anisotropisches leitfähiges Verbindungsblatt, Herstellungsverfahren dafür und Produkt davon

Country Status (7)

Country Link
US (1) US6720787B2 (de)
EP (1) EP1195860B1 (de)
KR (1) KR100509526B1 (de)
CN (1) CN1296717C (de)
AT (1) ATE284083T1 (de)
DE (1) DE60107519T2 (de)
TW (1) TW515890B (de)

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CN100413151C (zh) * 2003-11-17 2008-08-20 Jsr株式会社 各向异性导电性片以及其制造方法和其应用制品
KR100658012B1 (ko) * 2003-12-18 2006-12-15 제이에스알 가부시끼가이샤 이방 도전성 커넥터 및 회로 장치의 검사 방법
WO2005060719A2 (en) * 2003-12-18 2005-07-07 Lecroy Corporation Resistive probe tips
US20060177971A1 (en) * 2004-01-13 2006-08-10 Jsr Corporation Anisotropically conductive connector, production process thereof and application product thereof
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JP4767147B2 (ja) * 2005-11-16 2011-09-07 パナソニック株式会社 検査装置および検査方法
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JP2007207530A (ja) * 2006-01-31 2007-08-16 Toshiba Corp 異方性導電膜及びこれを用いたx線平面検出器、赤外線平面検出器及び表示装置
DE102006059429A1 (de) * 2006-12-15 2008-06-26 Atg Luther & Maelzer Gmbh Modul für eine Prüfvorrichtung zum Testen von Leiterplatten
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WO2010125605A1 (ja) * 2009-04-28 2010-11-04 株式会社アドバンテスト 配線基板ユニットおよび試験装置
US8870579B1 (en) * 2011-01-14 2014-10-28 Paricon Technologies Corporation Thermally and electrically enhanced elastomeric conductive materials
US9176167B1 (en) * 2011-08-21 2015-11-03 Bruker Nano Inc. Probe and method of manufacture for semiconductor wafer characterization
US9442133B1 (en) * 2011-08-21 2016-09-13 Bruker Nano Inc. Edge electrode for characterization of semiconductor wafers
KR101266124B1 (ko) * 2012-04-03 2013-05-27 주식회사 아이에스시 고밀도 도전부를 가지는 테스트용 소켓 및 그 제조방법
US20130319759A1 (en) * 2012-05-31 2013-12-05 General Electric Company Fine-pitch flexible wiring
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US10356902B2 (en) * 2015-12-26 2019-07-16 Intel Corporation Board to board interconnect
KR101959536B1 (ko) * 2016-04-05 2019-03-18 주식회사 아이에스시 이종의 입자가 혼합된 도전성 입자를 포함하는 이방도전성 시트
TWI778971B (zh) * 2016-08-08 2022-10-01 日商積水化學工業股份有限公司 導通檢查裝置用構件及導通檢查裝置
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KR102364013B1 (ko) * 2016-12-07 2022-02-16 웨이퍼 엘엘씨 저손실 전기 전송 메커니즘과 이를 이용한 안테나
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Also Published As

Publication number Publication date
US6720787B2 (en) 2004-04-13
DE60107519T2 (de) 2005-12-15
EP1195860A1 (de) 2002-04-10
KR100509526B1 (ko) 2005-08-23
CN1349101A (zh) 2002-05-15
EP1195860B1 (de) 2004-12-01
CN1296717C (zh) 2007-01-24
US20020060583A1 (en) 2002-05-23
ATE284083T1 (de) 2004-12-15
TW515890B (en) 2003-01-01
KR20020024540A (ko) 2002-03-30

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