KR910700541A - 고밀도 솔더 범프 및 고밀도 솔더 범프용 기판 소켓 제조방법 - Google Patents

고밀도 솔더 범프 및 고밀도 솔더 범프용 기판 소켓 제조방법

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KR910700541A
KR910700541A KR1019900701936A KR900701936A KR910700541A KR 910700541 A KR910700541 A KR 910700541A KR 1019900701936 A KR1019900701936 A KR 1019900701936A KR 900701936 A KR900701936 A KR 900701936A KR 910700541 A KR910700541 A KR 910700541A
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solder
substrate
resist
paste
wells
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KR1019900701936A
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KR940000747B1 (ko
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에프. 앨트맨 레너드
엘. 플루거 질
비. 슈플사 앤쏘니
비. 멀린 3세 윌리암
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빈센트 죠셉 로너
모토로라 인코포레이티드
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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Abstract

내용 없음.

Description

고밀도 솔더 범프 및 고밀도 솔더 범프용 기판 소켓 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 금속화된 패드를 갖는 기판 어레이의 평면도이다.
제2도는 솔더 페이스트를 인가한 후 기판 어레이의 평면도이다.
제3도는 한정되지 않는 솔더 레지스트로 덮혀진 기판의 단면도이다.

Claims (9)

  1. 기판상에 레지스트의 얇은 층을 인가하는 단계와, 기판의 솔더 패드에서 웰을 제공하도록 레지스트를 선택적으로 제거하는 단계와, 패드상에서 솔더 범프를 형성하도록 솔더를 인가하는 단계를 구비하는 솔더 범프 형성 방법.
  2. 제1항에 있어서, 솔더 범프를 형성한후 나머지 레지스트를 제거하는 단계를 구비하는 솔더 범프 형성방법.
  3. 제1항에 있어서, 솔더를 인가하는 단계는, 웰의 기판에 솔더 페이스트를 인가하는 단계와, 솔더 범프를 형성하도록 솔더 페이스트를 리플로우 하는 단계를 구비하는 솔더 범프 형성 방법.
  4. 제3항에 있어서, 솔더 페이스트는 압착에 의해 기판에 인가되는 솔더 범프 형성 방법.
  5. 제1항에 있어서, 웰은 솔더 패드보다 조금 크게 형성되는 솔더 범프 형성방법.
  6. 제1항에 있어서, 솔더 페이스트의 층은 최소한 10mils, 두게인 솔더 범프 형성방법.
  7. 제1항에 있어서, 레지스트 층은 대략 15mils, 두께인 솔더 범프 형성방법.
  8. 솔더 범프된 부재를 기판에 부착시키는 방법에 있어서, 부재의 솔더 범프에 대응하는 금속화된 패드를 갖는 기판을 제공하는 단계와, 기판에 레지스트의 두꺼운 층을 인가하는 단계와, 기판의 금속화된 패드에서 웰을 제공하도록 레지스트를 선택적으로 제거하는 단계와, 웰에서 솔더 페이스트를 침전시키는 단계와, 솔더 범프가 웰에 있도록 부재를 위치시키는 단계와, 솔더 범프와 금속화된 패드를 리플로우하여 결합하도록 솔더 페이스트를 가열하는 단계를 구비하는 솔더 범프윈 부재부착방법.
  9. 제8항에 있어서, 상기 솔더 페이스트는 솔더 범프의 온도보다 낮은 용융온도를 갖도록 선택되며, 가열 단계동안, 솔더 페이스트는 솔더 범프의 용융온도 보다 낮은 온도로 가열되는 솔더 범프된 부재 부착방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900701936A 1989-01-03 1989-12-15 고밀도 솔더범프 형성 및 솔더범프된 부재 부착방법 KR940000747B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US29298889A 1989-01-03 1989-01-03
US292,988 1989-01-03
PCT/US1989/005528 WO1990007792A1 (en) 1989-01-03 1989-12-15 Method of making high density solder bumps and a substrate socket for high density solder bumps

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KR910700541A true KR910700541A (ko) 1991-03-15
KR940000747B1 KR940000747B1 (ko) 1994-01-28

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EP (1) EP0403631B1 (ko)
JP (2) JPH03504064A (ko)
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AT (1) ATE126395T1 (ko)
DE (1) DE68923790T2 (ko)
WO (1) WO1990007792A1 (ko)

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US5611140A (en) * 1989-12-18 1997-03-18 Epoxy Technology, Inc. Method of forming electrically conductive polymer interconnects on electrical substrates
US5060844A (en) * 1990-07-18 1991-10-29 International Business Machines Corporation Interconnection structure and test method
ZA915965B (en) * 1990-07-30 1992-04-29 South Africa Ind Dev Corp Attaching integrated circuits to circuit boards
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Publication number Publication date
EP0403631B1 (en) 1995-08-09
JPH0666358B2 (ja) 1994-08-24
KR940000747B1 (ko) 1994-01-28
DE68923790D1 (de) 1995-09-14
JPH03504064A (ja) 1991-09-05
ATE126395T1 (de) 1995-08-15
DE68923790T2 (de) 1996-05-15
EP0403631A1 (en) 1990-12-27
EP0403631A4 (en) 1992-01-02
JPH03501611A (ja) 1991-04-11
WO1990007792A1 (en) 1990-07-12

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