ES2149927T3 - Metodo para interconectar un dispositivo electronico utilizando un medio portador de soldadura, retirable. - Google Patents
Metodo para interconectar un dispositivo electronico utilizando un medio portador de soldadura, retirable.Info
- Publication number
- ES2149927T3 ES2149927T3 ES95303496T ES95303496T ES2149927T3 ES 2149927 T3 ES2149927 T3 ES 2149927T3 ES 95303496 T ES95303496 T ES 95303496T ES 95303496 T ES95303496 T ES 95303496T ES 2149927 T3 ES2149927 T3 ES 2149927T3
- Authority
- ES
- Spain
- Prior art keywords
- welding
- electronic device
- interconnect
- particles
- contact pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003466 welding Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 239000002245 particle Substances 0.000 abstract 3
- 238000004090 dissolution Methods 0.000 abstract 1
- 239000000696 magnetic material Substances 0.000 abstract 1
- 239000006249 magnetic particle Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
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- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
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- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L2224/81801—Soldering or alloying
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0218—Composite particles, i.e. first metal coated with second metal
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0425—Solder powder or solder coated metal powder
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
SEGUN LA INVENCION, SE ADHIERE UN DISPOSITIVO ELECTRONICO (9) QUE TIENE UNA O MAS ALMOHADILLAS DE CONTACTO (12) A UNA RED DE PARTICULAS DE SOLDADURA TRANSFERIBLES (31) QUE HAY SOBRE UNA LAMINA DE SOPORTE RETIRABLE (32). EL SOPORTE SE RETIRA, MEDIANTE DISOLUCION, POR EJEMPLO, DEJANDO LA SOLDADURA SELECTIVAMENTE ADHERIDA A LAS ALMOHADILLAS DE CONTACTO. EN UN ASPECTO PREFERENTE DE LA INVENCION, EL MEDIO DE SOPORTE DE LA SOLDADURA ES SOLUBLE EN AGUA Y LAS PARTICULAS DE SOLDADURA CONTIENEN UNAS PARTICULAS MAGNETICAS REVESTIDAS CON UNA SOLDADURA. LA APLICACION DE UN MATERIAL MAGNETICO MIENTRAS EL MEDIO SE SECA O SE CURA, HACE QUE SE PRODUZCA UNA RED REGULAR DE LAS PARTICULAS REVESTIDAS CON LA SOLDADURA. MEDIANTE LA UTILIZACION DE ESTE METODO, SE PUEDEN INTERCONECTAR FACILMENTE DISPOSITIVO QUE TIENEN UNAS ESTRUCTURAS DE CONTACTO MAS PEQUEÑAS DE LO NORMAL.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/251,547 US5591037A (en) | 1994-05-31 | 1994-05-31 | Method for interconnecting an electronic device using a removable solder carrying medium |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2149927T3 true ES2149927T3 (es) | 2000-11-16 |
Family
ID=22952433
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES95303496T Expired - Lifetime ES2149927T3 (es) | 1994-05-31 | 1995-05-24 | Metodo para interconectar un dispositivo electronico utilizando un medio portador de soldadura, retirable. |
Country Status (7)
Country | Link |
---|---|
US (1) | US5591037A (es) |
EP (1) | EP0685880B1 (es) |
JP (2) | JP3946786B2 (es) |
KR (1) | KR950035551A (es) |
DE (1) | DE69518120T2 (es) |
ES (1) | ES2149927T3 (es) |
TW (1) | TW267251B (es) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6099935A (en) * | 1995-12-15 | 2000-08-08 | International Business Machines Corporation | Apparatus for providing solder interconnections to semiconductor and electronic packaging devices |
KR100542552B1 (ko) * | 2003-08-21 | 2006-01-11 | 삼성전자주식회사 | 인쇄회로기판, 및 이 인쇄회로기판을 갖는 화상기록장치 |
US20050221635A1 (en) | 2004-03-30 | 2005-10-06 | International Business Machines Corporation | Micro-bumps to enhance lga interconnections |
DE102004025279B4 (de) * | 2004-05-19 | 2011-04-28 | Infineon Technologies Ag | Anlage für ein Bestücken von Substraten mit Kugelkontakten und Verfahren zum Bestücken von Substraten mit Kugelkontakten |
US9821397B2 (en) | 2004-12-20 | 2017-11-21 | Senju Metal Industry Co., Ltd. | Solder precoating method and workpiece for electronic equipment |
US20090226696A1 (en) * | 2008-02-06 | 2009-09-10 | World Properties, Inc. | Conductive Polymer Foams, Method of Manufacture, And Uses Thereof |
US8623265B2 (en) * | 2007-02-06 | 2014-01-07 | World Properties, Inc. | Conductive polymer foams, method of manufacture, and articles thereof |
JP2010518227A (ja) * | 2007-02-06 | 2010-05-27 | ワールド プラパティーズ、 インコーポレイテッド | 導電性ポリマー発泡体、その作製方法、およびその使用 |
US7790597B2 (en) * | 2007-07-11 | 2010-09-07 | Texas Instruments Incorporated | Solder cap application process on copper bump using solder powder film |
TWI462676B (zh) * | 2009-02-13 | 2014-11-21 | Senju Metal Industry Co | The solder bumps for the circuit substrate are formed using the transfer sheet |
CN102686652A (zh) * | 2009-12-29 | 2012-09-19 | 罗杰斯公司 | 导电聚合物泡沫、其制造方法及其用途 |
DE102010002252A1 (de) * | 2010-02-23 | 2011-08-25 | JENOPTIK Laser GmbH, 07745 | Verfahren zum Aufbringen von Weichlot auf eine Montagefläche eines Bauelementes |
JP2011189390A (ja) * | 2010-03-16 | 2011-09-29 | shuan-sheng Wang | 鉄粉を含有する錫基の複合はんだ合金ボール、及び、それを利用したフリップチップのバンプ形成方法 |
CN103180079B (zh) | 2010-11-08 | 2016-03-30 | 松下知识产权经营株式会社 | 焊料转印基材的制造方法、焊料预涂方法、及焊料转印基材 |
US9238278B2 (en) * | 2011-03-29 | 2016-01-19 | Panasonic Intellectual Property Management Co., Ltd. | Solder transfer substrate, manufacturing method of solder transfer substrate, and solder transfer method |
JP2013093471A (ja) * | 2011-10-26 | 2013-05-16 | Hitachi Chemical Co Ltd | はんだプリコート及びその形成方法、並びにはんだプリコート付き基板 |
US9656353B2 (en) * | 2011-10-26 | 2017-05-23 | Hitachi Chemical Company, Ltd. | Reflow film, solder bump formation method, solder joint formation method, and semiconductor device |
JP6009350B2 (ja) * | 2012-12-28 | 2016-10-19 | 花王株式会社 | 電子部品が接合した回路基板の製造方法 |
JP2013229635A (ja) * | 2013-08-01 | 2013-11-07 | Senju Metal Ind Co Ltd | はんだプリコート法 |
DE102016123180A1 (de) * | 2016-11-30 | 2018-05-30 | Gottfried Wilhelm Leibniz Universität Hannover | Verfahren zum Verbinden eines Halbleiterbauelements mit einem Gegenstück sowie Anordnung mit einem Halbleiterbauelement |
CN113948624B (zh) * | 2020-07-16 | 2023-10-24 | 重庆康佳光电技术研究院有限公司 | Led焊料涂布方法、发光装置和显示装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4655382A (en) * | 1985-11-12 | 1987-04-07 | Raychem Corp. | Materials for use in forming electronic interconnect |
US4737112A (en) * | 1986-09-05 | 1988-04-12 | American Telephone And Telegraph Company, At&T Bell Laboratories | Anisotropically conductive composite medium |
US4820376A (en) * | 1987-11-05 | 1989-04-11 | American Telephone And Telegraph Company At&T Bell Laboratories | Fabrication of CPI layers |
US4902857A (en) * | 1988-12-27 | 1990-02-20 | American Telephone And Telegraph Company, At&T Bell Laboratories | Polymer interconnect structure |
JPH0695462B2 (ja) * | 1989-05-19 | 1994-11-24 | シャープ株式会社 | 電極上への導電性粒子の配置方法 |
US5323947A (en) * | 1993-05-03 | 1994-06-28 | Motorola, Inc. | Method and apparatus for use in forming pre-positioned solder bumps on a pad arrangement |
-
1994
- 1994-05-31 US US08/251,547 patent/US5591037A/en not_active Expired - Lifetime
- 1994-10-28 TW TW083109979A patent/TW267251B/zh not_active IP Right Cessation
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1995
- 1995-05-24 DE DE69518120T patent/DE69518120T2/de not_active Expired - Fee Related
- 1995-05-24 EP EP95303496A patent/EP0685880B1/en not_active Expired - Lifetime
- 1995-05-24 ES ES95303496T patent/ES2149927T3/es not_active Expired - Lifetime
- 1995-05-31 JP JP13250195A patent/JP3946786B2/ja not_active Expired - Fee Related
- 1995-05-31 KR KR1019950014011A patent/KR950035551A/ko active IP Right Grant
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2006
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KR950035551A (ko) | 1995-12-30 |
JP2007110158A (ja) | 2007-04-26 |
DE69518120T2 (de) | 2000-12-21 |
EP0685880B1 (en) | 2000-07-26 |
JPH07336033A (ja) | 1995-12-22 |
TW267251B (es) | 1996-01-01 |
DE69518120D1 (de) | 2000-08-31 |
JP3946786B2 (ja) | 2007-07-18 |
EP0685880A1 (en) | 1995-12-06 |
US5591037A (en) | 1997-01-07 |
JP4065457B2 (ja) | 2008-03-26 |
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