KR890013973A - 다이 접합재 픽업 공구 - Google Patents
다이 접합재 픽업 공구 Download PDFInfo
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- KR890013973A KR890013973A KR1019880011243A KR880011243A KR890013973A KR 890013973 A KR890013973 A KR 890013973A KR 1019880011243 A KR1019880011243 A KR 1019880011243A KR 880011243 A KR880011243 A KR 880011243A KR 890013973 A KR890013973 A KR 890013973A
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- H01L23/495—Lead-frames or other flat leads
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Abstract
내용 없음.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 비교적 비 가요성 리본의 패드를 배치하는 종래의 다이 접한체 픽업(pickup) 공구를 보이는 도면 ;
제2도는 접합소에 부착되는 공정에서 그 접합소와 집적 회로 칩 위로 가용성 리본 접합재의 패드를 배치하는 이 발명의 다이 접합재 픽업 공구의 개략 사시도.
Claims (26)
- 제1 표면이 있는 가요성 다이 접합제를 픽업하여 그 다이 접합재를 거의 평탄한 위치로배치하는 다이 접합재 픽업 공구로서, 상기 다이 접합재의 상기 제1 표면과 닿고, 적어도 상기 제1 표면만큼 큰 제2 표면과 구멍이 있는 면 ; 과 진공원에 연결되도록 상기 구멍에 연결되어 있는 통로 수단 ; 으로 구성되는 다이 접합재 픽업 공구.
- 제1항에 있어서, 상기 제2 표면은 적어도약 1.27㎟인 다이 접합재 픽업 공구.
- 제1항에 있어서, 상기구멍의 원형단면은 직경이 약 0.254-0.900㎜범위내인 다이 접합재 픽업 공구.
- 제1항에 있어서,상기 제2 표면이 2.54㎟보다 더 큰 상기 면에는 약 2.54㎟마다 다른 구멍이 더 있고, 상기 각 다른 구멍은 상기 통로 수단에 연결되는 다이 접합재 픽업 공구.
- 제4항에 있어서, 상기 면에는 구멍들이 여러개 있고, 상기 각 구멍의 원형 단면은 직경이 약 0.254-0.900㎜범위내인 다이 접합재 픽업 공구.
- 제5항에 있어서, 상기 구멍들은 서로 그리고 상기 면의 연부들에서 이격되어 있는 다이 접합재 픽업 공구.
- 제1항에 있어서, 상기 면이 평탄한 다이 접합재 픽업 공구.
- 제1항에 있어서, 상기 면이 블록한 다이 접합재 픽업 공구.
- 제1항에 있어서, 상기 면이 다공성 재료로 되어있는 다이 접합재 픽업 공구.
- 제1항에 있어서, 상기 면에는, 다이 접합재를 픽업할때 공구를 용이하게 위치시키기 위한 연부가 있는 다이 접합재 픽업 공구.
- 제1항에 있어서, 상기 통로 수단의 단면적은 상기 구멍의 단면적보다 더 큰 다이 접합재 픽업 공구.
- 제1항에 있어서, 상기 가요성 다이 접합재는 23℃에서 약 500-7,500N/mm2범위내의 탄성율을 갖는 다이 접합재 픽업 공구.
- 제1항에 있어서, 상기 가요성 다이 접합재는 약 25-125㎛범위내의 두께를 갖는 다이 접합재 픽업 공구.
- 제1 표면이 있는 가요성 다이 접합재를 절단부에서 픽업해서 그 다이 접합재를 접합소로 이송하여 그 위에 배치하는 다이 접합재 픽업 공구로서, 상기 다이 접합재와 닿고, 적어도 약 1.27mm2의 제2 표면과 구멍이 있는 면 ; 과 진공원에 연결되도록 상기 구멍에 연결되어있는 통로수단 ; 으로 구성되어 있어, 상기 제1 표면의 각 지점이 상기 제2 표면의 한 지점과 닿아 있거나 상기 구멍에 인접하여 있을때, 상기 진공원이 작동되면 공구가 상기 다이 접합재를 픽업하여 이송하도록 되어 있고, 상기 진공원이 정지되면 공구가 상기 다이 접합재를 모두 거의 평탄한 위치로 배치하도록 되어있는 다이 접합재 픽업 공구.
- 제14항에 있어서, 상기 구멍은 원형 단명이 약 0.254-0.900㎜범위내인 다이 접합재 픽업 공구.
- 제15항에 있어서,상기 제2 표면이 2.54mm2보다 더 큰 상기 면에는 약 2.54mm2마다 다른 구멍이 더 있고, 상기 각 다른 구멍은 상기 통로 수단에 연결되어 있는 다이 접합재 픽업 공구.
- 제16항에 있어서, 상기 면에는 상기 구멍들이 여러개 있고, 상기 각 구멍의 원형 단면은 직경이 약 0.254-0.900㎜범위내인 다이 접합재 픽업 공구.
- 제17항에 있어서, 상기 구멍들은 서로 그리고 상기 면의 연부들에서 이격되어 있는 다이 접합재 픽업 공구.
- 제15항에 있어서, 상기 면이 평탄한 다이 접합재 픽업 공구.
- 제15항에 있어서, 상기 면이 블록한 다이 접합재 픽업 공구.
- 제15항에 있어서, 상기 면이 다공성 재료로 되어 있느 다이 접합재 픽업 공구.
- 제15항에 있어서, 상기 면에는, 상기 다이 접합재를 픽업할때 공구를 용이하게 위치시키기 위한 연부가 있는 다이 접합재 픽업 공구.
- 제15항에 있어서, 상기 통로 수단의 단면적은 상기 구멍의 단면적보다 더 큰 다이 접합재 픽업 공구.
- 진공원에 연결되는 단부 부위 ; 상기 단부 부위에 연결되어있고, 가요성 리본 패드를 거의 평탄하게 유지하면서 다시 배치하는 수단이 있는 머리 부위 ; 및 상기 단부 부위와 상기 재배치 수단을 포함하는 상기 머리 부위를 통하여 진공을 제공하는 공기 통로 ; 로 구성되는 가요성 리본 패드를 재배치하는 장치.
- 제24항에 있어서, 상기 가요성 리본은 23℃에서 약 500-7,500N/mm2범위내의 탄성율을 갖는 장치.
- 제24항에 있어서, 상기 가요성 리본은 약 25-125㎛범위내의 두께를 갖는 장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US158,729 | 1988-02-22 | ||
US07/158,729 US4875279A (en) | 1987-08-21 | 1988-02-22 | Die attach pickup tools |
Publications (1)
Publication Number | Publication Date |
---|---|
KR890013973A true KR890013973A (ko) | 1989-09-26 |
Family
ID=22569435
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880011243A KR890013973A (ko) | 1988-02-22 | 1988-08-31 | 다이 접합재 픽업 공구 |
Country Status (5)
Country | Link |
---|---|
US (1) | US4875279A (ko) |
EP (1) | EP0329823A3 (ko) |
JP (1) | JPH01235339A (ko) |
KR (1) | KR890013973A (ko) |
CA (1) | CA1289990C (ko) |
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TW310481B (ko) * | 1995-07-06 | 1997-07-11 | Hitachi Chemical Co Ltd | |
US6717242B2 (en) | 1995-07-06 | 2004-04-06 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
US6099678A (en) * | 1995-12-26 | 2000-08-08 | Hitachi Chemical Company Ltd. | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device |
US5882471A (en) * | 1996-01-31 | 1999-03-16 | Chandler; Johnny C. | Vacuum connector apparatus for retreading tires |
DE19610112C2 (de) * | 1996-03-14 | 2000-04-06 | Tech Gmbh Antriebstechnik Und | Verfahren zum Auflöten von Halbleiterchips |
US6152506A (en) | 1997-07-22 | 2000-11-28 | Matsushita Electric Industrial Co., Ltd. | Nozzle block of electronic part suction holding nozzle |
KR100236487B1 (ko) * | 1997-10-22 | 2000-01-15 | 윤종용 | 정전기 방전 불량을 방지하기 위한 분할형 칩 흡착수단을구비하는 칩 접착 장치 |
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-
1988
- 1988-02-22 US US07/158,729 patent/US4875279A/en not_active Expired - Fee Related
- 1988-08-31 KR KR1019880011243A patent/KR890013973A/ko not_active Application Discontinuation
- 1988-09-01 JP JP63216446A patent/JPH01235339A/ja active Pending
- 1988-09-01 EP EP19880114252 patent/EP0329823A3/en not_active Withdrawn
- 1988-09-01 CA CA000576314A patent/CA1289990C/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CA1289990C (en) | 1991-10-01 |
JPH01235339A (ja) | 1989-09-20 |
EP0329823A3 (en) | 1991-03-20 |
US4875279A (en) | 1989-10-24 |
EP0329823A2 (en) | 1989-08-30 |
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