JPS5310274A - Suction apparatus of thin metal plates - Google Patents

Suction apparatus of thin metal plates

Info

Publication number
JPS5310274A
JPS5310274A JP8528676A JP8528676A JPS5310274A JP S5310274 A JPS5310274 A JP S5310274A JP 8528676 A JP8528676 A JP 8528676A JP 8528676 A JP8528676 A JP 8528676A JP S5310274 A JPS5310274 A JP S5310274A
Authority
JP
Japan
Prior art keywords
thin metal
metal plates
suction apparatus
metal plate
vacuum suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8528676A
Other languages
Japanese (ja)
Inventor
Hiroyuki Fujii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP8528676A priority Critical patent/JPS5310274A/en
Publication of JPS5310274A publication Critical patent/JPS5310274A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prevent the occurrence of deformation in a thin metal plate at the time of its vacuum suction by flattening the bottom surface of a bottomed cylindrical body, providing a plurality of fine holes therein, connecting the opening ends to a vacuum suction line and sucking the thin metal plate disposed under the bottom.
COPYRIGHT: (C)1978,JPO&Japio
JP8528676A 1976-07-16 1976-07-16 Suction apparatus of thin metal plates Pending JPS5310274A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8528676A JPS5310274A (en) 1976-07-16 1976-07-16 Suction apparatus of thin metal plates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8528676A JPS5310274A (en) 1976-07-16 1976-07-16 Suction apparatus of thin metal plates

Publications (1)

Publication Number Publication Date
JPS5310274A true JPS5310274A (en) 1978-01-30

Family

ID=13854318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8528676A Pending JPS5310274A (en) 1976-07-16 1976-07-16 Suction apparatus of thin metal plates

Country Status (1)

Country Link
JP (1) JPS5310274A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59117145U (en) * 1983-01-26 1984-08-07 新日本無線株式会社 Collection for transporting semiconductor chips
JPS59171341U (en) * 1983-04-30 1984-11-16 株式会社東芝 mounting device
JPS61288710A (en) * 1985-06-14 1986-12-18 プラス プラグス リミテツド Wire stripper
JPH01235339A (en) * 1988-02-22 1989-09-20 E I Du Pont De Nemours & Co Pick-up tool for die-bonding adhesive

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4425209Y1 (en) * 1966-10-22 1969-10-23
JPS509891U (en) * 1973-05-24 1975-01-31
JPS5112781U (en) * 1974-07-09 1976-01-30

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4425209Y1 (en) * 1966-10-22 1969-10-23
JPS509891U (en) * 1973-05-24 1975-01-31
JPS5112781U (en) * 1974-07-09 1976-01-30

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59117145U (en) * 1983-01-26 1984-08-07 新日本無線株式会社 Collection for transporting semiconductor chips
JPS59171341U (en) * 1983-04-30 1984-11-16 株式会社東芝 mounting device
JPS61288710A (en) * 1985-06-14 1986-12-18 プラス プラグス リミテツド Wire stripper
JPH01235339A (en) * 1988-02-22 1989-09-20 E I Du Pont De Nemours & Co Pick-up tool for die-bonding adhesive

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