ATE236788T1 - Strukturierte trennfolie zwischen zwei laminierten oberflächen - Google Patents
Strukturierte trennfolie zwischen zwei laminierten oberflächenInfo
- Publication number
- ATE236788T1 ATE236788T1 AT00965566T AT00965566T ATE236788T1 AT E236788 T1 ATE236788 T1 AT E236788T1 AT 00965566 T AT00965566 T AT 00965566T AT 00965566 T AT00965566 T AT 00965566T AT E236788 T1 ATE236788 T1 AT E236788T1
- Authority
- AT
- Austria
- Prior art keywords
- substrate
- release material
- covered
- substrates
- release film
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 12
- 239000000463 material Substances 0.000 abstract 6
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0076—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised in that the layers are not bonded on the totality of their surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
- B32B2315/02—Ceramics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
- B32B2379/08—Polyimides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1056—Perforating lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
- Y10T156/1064—Partial cutting [e.g., grooving or incising]
Landscapes
- Laminated Bodies (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Coils Or Transformers For Communication (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14588999P | 1999-07-27 | 1999-07-27 | |
| PCT/US2000/040487 WO2001007247A1 (en) | 1999-07-27 | 2000-07-26 | Patterned release film between two laminated surfaces |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE236788T1 true ATE236788T1 (de) | 2003-04-15 |
Family
ID=22514993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT00965566T ATE236788T1 (de) | 1999-07-27 | 2000-07-26 | Strukturierte trennfolie zwischen zwei laminierten oberflächen |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6627034B1 (de) |
| EP (1) | EP1202859B1 (de) |
| AT (1) | ATE236788T1 (de) |
| AU (1) | AU7626500A (de) |
| CA (1) | CA2380093A1 (de) |
| DE (1) | DE60002090T2 (de) |
| WO (1) | WO2001007247A1 (de) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4907839B2 (ja) * | 2003-03-26 | 2012-04-04 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| KR100632510B1 (ko) * | 2004-04-30 | 2006-10-09 | 엘지전자 주식회사 | 와이어 그리드 편광자 및 그 제조 방법 |
| US20070046149A1 (en) * | 2005-08-23 | 2007-03-01 | Zipparo Michael J | Ultrasound probe transducer assembly and production method |
| JP5042297B2 (ja) * | 2009-12-10 | 2012-10-03 | 日東電工株式会社 | 半導体装置の製造方法 |
| BR112015010690B1 (pt) * | 2012-11-09 | 2021-05-11 | Dsm Ip Assets B.V | partes compósitas flexíveis em formato tridimensional e método de produção dessas partes |
| CN109940959A (zh) | 2013-03-13 | 2019-06-28 | 帝斯曼知识产权资产管理有限公司 | 柔性复合材料体系和方法 |
| CA2906068C (en) | 2013-03-13 | 2021-11-09 | Dsm Ip Assets B.V. | Systems and method for producing three-dimensional articles from flexible composite materials |
| US9789662B2 (en) | 2013-03-13 | 2017-10-17 | Cubic Tech Corporation | Engineered composite systems |
| EP3242796B1 (de) | 2015-01-09 | 2020-08-12 | DSM IP Assets B.V. | Leichte laminate und plattenträgerwesten sowie andere fertigungsartikel daraus |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3523050A (en) * | 1967-03-10 | 1970-08-04 | Polaroid Corp | Process for preparing envelope structures |
| US3616121A (en) * | 1969-07-23 | 1971-10-26 | Addressograph Multigraph | Composite identification card |
| US3829342A (en) * | 1970-05-18 | 1974-08-13 | Gen Motors Corp | Laminated liquid pump and method of making same |
| GB1362952A (en) | 1970-07-21 | 1974-08-07 | Rasmussen O B | Conjugate fibre and method of manufacturing same |
| US4087578A (en) * | 1973-05-16 | 1978-05-02 | Bayer Aktiengesellschaft | Heat sealable sheet materials |
| US4288275A (en) * | 1979-05-14 | 1981-09-08 | Davis Jesse B | Roll leaf coating apparatus |
| US4426253A (en) | 1981-12-03 | 1984-01-17 | E. I. Du Pont De Nemours & Co. | High speed etching of polyimide film |
| JPS58163373A (ja) * | 1982-03-24 | 1983-09-28 | テルモ株式会社 | 医療用バツグおよびその製造方法 |
| IT1163598B (it) * | 1983-06-24 | 1987-04-08 | Cga Comp Gen Allumino Spa | Metodo per ottenere condotti mediante gonfiaggio di pannelli in lamiera metallica in due strati |
| US4681928A (en) * | 1984-06-01 | 1987-07-21 | M&T Chemicals Inc. | Poly(amide-amide acid), polyamide acid, poly(esteramide acid), poly(amide-imide), polyimide, poly(esterimide) from poly arylene diamine |
| FR2578099B1 (fr) * | 1985-02-26 | 1987-12-04 | Eurofarad | Substrat monolithique pour composant electronique de puissance, et procede pour sa fabrication |
| US4803029A (en) * | 1986-01-28 | 1989-02-07 | Pmt Corporation | Process for manufacturing an expandable member |
| US4857143A (en) | 1988-12-16 | 1989-08-15 | International Business Machines Corp. | Wet etching of cured polyimide |
| US5183534A (en) | 1990-03-09 | 1993-02-02 | Amoco Corporation | Wet-etch process and composition |
| US5123987A (en) * | 1990-07-20 | 1992-06-23 | Cooper Tire & Rubber Company | Method of producing an air bladder from two uncured membranes |
| US5350487A (en) | 1993-05-03 | 1994-09-27 | Ameen Thomas J | Method of etching polyimide |
| US5514431A (en) * | 1993-12-30 | 1996-05-07 | Dai Nippon Printing Co., Ltd. | Air bag and method for making the air bag |
| US5464690A (en) * | 1994-04-04 | 1995-11-07 | Novavision, Inc. | Holographic document and method for forming |
| US5525405A (en) | 1994-12-14 | 1996-06-11 | E. I. Du Pont De Nemours And Company | Adhesiveless aromatic polyimide laminate |
| AU4380997A (en) * | 1996-09-09 | 1998-03-26 | Unilever Plc | Frozen product and process for the preparation thereof |
| US6073482A (en) | 1997-07-21 | 2000-06-13 | Ysi Incorporated | Fluid flow module |
| US6293012B1 (en) | 1997-07-21 | 2001-09-25 | Ysi Incorporated | Method of making a fluid flow module |
| US5932799A (en) | 1997-07-21 | 1999-08-03 | Ysi Incorporated | Microfluidic analyzer module |
| WO1999009534A1 (en) | 1997-08-18 | 1999-02-25 | Motorola Inc. | Apparatus for communicating multi-lingual messages and method therefor |
| US6183578B1 (en) * | 1998-04-21 | 2001-02-06 | Penn State Research Foundation | Method for manufacture of high frequency ultrasound transducers |
| JP3547327B2 (ja) * | 1998-11-02 | 2004-07-28 | 松下電器産業株式会社 | セラミック多層基板の製造方法 |
-
2000
- 2000-07-26 EP EP00965566A patent/EP1202859B1/de not_active Expired - Lifetime
- 2000-07-26 US US09/625,903 patent/US6627034B1/en not_active Expired - Fee Related
- 2000-07-26 AT AT00965566T patent/ATE236788T1/de not_active IP Right Cessation
- 2000-07-26 AU AU76265/00A patent/AU7626500A/en not_active Abandoned
- 2000-07-26 CA CA002380093A patent/CA2380093A1/en not_active Abandoned
- 2000-07-26 WO PCT/US2000/040487 patent/WO2001007247A1/en not_active Ceased
- 2000-07-26 DE DE60002090T patent/DE60002090T2/de not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1202859A1 (de) | 2002-05-08 |
| CA2380093A1 (en) | 2001-02-01 |
| DE60002090D1 (de) | 2003-05-15 |
| WO2001007247A1 (en) | 2001-02-01 |
| EP1202859B1 (de) | 2003-04-09 |
| US6627034B1 (en) | 2003-09-30 |
| DE60002090T2 (de) | 2004-03-18 |
| AU7626500A (en) | 2001-02-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |