DE60002090D1 - Strukturierte trennfolie zwischen zwei laminierten oberflächen - Google Patents

Strukturierte trennfolie zwischen zwei laminierten oberflächen

Info

Publication number
DE60002090D1
DE60002090D1 DE60002090T DE60002090T DE60002090D1 DE 60002090 D1 DE60002090 D1 DE 60002090D1 DE 60002090 T DE60002090 T DE 60002090T DE 60002090 T DE60002090 T DE 60002090T DE 60002090 D1 DE60002090 D1 DE 60002090D1
Authority
DE
Germany
Prior art keywords
substrate
release material
covered
substrates
laminated surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60002090T
Other languages
English (en)
Other versions
DE60002090T2 (de
Inventor
Stefan Ufer
J Cuomo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
North Carolina State University
University of California
Original Assignee
North Carolina State University
University of California
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by North Carolina State University, University of California filed Critical North Carolina State University
Application granted granted Critical
Publication of DE60002090D1 publication Critical patent/DE60002090D1/de
Publication of DE60002090T2 publication Critical patent/DE60002090T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0076—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised in that the layers are not bonded on the totality of their surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
    • B32B2315/02—Ceramics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08—Polyimides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1064—Partial cutting [e.g., grooving or incising]

Landscapes

  • Laminated Bodies (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Coils Or Transformers For Communication (AREA)
DE60002090T 1999-07-27 2000-07-26 Strukturierte trennfolie zwischen zwei laminierten oberflächen Expired - Fee Related DE60002090T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14588999P 1999-07-27 1999-07-27
US145889P 1999-07-27
PCT/US2000/040487 WO2001007247A1 (en) 1999-07-27 2000-07-26 Patterned release film between two laminated surfaces

Publications (2)

Publication Number Publication Date
DE60002090D1 true DE60002090D1 (de) 2003-05-15
DE60002090T2 DE60002090T2 (de) 2004-03-18

Family

ID=22514993

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60002090T Expired - Fee Related DE60002090T2 (de) 1999-07-27 2000-07-26 Strukturierte trennfolie zwischen zwei laminierten oberflächen

Country Status (7)

Country Link
US (1) US6627034B1 (de)
EP (1) EP1202859B1 (de)
AT (1) ATE236788T1 (de)
AU (1) AU7626500A (de)
CA (1) CA2380093A1 (de)
DE (1) DE60002090T2 (de)
WO (1) WO2001007247A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4907839B2 (ja) * 2003-03-26 2012-04-04 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
KR100632510B1 (ko) * 2004-04-30 2006-10-09 엘지전자 주식회사 와이어 그리드 편광자 및 그 제조 방법
US20070046149A1 (en) * 2005-08-23 2007-03-01 Zipparo Michael J Ultrasound probe transducer assembly and production method
JP5042297B2 (ja) * 2009-12-10 2012-10-03 日東電工株式会社 半導体装置の製造方法
KR102158890B1 (ko) * 2012-11-09 2020-09-23 디에스엠 아이피 어셋츠 비.브이. 가요성 복합체 물질로부터의 삼차원 제품
US10189209B2 (en) 2013-03-13 2019-01-29 Dsm Ip Assets B.V. Systems and method for producing three-dimensional articles from flexible composite materials
US9789662B2 (en) 2013-03-13 2017-10-17 Cubic Tech Corporation Engineered composite systems
WO2014160483A1 (en) 2013-03-13 2014-10-02 Cubic Tech Corporation Flexible composite systems and methods
WO2016113637A2 (en) 2015-01-09 2016-07-21 Dsm Ip Assets B.V. Lightweight laminates and plate-carrier vests and other articles of manufacture therefrom

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3523050A (en) * 1967-03-10 1970-08-04 Polaroid Corp Process for preparing envelope structures
US3616121A (en) * 1969-07-23 1971-10-26 Addressograph Multigraph Composite identification card
US3829342A (en) * 1970-05-18 1974-08-13 Gen Motors Corp Laminated liquid pump and method of making same
GB1362952A (en) 1970-07-21 1974-08-07 Rasmussen O B Conjugate fibre and method of manufacturing same
US4087578A (en) * 1973-05-16 1978-05-02 Bayer Aktiengesellschaft Heat sealable sheet materials
US4288275A (en) * 1979-05-14 1981-09-08 Davis Jesse B Roll leaf coating apparatus
US4426253A (en) 1981-12-03 1984-01-17 E. I. Du Pont De Nemours & Co. High speed etching of polyimide film
JPS58163373A (ja) * 1982-03-24 1983-09-28 テルモ株式会社 医療用バツグおよびその製造方法
IT1163598B (it) * 1983-06-24 1987-04-08 Cga Comp Gen Allumino Spa Metodo per ottenere condotti mediante gonfiaggio di pannelli in lamiera metallica in due strati
US4681928A (en) * 1984-06-01 1987-07-21 M&T Chemicals Inc. Poly(amide-amide acid), polyamide acid, poly(esteramide acid), poly(amide-imide), polyimide, poly(esterimide) from poly arylene diamine
FR2578099B1 (fr) * 1985-02-26 1987-12-04 Eurofarad Substrat monolithique pour composant electronique de puissance, et procede pour sa fabrication
US4803029A (en) * 1986-01-28 1989-02-07 Pmt Corporation Process for manufacturing an expandable member
US4857143A (en) 1988-12-16 1989-08-15 International Business Machines Corp. Wet etching of cured polyimide
US5183534A (en) 1990-03-09 1993-02-02 Amoco Corporation Wet-etch process and composition
US5123987A (en) * 1990-07-20 1992-06-23 Cooper Tire & Rubber Company Method of producing an air bladder from two uncured membranes
US5350487A (en) 1993-05-03 1994-09-27 Ameen Thomas J Method of etching polyimide
US5514431A (en) * 1993-12-30 1996-05-07 Dai Nippon Printing Co., Ltd. Air bag and method for making the air bag
US5464690A (en) * 1994-04-04 1995-11-07 Novavision, Inc. Holographic document and method for forming
US5525405A (en) 1994-12-14 1996-06-11 E. I. Du Pont De Nemours And Company Adhesiveless aromatic polyimide laminate
AU4380997A (en) * 1996-09-09 1998-03-26 Unilever Plc Frozen product and process for the preparation thereof
US5932799A (en) 1997-07-21 1999-08-03 Ysi Incorporated Microfluidic analyzer module
US6293012B1 (en) 1997-07-21 2001-09-25 Ysi Incorporated Method of making a fluid flow module
US6073482A (en) 1997-07-21 2000-06-13 Ysi Incorporated Fluid flow module
WO1999009534A1 (en) 1997-08-18 1999-02-25 Motorola Inc. Apparatus for communicating multi-lingual messages and method therefor
US6183578B1 (en) * 1998-04-21 2001-02-06 Penn State Research Foundation Method for manufacture of high frequency ultrasound transducers
JP3547327B2 (ja) * 1998-11-02 2004-07-28 松下電器産業株式会社 セラミック多層基板の製造方法

Also Published As

Publication number Publication date
ATE236788T1 (de) 2003-04-15
US6627034B1 (en) 2003-09-30
CA2380093A1 (en) 2001-02-01
EP1202859B1 (de) 2003-04-09
WO2001007247A1 (en) 2001-02-01
EP1202859A1 (de) 2002-05-08
AU7626500A (en) 2001-02-13
DE60002090T2 (de) 2004-03-18

Similar Documents

Publication Publication Date Title
TW358992B (en) Semiconductor device and method of fabricating the same
WO2002068320A3 (en) Devices having substrates with openings passing through the substrates and conductors in the openings, and methods of manufacture
TW373330B (en) Method of manufacturing semiconductor articles
EP1067611A4 (de) Elektrode für zelle, verfahren zu deren herstellung und zelle
MY118019A (en) Composite member, its separation method, and preparation method of semiconductor substrate by utilization thereof
TW339473B (en) Electronic package with multilevel connections
EP1365455A4 (de) Solarzelle und verfahren zu ihrer herstellung
FR2810448B1 (fr) Procede de fabrication de substrats et substrats obtenus par ce procede
CA2435421A1 (en) Method for making an article comprising a sheet and at least an element directly mounted thereon
TW335503B (en) Semiconductor thin film and manufacturing method and semiconductor device and its manufacturing method
NO864188D0 (no) 3-lagsplate bestaaende av en plan polyuretan-skumstoffplate med paaklebede metallytterlag samt fremgangsmaate til fremstilling derav.
TW372366B (en) Method of manufacturing semiconductor article
EP0867919A3 (de) Halbleitersubstrat und Verfahren dessen Herstellung
SG60102A1 (en) Lead frame semiconductor package having the same and method for manufacturing the same
DE60002090D1 (de) Strukturierte trennfolie zwischen zwei laminierten oberflächen
PL347421A1 (en) Method for producing a multilayer coextrudate and a coextrudate produced according thereto
TW430792B (en) Disk bonding method and system
TW200610146A (en) Electrode contact structure and method for fabricating the same
CA2269741A1 (en) Method for tackifying surface of soft layer
EP1148543A3 (de) Halbleiteranordnung und Herstellungsverfahren
CA2393908A1 (en) Foam sign
AU3480397A (en) Methods for forming extensible laminate structures
MY136656A (en) Film bulk acoustic resonator structure and method of making
AU3611499A (en) Safety envelope formed by a sleeve made in heat shrinkable material equipped with an identifying metal-coated strip
TW350077B (en) Chip-shaped electronic parts and the manufacturing method

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee