KR930019791A - 이방성 전기 전도성 접착 필름 및 이를 사용하는 결합 구조물 - Google Patents

이방성 전기 전도성 접착 필름 및 이를 사용하는 결합 구조물 Download PDF

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KR930019791A
KR930019791A KR1019930003608A KR930003608A KR930019791A KR 930019791 A KR930019791 A KR 930019791A KR 1019930003608 A KR1019930003608 A KR 1019930003608A KR 930003608 A KR930003608 A KR 930003608A KR 930019791 A KR930019791 A KR 930019791A
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South Korea
Prior art keywords
electrically conductive
conductive adhesive
adhesive film
anisotropic electrically
hole
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KR1019930003608A
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English (en)
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KR100260478B1 (ko
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가즈미 히가시
아마네 모치즈키
마사코 마에다
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가마이 고로
닛토덴코 가부시키가이샤
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Priority claimed from JP4090045A external-priority patent/JPH05258790A/ja
Priority claimed from JP4090044A external-priority patent/JPH05258789A/ja
Application filed by 가마이 고로, 닛토덴코 가부시키가이샤 filed Critical 가마이 고로
Publication of KR930019791A publication Critical patent/KR930019791A/ko
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Publication of KR100260478B1 publication Critical patent/KR100260478B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

본 발명은 절연 필름(여기서, 절연 필름은 400℃에서의 용융점도가 1 ×108poise이하인 열가소성 폴리이미드 수지를 포함한다)을 각각 전기 전도적으로 두께 방향으로 통과하는 미세한 통과 구멍을 갖고, 절연 필름의 전면 및 후면의 각각의 통과 구멍의 양쪽 말단 부분 중의 하나 이상의 말단 부분이 통과 구멍의 개방 부분의 면적보다 더 큰 기저 면적을 갖는 범프형 금속 돌출부로 차단되는 이방성 전기 전도성 접착 필름에 관한 것이다. 필름을 결합되는 재료들 사이에 삽입시켜 결합 구조물을 제공한다.

Description

이방성 전기 전도성 접착 필름 및 이를 사용하는 결합 구조물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 이방성 전기 전도성 필름의 하나의 양태를 나타내는 확대 단면도이다.(여기서,절연필름은 자체가 열접착 특성을 갖는다)
제2도는 본 발명의 이방성 전기 전도성 필름의 또 다른 양태를 나타내는 확대 단면도이다(여기서, 절연 필름은 자체가 열접착 특성을 갖는다.)
제3도는 외부 회로 기판상에 본 발명의 이방성 전기 전도성 접착필름을 사용하여 유연성 인쇄기판을 부착하기 전의 결합 구조를 구조물을 나타내는 단면도이다.

Claims (16)

  1. 400℃에서의 용융점도가 1×108poise이하인 열가소성 폴리이미드 수지를 포함하는 절연 필름을 각각 전기 전도적으로 두께 방향으로 통과하는 미세한 통과 구멍을 갖고, 절연 필름의 전면 및 후면의 각각의 통과 구멍의 양쪽 말단 부분 중의 하나 이상의 말단 부분이 통과 구멍의 개방 부분의 면적보다 더 큰 기저 면적을 갖는 범프형 금속 돌출부로 차단되는 이방성 전기 전도성 접착 필름.
  2. 제1항에 있어서, 미세한 통과 구멍이 레이저 광을 조사함으로써 형성된 이방성 전기 전도성 접착 필름.
  3. 제1항에 있어서, 범프형 금속 돌출부의 기저 면적이 통과 구멍의 평면 면적보다 1. 1배 이상 더 큰 이방성 전기 전도성 접착 필름.
  4. 제1항에 있어서, 통과 구멍의 평면 면적이 (절연필름의 두께)2보다 더 큰 이방성 전기 전도성 접착 필름.
  5. 제1항에 있어서, 열가소성 폴리이미드 수지의 용융점도가 1×103내지 1 ×107poise인 이방성 전기 전도성 접착 필름.
  6. 제1항에 있어서, 열가소성 폴리이미드 수지의 유리전이 온도가 475°K이상인 이방성 전기 전도성 접착 필름.
  7. 제1항의 이방성 전기전도성 접착 필름(여기서, 이방성 전기 전도성 접착 필름은 결합되는 재료들 사이에 삽입된다) 및 결합되는 재료를 포함하는 결합 구조물.
  8. 제7항에 있어서, 결합되는 재료가 유연성 인쇄기판, 외부 회로기판, 반도체 소자, 다층회로 기판, 다중-팁 모듈, 전자 부품 및 리드 프레임으로부터 선택된 결합 구조물.
  9. 절연 필름을 각각 전기 전도적으로 두께 방향으로 통과하는 미세한 통과 구멍을 갖고, 절연 필름의 전면 및 후면의 각각의 통과 구멍의 양쪽 말단 부분 중의 하나 이상의 말단 부분이 통과 구멍의 개방 부분의 면적보다 더 큰 기저 면적을 갖는 범프형 금속 돌출부로 차단되며, 400℃에서의 용융점도가 1 ×108poise이하인 열가소성 폴리이미드 수지 층이 절연 필름의 하나 이상의 표면에 형성되어 있는 이방성 전기 전도성 접착 필름.
  10. 제9항에 있어서, 미세한 통과 구멍이 레이저 광을 조사함으로써 형성되는 이방성 전기 전도성 접착 필름.
  11. 제9항에 있어서, 범프형 금속 돌출부의 기저 면적이 통과 구멍의 평면 면적보다 1.1배 이상 더 큰 이방성 전기 전도성 접착 필름.
  12. 제9항에 있어서, 통과 구멍의 평면 면적이 (절연필름의 두께)2보다 더 큰 이방성 전기 전도성 접착 필름.
  13. 제9항에 있어서, 열가소성 폴리이미드 수지의 용융점도가 1 ×103내지 1 ×107poise인 이방성 전기 전도성 접착 필름.
  14. 제9항에 있어서, 열가소성 폴리이미드 수지의 유리전이 온도가 475°K이상인 이방성 전기 전도성 접착 필름.
  15. 제9항의 이방성 전기 전도성 접착 필름(여기서, 이방성 전기 전도성 접착 필름은 결합되는 재료들 사이에 삽입된다) 및 결합되는 재료를 포함하는 결합 구조물.
  16. 제15항에 있어서, 결합되는 재료가 유연성 인쇄기판, 외부 회로 기판, 반도체 소자, 다층회로기판, 다중-팁 모듈, 전자부품 및 리드 프레임으로부터 선택된 결합 구조물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930003608A 1992-03-13 1993-03-11 이방성 전기 전도성 접착 필름 및 이를 사용하는 결합 구조물 KR100260478B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP4090045A JPH05258790A (ja) 1992-03-13 1992-03-13 異方導電性接着フィルムおよびこれを用いた接続構造
JP4090044A JPH05258789A (ja) 1992-03-13 1992-03-13 異方導電性接着フィルムおよびこれを用いた接続構造
JP92-090044 1992-03-13
JP92-090045 1992-03-13

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KR930019791A true KR930019791A (ko) 1993-10-18
KR100260478B1 KR100260478B1 (ko) 2000-07-01

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KR1019930003608A KR100260478B1 (ko) 1992-03-13 1993-03-11 이방성 전기 전도성 접착 필름 및 이를 사용하는 결합 구조물

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US (1) US5438223A (ko)
EP (1) EP0560072A3 (ko)
KR (1) KR100260478B1 (ko)
TW (1) TW274620B (ko)

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EP0560072A3 (en) 1993-10-06

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