KR950002544A - 다층금속프린트기판과 몰드모듈 - Google Patents

다층금속프린트기판과 몰드모듈 Download PDF

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KR950002544A
KR950002544A KR1019940014415A KR19940014415A KR950002544A KR 950002544 A KR950002544 A KR 950002544A KR 1019940014415 A KR1019940014415 A KR 1019940014415A KR 19940014415 A KR19940014415 A KR 19940014415A KR 950002544 A KR950002544 A KR 950002544A
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metal
circuit board
printed circuit
board
metal printed
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KR1019940014415A
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껜지 오까모또
유끼오 나까지마
까주히꼬 이마무라
따께오 이찌하라
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나까사도 요시히꼬
후지덴끼 가부시기가이샤
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Publication of KR950002544A publication Critical patent/KR950002544A/ko

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    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • H—ELECTRICITY
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    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
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    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01—ELECTRIC ELEMENTS
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    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
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    • H05K1/18—Printed circuits structurally associated with non-printed electric components
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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Abstract

본 발명은 전자부품을 장착하기 위한 다층금속프린트기판에 관한 것으로서, 베이스로서의 금속시트의 표면상에 절연층을 적층하며, 전자부품은 절연층의 표면에 형성된 전도체패턴에 장착된다. 전자부품이 장착되는 양면형 프리트기판은 평행으로 위치하고, 이들 양프린트기판 사이의 공간에는 절연수지가 채워진 후 경화됨으로써 집적화되며, 또한 절연수지는 전자부품을 덮을 수 있도록 프리트기판의 표면에 적층된 후 경화된다. 전자부품으로부터 발생된 열은 높은 열전도도를 가지는 양쪽의 절연수지에 효과적으로 전달되며, 이후 열은 금속시트 또는 절연수지의 표면으로부터 방출된다.

Description

다층금속프린트기판과 몰드모듈
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1 실시예에 따른 다층금속프린트기판을 도시한 단면도.

Claims (21)

  1. 베이스로서의 금속시트 상에 절연층을 적층하고, 전자부품을 장착하여 형성한 금속프린트기판과, 상기 전자부품이 장착된 금속프린트기판의 한 측면 위에 적층된 동시에 다른 전자부품을 장착하고 있는 최소한 하나이상의 프린트기판과, 상기 금속프린트기판과 프린트기판 사이에 채워진 절연수지를, 구비하는 것을 특징으로 하는 다층금속프린트기판.
  2. 제1항에 있어서, 상기 절연수지는 높은 열전도성을 갖는 것을 특징으로 하는 다층금속프린트기판.
  3. 제1항에 있어서, 상기 금속프린트기판의 절연층 또는 프린트기판은 상기 장착된 부품의 동작특성에 따라 복수개의 부분으로 분리되고, 상기 절연층의 분리된 부분들은 물리적 특성이 상호 다른 재료로 구성된 것을 특징으로 하는 다층금속프린트기판.
  4. 제1항에 있어서, 상기 적층된 프린트기판에는 여기에 배치된 전도체패턴을 관통하는 관통공이 배치된 것을 특징으로 하는 다층금속프린트기판.
  5. 제1항에 있어서, 상기 금속프린트기판 상에 적층된 상기 프리트기판은 제거된 요부를 가지며, 관통공이 형성된 기판과 접속용 전극패턴이 상기 요부에 삽입 및 매설되는 것을 특징으로 하는 다층금속프린트기판.
  6. 제1항에 있어서, 상호 마주하는 상기 프린트기판과 금속프린트기판에 배치된 전도패턴을 접속하기 위한 금속핀을 구비하며, 이 금속핀은 상기 다층금속프린트기판의 두께방향으로 따라 매설되어 있는 것을 특징으로 하는 다층금속프린트기판.
  7. 제1항에 있어서, 상기 다층금속프린트기판은 상기 프린트기판 및 상기 금속프린트기판과 이들 양쪽기판 사이에 수지침투재로서 위치하는 상기 절연수지에 진공가압을 행하여 형성하는 집적화된 구조체인 것을 특징으로 하는 다층금속프린트기판.
  8. 제1항에 있어서, 상기 다층금속프린트기판은 전자부품이 장착된 상기 프린트기판을 배치한 후 상기 절연수지를 성형몰드에 주사하여 형성된 집적화된 구조체인 것을 특징으로 하는 다층금속프린트기판.
  9. 제1항에 있어서, 상기 금속프린트기판은 상기 프린트기판의 외주변 및 상기 금속프린트기판 상의 절연수지보다 크고, 상기 금속프린트기판의 표면상에 형성된 전도체패턴은 노출되어 외부회로와 연결할 수있는 접속부를 형성하는 것을 특징으로 하는 다층금속프린트기판.
  10. 제9항에 있어서, 상기 금속프린트기판의 외측에지는 상향으로 굽혀져 상기 금속프린트기판 상에 적층된 상기 프린트기판을 둘러싸는 성형체를 이루는 것을 특징으로 하는 다층금속프린트기판.
  11. 전자부품이 장착된 마더보드로서의 프린트기판과, 제1절연수지로 다층금속프린트기판의 내측을 채워 형성되는 것으로서, 상기 마더보드로서의 상기 프린트기판과 결합하고, 상기 다층금속프린트기판이 금속프린트기판과 이 금속프린트기판 사에 적층된 최소한 하나이상의 프린트기판을 가지며, 상기 금속프린트기판은 상기 프린트기판의 외주변보다 크고, 상기 금속프린트기판의 외측에지는 상향으로 굽려져 상기 금속프린트기판 상에 적층된 상기 프린트기판을 둘러싸는 성형체를 이루는 다층패키지와, 상기 마더보드와 상기 다층패키지의 결합부 주위부분과 상기 마더보드와 상기 다층패키지 사이의 공간에 채워진 제2절연수지를, 구비하며, 전체적인 구조가 집적화되어 있는 것을 특징으로 하는 몰드모듈.
  12. 제11항에 있어서, 상기 다층패키지의 상기 금속프린트기판은 열설정폴리아미드로 제조된 접착시트의 절연층과, 상기 절연층의 한 표면에 접착되는 금속시트와, 상기 절연층의 다른 표면에 접착되는 구리박막을 구비하는 것을 특징으로 하는 몰든모듈.
  13. 제11항에 있어서, 상기 다층패키지는 상기 금속프린트기판 위에 적층된 상기 프린트기판상에 장착되는 IC베어칩을 구비하는 것을 특징으로 하는 몰드모듈.
  14. 제11항에 있어서, 상기 다층패키지는 상기 금속프린트기판의 4개의 모서리에 슬릿을 형성하고, 곡률반경이 보다 크게 상기 금속기판의 2개의 대향측면을 굽히는 한편, 곡률반경이 보다 작게 상기 금속기판의 2개의 다른 대향측면을 굽혀서 형성되는 실질적으로 상자형상인 것을 특징으로 하는 몰드모듈.
  15. 제14항에 있어서, 보다 큰 곡률반경으로 굽혀진 상기2개의 측면상에는 상기 마더보드로서의 상기 프린트기판과 접속하기 위한 구리박막이 가공되어 형성된 것을 특징으로 하는 몰드모듈.
  16. 제11항에 있어서, 상기 금속프린트기판은 이 금속프린트기판 만을 굽힐 수 있는 구조를 가진 몰드로 가압되어 상기 다층패키지의 상기 금속프린트기판 상에 적층된 상기 프린트기판을 둘러싸는 것을 특징으로 하는 몰드모듈.
  17. 제11항에 있어서, 상기 다층패키지의 상기 제1절연수지는 상기 금속프린트기판을 구성하는 금속시트의 열팽창계수와 거의 동일한 열팽창계수를 갖는 높은 열전도성 절연수지로서, 상압 또는 이보다는 낮은 압력하에서 주입된 후 형성되는 것을 특징으로 하는 몰드모듈.
  18. 제11항에 있어서, 상기 다층패키지의 접합에지부는 정렬용 지그에 배치된 핀을 사용하여, 마더보드로서의 상기 프린트기판의 접합에지부와, 정렬하고, 이들 양 접합에지부는 납땜에 의해 상호 결합하는 것을 특징으로 하는 몰드모듈.
  19. 제11항에 있어서, 상기 다층패키지의 접합에지부와 상기 마더보드로서의 상기 프린트기판의 접합에지부 모두에 대응하는 형상 및 구조를 가진 납땜인두를 사용하여 땜납을 가열 용해함으로써 상기 다층패키지의 접합에지부와 상기 마더보드로서의 상기 프린트기판의 접합에너지부를 결합하는 것을 특징으로 하는 몰드모듈.
  20. 제11항에 있어서, 상기 마더보드로서의 프린트기판은 상기 다층패키지의 상기 금속프린트기판의 열팽창계수와 거의 동일한 열팽창계수를 가진 금속 또는 비금속으로 구성된 것을 특징으로 하는 몰드모듈.
  21. 제11항에 있어서, 상기 마더보드로서의 상기 프린트기판과 상기 다층패키지의 접합부 주변의 둘레 공간 그리고 상기 마더보드로서의 상기 프린트기판과 상기 다층패키지 사이의 공간에 채워진 상기 제2절연수지는 상기 다층패키지에 채워진 상기 제1절연수지의 열팽창계수와 거의 동일한 열팽창계수를 가진 높은 열전도성 절연수지인 것을 특징으로 하는 몰드모듈.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940014415A 1993-06-25 1994-06-23 다층금속프린트기판과 몰드모듈 KR950002544A (ko)

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