KR970014494A - 다층회로기판 및 그 제조방법 - Google Patents

다층회로기판 및 그 제조방법 Download PDF

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KR970014494A
KR970014494A KR1019960032696A KR19960032696A KR970014494A KR 970014494 A KR970014494 A KR 970014494A KR 1019960032696 A KR1019960032696 A KR 1019960032696A KR 19960032696 A KR19960032696 A KR 19960032696A KR 970014494 A KR970014494 A KR 970014494A
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thermoplastic resin
layer
metal layer
resin film
substrate
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KR100232414B1 (ko
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토시까즈 타께노우찌
미끼꼬 와까바야시
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모기 쥰이찌
신꼬오덴기 고오교오 가부시끼가이샤
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    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
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Abstract

본 발명은 비아의 도전성이 충분히 확보되어, 단위기판과 비아 사이에서 열팽창, 열수축이 매칭을 이루어, 크랙의 발생이 없는 신뢰성이 우수한 다층회로기판을 제공한다.
열경화성수지층(14)의 한 면에 금속층(13)이 형성되고, 다른 면에는 열가소성수지층(16)이 형성된 기판재료(11)에 구비된 비아홀(18)내에 도전재료가 함유된 도전성 열가소성수지가 충전되어 비아(20)가 형성되는 동시에, 금속층(13)이 비아(20)와 접속하는 배선패턴(22)이 형성된 단위기판(12)이 복수매 적층되어, 열가소성수지층(16)에 의해 각 단위기판이 접착되어 있는 것을 특징으로 한다.

Description

다층회로기판 및 그 제조방법
도1은 본 발명에 의한 다층회로기판의 일례를 나타낸 단면도,
도4는 도1에 나타낸 단위기판(12)의 제조방법을 설명하기 위한 단면설명도.

Claims (12)

  1. 열경화성수지필름의 한 면에 금속층이 형성되고, 다른 한 면에는 열가소성수지층이 형성된 기판재료에 설비된 비아홀내에, 도전재료가 함유된 도전성열가소성수지가 충전되어 이루어진 비아가 형성되어 있는 동시에, 상기 금속층이 상기 비아와 접속하는 소요의 배선패턴으로 형성된 단위기판이 복수매적층되고, 상기 열가소성수지층에의해 각단위기판이 접착되어 있는 것을 특징으로 하는 다층회로기판.
  2. 열경화성수지필름의 한 면에 금속층이 형성되고, 다른 한 면에는 열가소성수지층이 형성된 기판재료에 설비된 비아홀내에, 도전재료가 함유된 도전성열가소성지수가 충전되어 이루어진 비아가 형성되어 있는 동시에, 상기 열경화성수지필름의 금속층이 상기 비아와 접속하는 소요의 배선패턴으로 형성된 단위기판의 1매 또는 복수매와, 열경화성수지필름의 양면에 금속층이 형성된 기판재료에 구비된 비아홀내에, 도전재료가 함유된 도전성열가소성수지가 충전되어 이루어진 비아가 형성되는 동시에, 상기 금속층의 각각이 상기 비아와 접속하는 소요의 배선패턴으로 형성된 단위기판이 적층되고, 상기 열가소성수지층에 의해 각 단위기판이 접착되어 있는 것을 특징으로 하는 다층회로기판.
  3. 열경화성수지필름의 한 면에 금속층이 형성되고, 다른 한 면에 열가소성수지층이 형성된 기판재료에 구비된 비아홀내에, 도전재료가 함유된 도전성열가소성수지가 충전되어 이루어진 비아가 형성되어 있는 동시에, 상기 금속층이 상기 비아와 접속하는 소요의 배선패턴으로 형성된 단위기판의 1매 또는 복수매와, 열경화성수지필름의 한 면에 금속층이 형성된 기판재료에 상기 열경화성수지필름을 관통하는 단자홀이 형성되어 있는 동시에, 상기 단자홀의 저면으로 일부가 노출하도록, 상기 금속층이 소요의 배선패턴으로 형성된 단위기판이 상기 잔자홀을 밖깥쪽으로 향하여 적층되고, 상기 열가소성수지층에 의해 각 단위기판이 접착되어 있는 것을 특징으로 하는 다층회로기판.
  4. 제3항에 있어서, 단자홀에 외부접속용의 범프가 형성되어 있는 것을 특징으로 하는 다층회로기판.
  5. 열경화성수지필름의 한 면에 금속층이 형성되고, 다른 한 면에 열가소성수지층이 형성된 기판재료에 구비된 상기 금속층이 저면으로 노출되는 비아홀내에 소정 두께로 형성된 도금금속층과, 도전재료가 함유된 도전성열가소성수지층이 순차 적층되어 이루어진 비아가 형성되어 있는 동시에, 상기 열경화성수지필름의 금속층이 상기 비아와 접속하는 소요의 배선패턴으로 형성된 단위기판이 복수매 적층되고, 상기 열가소성수지층에 의해 각 단위기판이 접착되어 있는 것을 특징으로 하는 다층회로기판.
  6. 열경화성수지필름의 한 면에 금속층이 형성되고, 다른 한 면에 열가소성수지층이 형성된 기판재료에 구비된 상기 금속층이 저면으로 노출되는 비아홀내에 소정 두께로 형성된 도금금속층과, 도전재료가 함유된 도전성열가소성수지층이 순차 적층되어 이루어진 비아가 형성되어 있는 동시에, 상기 열경화성수지필름의 금속층이 상기 비아와 접속하는 소요의 배선패턴으로 형성된 단위기판의 1매 또는 복수매와, 열경화성수지필름의 한 면에 금속층이 형성된 기판재료에 상기 열경화성수지필름을 관통하는 단자홀이 형성되어 있는 동시에, 상기 단자홀의 저면에 일부가 노출하도록, 상기 금속층이 소요의 배선패턴으로 형성된 단위기판이 상기 단자홀을 밖깥쪽으로 향하여 적층되고, 상기 열가소성수지층에 의해 각 단위기판이 접착되어 있는 것을 특징으로 하는 다층회로기판.
  7. 제6항에 있어서, 단자홀에 외부접속용 범프가 형성되어 있는 것을 특징으로 하는 다층회로기판.
  8. 제5항 내지 7항중 어느 한항에 있어서, 도금금속층이 도전재료가 함유된 도전성열가소성수지층보다도 두꺼운 것을 특징으로 하는 다층회로기판.
  9. 제1항 내지 8항중 어느 한항에 있어서, 열경화성수지필름으로서 열경화성폴리이미드필름이 사용되는 동시에, 열가소성수지층이 열가소성폴리이미드층이고, 또 비아홀에 충전하는 도전성열가소성수지페이스트로서 금속입자를 함유하는 열가소성폴리이미드수지페이스트가 사용되는 것을 특징으로 하는 다층회로기판.
  10. 열경화성수지필름의 한 면에 금속층이 형성되고, 다른 한 면에 열가소성수지층이 형성된 기판재료에 구비된 비아홀내에 도전재료가 함유된 도전성열가소성수지페이스트를 충전한 후, 상기 도전성열가소성수지페이스트의 용매를 비산시키는 가열처리를 행하여 비아를 형성하는 동시에, 상기 열경화성수지필름의 금속층을 상기 비아에 접속하는 배선패턴으로 형성하여 단위기판을 형성하고, 이어서, 복수매의 상기 단위기판을 적층하고 가열가압을 행하여, 상기 열가소성수지층에 의해서 각 단위기판을 접착하는 것을 특징으로 하는 다층회로기판의 제조방법.
  11. 열경화성수지필름의 한 면에 금속층이 형성되고, 다른 한 면에는 열가소성수지층이 형성된 기판재료에 구비된 상기 금속층이 저면으로 노출되는 비아홀내에 소정 두께의 도전금속층을 형성한 후, 상기 도금 금속층상에 도전재료가 함유된 도전성열가소성수지페이스트를 충전하고, 이어서, 상기 도전재료가 함유된 도전성열가소성수지페이스트의 용매를 비산하는 가열처리를 행하여 비아를 형성한 후, 상기 열경화성수지필름의 금속층을 상기 비아에 접속하는 배선패턴으로 형성하여 단위기판을 형성하고, 그 후, 복수매의 상기 단위기판을 적층하여 가열가압을 행하여, 상기 열가소성수지층에 의해서 각 단위기판을 접착하는 것을 특징으로 하는 다층회로기판의 제조방법.
  12. 제10항 또는 제11항에 있어서, 열경화성수지필름으로서 열경화성폴리이미드필름을 사용하는 동시에, 열가소성수지층을 열가소성폴리이미드층으로 하고, 또 비아홀에 충전하는 도전성열가소성수지페이스트로서 금속입자를 함유하는 열가소성폴리이미드수지페이스트를 사용하는 것을 특징으로 하는 다층회로기판의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960032696A 1995-08-11 1996-08-06 다층회로기판 및 그 제조방법 KR100232414B1 (ko)

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