TW241438B - - Google Patents
Info
- Publication number
- TW241438B TW241438B TW083105672A TW83105672A TW241438B TW 241438 B TW241438 B TW 241438B TW 083105672 A TW083105672 A TW 083105672A TW 83105672 A TW83105672 A TW 83105672A TW 241438 B TW241438 B TW 241438B
- Authority
- TW
- Taiwan
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/045—Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18083693 | 1993-06-25 | ||
JP7440294 | 1994-03-18 | ||
JP09598594A JP3198796B2 (ja) | 1993-06-25 | 1994-05-10 | モールドモジュール |
Publications (1)
Publication Number | Publication Date |
---|---|
TW241438B true TW241438B (zh) | 1995-02-21 |
Family
ID=27301486
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW083105672A TW241438B (zh) | 1993-06-25 | 1994-06-22 |
Country Status (6)
Country | Link |
---|---|
US (2) | US5672414A (zh) |
JP (1) | JP3198796B2 (zh) |
KR (1) | KR950002544A (zh) |
CN (2) | CN1057659C (zh) |
DE (1) | DE4422216A1 (zh) |
TW (1) | TW241438B (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8119446B2 (en) | 2001-12-31 | 2012-02-21 | Megica Corporation | Integrated chip package structure using metal substrate and method of manufacturing the same |
US8471361B2 (en) | 2001-12-31 | 2013-06-25 | Megica Corporation | Integrated chip package structure using organic substrate and method of manufacturing the same |
US8492870B2 (en) | 2002-01-19 | 2013-07-23 | Megica Corporation | Semiconductor package with interconnect layers |
US8535976B2 (en) | 2001-12-31 | 2013-09-17 | Megica Corporation | Method for fabricating chip package with die and substrate |
US9030029B2 (en) | 2001-12-31 | 2015-05-12 | Qualcomm Incorporated | Chip package with die and substrate |
TWI556701B (zh) * | 2014-09-26 | 2016-11-01 | Panasonic Ip Man Co Ltd | Method for manufacturing double-sided metal foil laminated board, method for manufacturing printed circuit board, method for manufacturing multilayer laminated sheet, and method for manufacturing multilayer printed circuit board |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6175084B1 (en) | 1995-04-12 | 2001-01-16 | Denki Kagaku Kogyo Kabushiki Kaisha | Metal-base multilayer circuit substrate having a heat conductive adhesive layer |
JPH09214097A (ja) * | 1996-02-06 | 1997-08-15 | Toshiba Corp | プリント回路基板 |
KR100433685B1 (ko) * | 1996-04-18 | 2004-10-06 | 인터내쇼널 렉티파이어 코포레이션 | 10마력모터제어기용전력트레인분할장치 |
US6795120B2 (en) | 1996-05-17 | 2004-09-21 | Sony Corporation | Solid-state imaging apparatus and camera using the same |
DE19648205C1 (de) * | 1996-11-21 | 1998-04-02 | Hermann Stahl Gmbh | Trägerplatte für eine Platine mit elektronischen Bauelementen |
US6064286A (en) * | 1998-07-31 | 2000-05-16 | The Whitaker Corporation | Millimeter wave module with an interconnect from an interior cavity |
US6876554B1 (en) | 1999-09-02 | 2005-04-05 | Ibiden Co., Ltd. | Printing wiring board and method of producing the same and capacitor to be contained in printed wiring board |
EP2265101B1 (en) * | 1999-09-02 | 2012-08-29 | Ibiden Co., Ltd. | Printed circuit board and method of manufacturing printed circuit board |
ATE487238T1 (de) * | 1999-09-29 | 2010-11-15 | Kaneka Corp | Verfahren und gerät zur automatischen lötung von einem anschlussdraht an einer sonnenzellenbatterie |
US6362964B1 (en) * | 1999-11-17 | 2002-03-26 | International Rectifier Corp. | Flexible power assembly |
US6377219B2 (en) | 2000-01-11 | 2002-04-23 | Cool Options, Inc. | Composite molded antenna assembly |
US6680015B2 (en) | 2000-02-01 | 2004-01-20 | Cool Options, Inc. | Method of manufacturing a heat sink assembly with overmolded carbon matrix |
US6650559B1 (en) * | 2000-10-31 | 2003-11-18 | Fuji Electric Co., Ltd. | Power converting device |
US6680212B2 (en) * | 2000-12-22 | 2004-01-20 | Lucent Technologies Inc | Method of testing and constructing monolithic multi-chip modules |
US6677669B2 (en) * | 2002-01-18 | 2004-01-13 | International Rectifier Corporation | Semiconductor package including two semiconductor die disposed within a common clip |
JP2004205262A (ja) * | 2002-12-24 | 2004-07-22 | Sony Corp | ノイズ測定装置及びノイズ測定用ケーブル |
KR100699823B1 (ko) * | 2003-08-05 | 2007-03-27 | 삼성전자주식회사 | 저가형 플랙서블 필름 패키지 모듈 및 그 제조방법 |
US7095615B2 (en) * | 2003-11-13 | 2006-08-22 | Honeywell International, Inc. | Environmentally tuned circuit card assembly and method for manufacturing the same |
JP4042785B2 (ja) | 2004-02-13 | 2008-02-06 | 株式会社村田製作所 | 電子部品及びその製造方法 |
KR100716826B1 (ko) * | 2005-05-10 | 2007-05-09 | 삼성전기주식회사 | 전자부품이 내장된 기판의 제조방법 |
DE102005032489B3 (de) * | 2005-07-04 | 2006-11-16 | Schweizer Electronic Ag | Leiterplatten-Mehrschichtaufbau mit integriertem elektrischem Bauteil und Herstellungsverfahren |
US7990727B1 (en) * | 2006-04-03 | 2011-08-02 | Aprolase Development Co., Llc | Ball grid array stack |
JP4842167B2 (ja) * | 2007-02-07 | 2011-12-21 | 新光電気工業株式会社 | 多層配線基板の製造方法 |
JP2010176909A (ja) * | 2009-01-27 | 2010-08-12 | Panasonic Electric Works Co Ltd | 放電灯点灯装置及び照明器具 |
JP2011023463A (ja) * | 2009-07-14 | 2011-02-03 | Denso Corp | 半導体モジュール |
DE102010043788B4 (de) | 2010-11-11 | 2023-12-07 | Siteco Gmbh | Schaltungsanordnung zum Betreiben mindestens einer Lichtquelle und Verfahren zum Herstellen einer derartigen Schaltungsanordnung |
DE102011105346A1 (de) * | 2011-06-21 | 2012-12-27 | Schweizer Electronic Ag | Elektronische Baugruppe und Verfahren zu deren Herstellung |
KR101330770B1 (ko) * | 2011-11-16 | 2013-11-18 | 엘지이노텍 주식회사 | 백라이트 유닛용 절곡 인쇄회로기판 |
US8680663B2 (en) * | 2012-01-03 | 2014-03-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods and apparatus for package on package devices with reduced strain |
US9888568B2 (en) | 2012-02-08 | 2018-02-06 | Crane Electronics, Inc. | Multilayer electronics assembly and method for embedding electrical circuit components within a three dimensional module |
CN103036221B (zh) * | 2012-12-04 | 2015-07-08 | 华为技术有限公司 | 母线电容模块及功率单元 |
AT515069B1 (de) * | 2013-11-07 | 2019-10-15 | At & S Austria Tech & Systemtechnik Ag | Leiterplattenstruktur |
EP3258752A4 (en) | 2015-02-13 | 2018-10-17 | Pi-Crystal Incorporation | Method for forming laminated circuit board, and laminated circuit board formed using same |
JP6477567B2 (ja) * | 2016-03-30 | 2019-03-06 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
US10787303B2 (en) | 2016-05-29 | 2020-09-29 | Cellulose Material Solutions, LLC | Packaging insulation products and methods of making and using same |
US11078007B2 (en) | 2016-06-27 | 2021-08-03 | Cellulose Material Solutions, LLC | Thermoplastic packaging insulation products and methods of making and using same |
US10129979B2 (en) * | 2016-09-23 | 2018-11-13 | Apple Inc. | PCB assembly with molded matrix core |
KR102468765B1 (ko) | 2017-11-29 | 2022-11-22 | 삼성전자주식회사 | 반도체 패키지 구조체 및 이를 포함하는 반도체 모듈 |
US10645808B2 (en) * | 2018-02-22 | 2020-05-05 | Apple Inc. | Devices with radio-frequency printed circuits |
US10455707B1 (en) | 2018-08-10 | 2019-10-22 | Apple Inc. | Connection pad for embedded components in PCB packaging |
CN109121285B (zh) * | 2018-09-29 | 2020-05-26 | 维沃移动通信有限公司 | 一种电路板结构及电子设备 |
CN109348616B (zh) * | 2018-11-28 | 2024-09-03 | 宁波舜宇光电信息有限公司 | 一种具有热传导结构的线路板及其制作方法 |
CN109688696A (zh) * | 2019-01-04 | 2019-04-26 | 维沃移动通信有限公司 | 电路板装置、电路板装置的制作工艺及电子设备 |
KR102359904B1 (ko) | 2019-09-16 | 2022-02-08 | 삼성전자주식회사 | 반도체 패키지 |
US20230005822A1 (en) * | 2021-07-01 | 2023-01-05 | Hamilton Sundstrand Corporation | Polyimide bonded bus bar for power device |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE81673C (zh) * | ||||
DD81673A (zh) * | ||||
US2923860A (en) * | 1957-08-22 | 1960-02-02 | Miller John Dawson | Printed circuit board |
US3436604A (en) * | 1966-04-25 | 1969-04-01 | Texas Instruments Inc | Complex integrated circuit array and method for fabricating same |
US3746934A (en) * | 1971-05-06 | 1973-07-17 | Siemens Ag | Stack arrangement of semiconductor chips |
US3699394A (en) * | 1971-11-01 | 1972-10-17 | Powercube Corp | Modular circuit package with enhanced heat dissipation |
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- 1994-06-21 US US08/263,332 patent/US5672414A/en not_active Expired - Fee Related
- 1994-06-22 TW TW083105672A patent/TW241438B/zh active
- 1994-06-23 KR KR1019940014415A patent/KR950002544A/ko active IP Right Grant
- 1994-06-24 CN CN94107763A patent/CN1057659C/zh not_active Expired - Fee Related
- 1994-06-24 DE DE4422216A patent/DE4422216A1/de not_active Ceased
-
1996
- 1996-12-03 US US08/763,707 patent/US5770300A/en not_active Expired - Fee Related
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1997
- 1997-08-25 CN CN97117778A patent/CN1176571A/zh active Pending
Cited By (8)
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US8119446B2 (en) | 2001-12-31 | 2012-02-21 | Megica Corporation | Integrated chip package structure using metal substrate and method of manufacturing the same |
US8471361B2 (en) | 2001-12-31 | 2013-06-25 | Megica Corporation | Integrated chip package structure using organic substrate and method of manufacturing the same |
US8535976B2 (en) | 2001-12-31 | 2013-09-17 | Megica Corporation | Method for fabricating chip package with die and substrate |
US8835221B2 (en) | 2001-12-31 | 2014-09-16 | Qualcomm Incorporated | Integrated chip package structure using ceramic substrate and method of manufacturing the same |
US9030029B2 (en) | 2001-12-31 | 2015-05-12 | Qualcomm Incorporated | Chip package with die and substrate |
US9136246B2 (en) | 2001-12-31 | 2015-09-15 | Qualcomm Incorporated | Integrated chip package structure using silicon substrate and method of manufacturing the same |
US8492870B2 (en) | 2002-01-19 | 2013-07-23 | Megica Corporation | Semiconductor package with interconnect layers |
TWI556701B (zh) * | 2014-09-26 | 2016-11-01 | Panasonic Ip Man Co Ltd | Method for manufacturing double-sided metal foil laminated board, method for manufacturing printed circuit board, method for manufacturing multilayer laminated sheet, and method for manufacturing multilayer printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
US5672414A (en) | 1997-09-30 |
US5770300A (en) | 1998-06-23 |
CN1057659C (zh) | 2000-10-18 |
JPH07307574A (ja) | 1995-11-21 |
JP3198796B2 (ja) | 2001-08-13 |
DE4422216A1 (de) | 1995-01-05 |
CN1176571A (zh) | 1998-03-18 |
CN1098588A (zh) | 1995-02-08 |
KR950002544A (ko) | 1995-01-04 |