ATE487238T1 - Verfahren und gerät zur automatischen lötung von einem anschlussdraht an einer sonnenzellenbatterie - Google Patents
Verfahren und gerät zur automatischen lötung von einem anschlussdraht an einer sonnenzellenbatterieInfo
- Publication number
- ATE487238T1 ATE487238T1 AT00105317T AT00105317T ATE487238T1 AT E487238 T1 ATE487238 T1 AT E487238T1 AT 00105317 T AT00105317 T AT 00105317T AT 00105317 T AT00105317 T AT 00105317T AT E487238 T1 ATE487238 T1 AT E487238T1
- Authority
- AT
- Austria
- Prior art keywords
- lead wire
- soldering
- solar cell
- connection wire
- cell battery
- Prior art date
Links
- 238000005476 soldering Methods 0.000 title abstract 12
- 238000000034 method Methods 0.000 title 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 17
- 229910000679 solder Inorganic materials 0.000 abstract 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 4
- 229910052742 iron Inorganic materials 0.000 abstract 2
- 238000003466 welding Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0615—Solder feeding devices forming part of a soldering iron
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67138—Apparatus for wiring semiconductor or solid state device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
- H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
- H01L31/0201—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules comprising specially adapted module bus-bar structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
- H01L31/046—PV modules composed of a plurality of thin film solar cells deposited on the same substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
- H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27636099A JP2001102610A (ja) | 1999-09-29 | 1999-09-29 | 半田バンプ付きリード線、太陽電池用リード線取付け装置及び太陽電池の製造方法 |
JP29273099A JP2001111085A (ja) | 1999-10-14 | 1999-10-14 | 太陽電池モジュールの製造方法 |
JP30553399A JP4504485B2 (ja) | 1999-10-27 | 1999-10-27 | 太陽電池用リード線半田付け装置 |
JP31239999A JP4459339B2 (ja) | 1999-11-02 | 1999-11-02 | 太陽電池用リード線取付け方法及びその装置 |
JP35740099A JP4451950B2 (ja) | 1999-12-16 | 1999-12-16 | 太陽電池用リード線自動半田付け方法及びその装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE487238T1 true ATE487238T1 (de) | 2010-11-15 |
Family
ID=27530619
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT00105317T ATE487238T1 (de) | 1999-09-29 | 2000-03-16 | Verfahren und gerät zur automatischen lötung von einem anschlussdraht an einer sonnenzellenbatterie |
Country Status (5)
Country | Link |
---|---|
US (1) | US6357649B1 (de) |
EP (2) | EP2259338B1 (de) |
AT (1) | ATE487238T1 (de) |
AU (1) | AU767276B2 (de) |
DE (1) | DE60045182D1 (de) |
Families Citing this family (48)
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EP1172863A3 (de) * | 2000-07-10 | 2007-02-14 | Sanyo Electric Co., Ltd. | Verfahren zur Installation von Solarzellenmoduln und Solarzellenmodul |
JP4783500B2 (ja) * | 2000-12-25 | 2011-09-28 | 株式会社カネカ | 封止前準備用シートセット装置、封止前準備用出力取出し線セット装置、及び自動封止前準備装置 |
US6471116B2 (en) * | 2001-01-19 | 2002-10-29 | Orthodyne Electronics Corporation | Wire bonding spool system |
JP2003037277A (ja) | 2001-05-15 | 2003-02-07 | Canon Inc | 光起電力素子及び光起電力素子の製造方法 |
CN101088168A (zh) | 2004-12-24 | 2007-12-12 | 皮雷利&C.有限公司 | 硅上锗中的光电探测器 |
DE602004028529D1 (de) | 2004-12-29 | 2010-09-16 | Pgt Photonics Spa | Verdrahtungsverfahren und -einrichtung |
DE102006022818A1 (de) * | 2006-05-13 | 2007-11-22 | Solarwatt Ag | Verbindungseinrichtung und Verfahren zur Verschaltung von Solarzellen |
DE102006035626A1 (de) * | 2006-07-31 | 2008-02-07 | Zentrum für Material- und Umwelttechnik GmbH | Verfahren zum Anbringen eines Verbindungsleiters an einer photovoltaischen Solarzelle |
US20080041919A1 (en) * | 2006-08-15 | 2008-02-21 | Athena Plus, Inc. | Devices for manipulating a work piece in a welding system |
SG146606A1 (en) * | 2007-05-04 | 2008-10-30 | Asm Tech Singapore Pte Ltd | Temperature control of a bonding stage |
JP4411338B2 (ja) * | 2007-07-13 | 2010-02-10 | シャープ株式会社 | 薄膜太陽電池モジュール |
WO2009049573A1 (de) * | 2007-10-19 | 2009-04-23 | Solarwatt Ag | Verbindungseinrichtung und verfahren zur verschaltung von solarzellen |
US7699208B2 (en) | 2007-11-30 | 2010-04-20 | Nordson Corporation | Soldering tip, soldering iron, and soldering system |
JP2010067968A (ja) * | 2008-09-11 | 2010-03-25 | Komax Holding Ag | 太陽素子に対して細長導体を付着するための方法および装置 |
WO2010126699A2 (en) | 2009-04-29 | 2010-11-04 | Hunter Douglas Industries B.V. | Architectural panels with organic photovoltaic interlayers and methods of forming the same |
US20100294332A1 (en) * | 2009-05-22 | 2010-11-25 | Sanyo Electric Co., Ltd. | Solar cell module and method of manufacturing the same |
CN102460729B (zh) * | 2009-06-25 | 2014-05-07 | 三洋电机株式会社 | 太阳能电池模块和太阳能电池模块的制造方法 |
PL2273567T3 (pl) * | 2009-06-30 | 2014-02-28 | Mikron Berlin Gmbh | Sposób i urządzenie do wyprężania taśmy lutowniczej |
TWI404218B (zh) * | 2009-08-14 | 2013-08-01 | Nexpower Technology Corp | A thin film solar cell module capable of improving contact between front and rear electrodes, and a method of manufacturing the same |
DE102010000520A1 (de) | 2010-02-23 | 2011-08-25 | SCHOTT Solar AG, 55122 | Verfahren und Vorrichtung zum Aufbringen von Lot auf ein Werkstück |
US20110225821A1 (en) * | 2010-03-17 | 2011-09-22 | DuPont Apollo Ltd. | Process of electrically connecting electrodes of a photovoltaic panel |
US8746537B2 (en) | 2010-03-31 | 2014-06-10 | Orthodyne Electronics Corporation | Ultrasonic bonding systems and methods of using the same |
DE112011101129B4 (de) * | 2010-03-31 | 2022-05-25 | Kulicke And Soffa Industries, Inc. | Ultraschall-Bondsysteme und Verfahren zu ihrer Verwendung |
DE102010016814B3 (de) * | 2010-05-05 | 2011-10-06 | Schott Solar Ag | Verfahren und Vorrichtung zum Aufbringen von Lot auf ein Werkstück |
US8231044B2 (en) | 2010-10-01 | 2012-07-31 | Orthodyne Electronics Corporation | Solar substrate ribbon bonding system |
CN102059438B (zh) * | 2010-11-17 | 2013-02-13 | 周俊雄 | 锂电池集流柱焊接装置 |
TWI413198B (zh) * | 2010-12-21 | 2013-10-21 | Powertech Technology Inc | 打線接合設備及打線接合方法 |
DE102011051024A1 (de) | 2011-05-17 | 2012-11-22 | Schott Solar Ag | Verfahren zum stoffschlüssigen Verbinden von Elementen |
JP5770567B2 (ja) * | 2011-08-25 | 2015-08-26 | 平田機工株式会社 | 接合装置及び接合方法 |
CN103252551B (zh) * | 2012-11-29 | 2017-05-17 | 东莞市亘高自动化机械有限公司 | 一种线材自动焊接工艺及线材自动焊接机 |
CN104551291A (zh) * | 2013-10-21 | 2015-04-29 | 泰科电子(上海)有限公司 | 自动焊接系统 |
US9444004B1 (en) * | 2014-05-02 | 2016-09-13 | Deployable Space Systems, Inc. | System and method for producing modular photovoltaic panel assemblies for space solar arrays |
CN104022180B (zh) * | 2014-05-12 | 2016-08-03 | 山东中晶新能源有限公司 | 提高光伏组件功率的焊接方法 |
CN104259612B (zh) * | 2014-09-23 | 2016-08-24 | 东莞市诠智自动化设备科技有限公司 | 一种dc线自动焊线机 |
CN205992538U (zh) * | 2014-10-27 | 2017-03-01 | 杰宜斯科技有限公司 | 搭接装置 |
CN104526178A (zh) * | 2014-12-31 | 2015-04-22 | 苏州博阳能源设备有限公司 | 太阳能电池汇流条焊接机 |
DE102015219611A1 (de) * | 2015-10-09 | 2017-04-13 | Ersa Gmbh | Lötmodul |
KR102101429B1 (ko) | 2016-05-18 | 2020-04-16 | 주식회사 엘지화학 | 리드 용접 장치, 이러한 리드 용접 장치를 통해 제조되는 배터리 모듈 및 이러한 배터리 모듈을 포함하는 배터리 팩 |
CN106238854B (zh) * | 2016-10-19 | 2018-10-09 | 惠州市锐达电子有限公司 | 一种连接线自动铆接、焊接设备 |
CN109454716A (zh) * | 2016-12-30 | 2019-03-12 | 东莞市凯勒帝数控科技有限公司 | 一种进行载料支撑的板材切槽机 |
CN106825839A (zh) * | 2017-03-22 | 2017-06-13 | 无锡先导智能装备股份有限公司 | 汇流条的供料机构以及供料方法 |
US10780515B2 (en) * | 2018-04-26 | 2020-09-22 | Raytheon Technologies Corporation | Auto-adaptive braze dispensing systems and methods |
CN108838590A (zh) * | 2018-07-13 | 2018-11-20 | 无锡奥特维科技股份有限公司 | 一种太阳能电池片焊接方法和装置 |
CN109952016B (zh) * | 2019-01-29 | 2020-08-14 | 深圳市邦正精密机械有限公司 | 一种全自动四头补强片贴合机 |
CN110473932B (zh) * | 2019-07-23 | 2020-11-24 | 杭州康奋威科技股份有限公司 | 一种太阳能光伏组件的汇流条焊接装置及其焊接方法 |
CN112975026A (zh) * | 2021-02-26 | 2021-06-18 | 宁夏小牛自动化设备有限公司 | 一种修复太阳能电池串的方法 |
CN115117203B (zh) * | 2022-07-05 | 2023-06-23 | 苏州伟昇智能装备有限公司 | 一种太阳能电池接线点位放高温布折引线一体设备 |
CN116493794B (zh) * | 2023-06-08 | 2023-10-31 | 广东洋基科技有限公司 | 一种锂电池电极柱同步定位的串并联焊接装置及方法 |
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JP3613851B2 (ja) | 1995-09-14 | 2005-01-26 | 株式会社カネカ | 集積化薄膜太陽電池 |
JP3676451B2 (ja) | 1995-11-08 | 2005-07-27 | 株式会社カネカ | 太陽電池モジュール及びその製造方法 |
JP2844330B2 (ja) | 1996-05-09 | 1999-01-06 | 黒田電気株式会社 | 超音波ハンダ付方法及び装置 |
US5731244A (en) * | 1996-05-28 | 1998-03-24 | Micron Technology, Inc. | Laser wire bonding for wire embedded dielectrics to integrated circuits |
JP3747096B2 (ja) | 1996-06-03 | 2006-02-22 | 株式会社カネカ | 太陽電池モジュール及びその製造方法 |
-
2000
- 2000-03-16 DE DE60045182T patent/DE60045182D1/de not_active Expired - Lifetime
- 2000-03-16 EP EP10172652.9A patent/EP2259338B1/de not_active Expired - Lifetime
- 2000-03-16 AT AT00105317T patent/ATE487238T1/de not_active IP Right Cessation
- 2000-03-16 AU AU22378/00A patent/AU767276B2/en not_active Ceased
- 2000-03-16 EP EP00105317A patent/EP1089347B1/de not_active Expired - Lifetime
- 2000-03-22 US US09/532,195 patent/US6357649B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1089347A2 (de) | 2001-04-04 |
EP2259338A1 (de) | 2010-12-08 |
DE60045182D1 (de) | 2010-12-16 |
AU767276B2 (en) | 2003-11-06 |
AU2237800A (en) | 2001-04-05 |
EP1089347A3 (de) | 2008-07-09 |
EP2259338B1 (de) | 2014-09-17 |
EP1089347B1 (de) | 2010-11-03 |
US6357649B1 (en) | 2002-03-19 |
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