DE69713843D1 - Verfahren zum Reflow-Löten einer oberflächenmontierten Halbleitervorrichtung - Google Patents

Verfahren zum Reflow-Löten einer oberflächenmontierten Halbleitervorrichtung

Info

Publication number
DE69713843D1
DE69713843D1 DE69713843T DE69713843T DE69713843D1 DE 69713843 D1 DE69713843 D1 DE 69713843D1 DE 69713843 T DE69713843 T DE 69713843T DE 69713843 T DE69713843 T DE 69713843T DE 69713843 D1 DE69713843 D1 DE 69713843D1
Authority
DE
Germany
Prior art keywords
semiconductor device
surface mount
reflow soldering
mount semiconductor
reflow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69713843T
Other languages
English (en)
Other versions
DE69713843T2 (de
Inventor
Naofumi Iwamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Application granted granted Critical
Publication of DE69713843D1 publication Critical patent/DE69713843D1/de
Publication of DE69713843T2 publication Critical patent/DE69713843T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/159—Using gravitational force; Processing against the gravity direction; Using centrifugal force
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE69713843T 1996-09-05 1997-04-24 Verfahren zum Reflow-Löten einer oberflächenmontierten Halbleitervorrichtung Expired - Fee Related DE69713843T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8234826A JPH1079400A (ja) 1996-09-05 1996-09-05 半導体装置の実装方法及び半導体装置の構造

Publications (2)

Publication Number Publication Date
DE69713843D1 true DE69713843D1 (de) 2002-08-14
DE69713843T2 DE69713843T2 (de) 2003-03-13

Family

ID=16976999

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69713843T Expired - Fee Related DE69713843T2 (de) 1996-09-05 1997-04-24 Verfahren zum Reflow-Löten einer oberflächenmontierten Halbleitervorrichtung

Country Status (7)

Country Link
US (1) US6019274A (de)
EP (1) EP0828293B1 (de)
JP (1) JPH1079400A (de)
KR (1) KR100361050B1 (de)
CN (1) CN1177206A (de)
DE (1) DE69713843T2 (de)
TW (1) TW355823B (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4161399B2 (ja) * 1998-03-12 2008-10-08 沖電気工業株式会社 半導体装置用樹脂基板及び半導体装置
KR100313500B1 (ko) * 1998-12-31 2001-12-12 김영환 테이프캐리어패키지및그제조방법
DE29912210U1 (de) * 1999-07-13 1999-09-16 Kostal Leopold Gmbh & Co Kg Elektrische Steckverbinderanordnung
KR100612048B1 (ko) * 2005-07-04 2006-08-14 한국전자통신연구원 칩 본딩 방법
DE202009005275U1 (de) 2009-09-14 2009-12-24 Yan, Li-Lan, Puzih City Verstärkungskonstruktion eines Radblocks
CN107331628A (zh) * 2017-08-07 2017-11-07 山东晶导微电子有限公司 一种电子元器件焊接装置和工艺
KR102578051B1 (ko) * 2018-06-01 2023-09-14 삼성전자주식회사 필름형 패키지 및 이를 구비한 디스플레이 장치
CN112530894A (zh) * 2020-11-25 2021-03-19 通富微电子股份有限公司技术研发分公司 功率模块及具有其的电子设备、键合金属片的制备方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4396140A (en) * 1981-01-27 1983-08-02 Bell Telephone Laboratories, Incorporated Method of bonding electronic components
JPH03136340A (ja) * 1989-10-23 1991-06-11 Shinkawa Ltd ワイヤボンデイング方法及び装置
JP2708927B2 (ja) * 1990-03-22 1998-02-04 アルプス電気株式会社 Ｉｃパッケージのリード端子の整形方法
EP0448266B1 (de) * 1990-03-23 1996-06-05 Motorola, Inc. Oberflächenmontierbare Halbleitervorrichtung mit selbstbeladenen Lötverbindungen
US5060846A (en) * 1990-04-23 1991-10-29 Motorola, Inc. Integrated load compensation device
US5080279A (en) * 1990-06-27 1992-01-14 At&T Bell Laboratories Method for tape automated bonding
JPH04315494A (ja) * 1991-04-15 1992-11-06 Fujitsu Ltd 回路部品へのワイヤ接続方法
JPH04361552A (ja) * 1991-06-10 1992-12-15 Fujitsu Ltd テープキャリアのアウタボンディングツール
JP2923096B2 (ja) * 1991-09-10 1999-07-26 株式会社日立製作所 テープキャリアパッケージおよび高周波加熱はんだ接合装置
DE4204882C2 (de) * 1992-02-18 1997-02-20 Helmut Walter Leicht Vorrichtung und Verfahren zum Bestücken von oberflächenmontierbaren Bauelementen mit kleinen Kontaktabständen
US5361966A (en) * 1992-03-17 1994-11-08 Kabushiki Kaisha Tokai Rika Denki Seisakusho Solder-bonded structure
JPH0613429A (ja) * 1992-06-26 1994-01-21 Sharp Corp 光硬化性樹脂を用いたアウターリードボンディング法
JPH06196610A (ja) * 1992-12-24 1994-07-15 Hitachi Ltd サブパッケージおよびサブパッケージを用いた半導体装置の実装方法
JP3178181B2 (ja) * 1993-09-06 2001-06-18 松下電器産業株式会社 アウターリードボンディング装置およびアウターリードボンディング方法
US5673479A (en) * 1993-12-20 1997-10-07 Lsi Logic Corporation Method for mounting a microelectronic circuit peripherally-leaded package including integral support member with spacer
JPH088352A (ja) * 1994-06-21 1996-01-12 Hitachi Cable Ltd 半導体装置および半導体実装基板の製造方法
JP2673098B2 (ja) * 1994-08-03 1997-11-05 インターナショナル・ビジネス・マシーンズ・コーポレイション プリント配線基板及び実装構造体
JP2606606B2 (ja) * 1994-10-14 1997-05-07 日本電気株式会社 半導体装置の製造方法
US5817208A (en) * 1995-08-04 1998-10-06 Matsushita Electronics Corporation Resin sealing die, resin-sealed-type semiconductor device and method of manufacturing the device

Also Published As

Publication number Publication date
EP0828293B1 (de) 2002-07-10
EP0828293A1 (de) 1998-03-11
DE69713843T2 (de) 2003-03-13
US6019274A (en) 2000-02-01
KR19980024072A (ko) 1998-07-06
TW355823B (en) 1999-04-11
KR100361050B1 (ko) 2003-02-19
JPH1079400A (ja) 1998-03-24
CN1177206A (zh) 1998-03-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee