DE8600928U1 - - Google Patents

Info

Publication number
DE8600928U1
DE8600928U1 DE19868600928 DE8600928U DE8600928U1 DE 8600928 U1 DE8600928 U1 DE 8600928U1 DE 19868600928 DE19868600928 DE 19868600928 DE 8600928 U DE8600928 U DE 8600928U DE 8600928 U1 DE8600928 U1 DE 8600928U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19868600928
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Intellectual Property and Standards GmbH
Original Assignee
Philips Patentverwaltung GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Patentverwaltung GmbH filed Critical Philips Patentverwaltung GmbH
Priority to DE19868600928 priority Critical patent/DE8600928U1/de
Publication of DE8600928U1 publication Critical patent/DE8600928U1/de
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/0278Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0284Details of three-dimensional rigid printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/119Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0183Dielectric layers
    • H05K2201/0191Dielectric layers wherein the thickness of the dielectric plays an important role
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09036Recesses or grooves in insulating substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09118Moulded substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302Bending a rigid substrate; Breaking rigid substrates by bending
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
DE19868600928 1986-01-16 1986-01-16 Expired DE8600928U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19868600928 DE8600928U1 (de) 1986-01-16 1986-01-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19868600928 DE8600928U1 (de) 1986-01-16 1986-01-16

Publications (1)

Publication Number Publication Date
DE8600928U1 true DE8600928U1 (de) 1987-06-11

Family

ID=6790606

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19868600928 Expired DE8600928U1 (de) 1986-01-16 1986-01-16

Country Status (1)

Country Link
DE (1) DE8600928U1 (de)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3717306A1 (de) * 1987-05-22 1988-12-01 Ruf Kg Wilhelm Verfahren zum herstellen eines elektrischen kontaktes und nach dem verfahren hergestellte leiterbahnplatte
DE3831551A1 (de) * 1987-09-16 1989-04-06 Papst Motoren Gmbh & Co Kg Leiterplatte
DE4118398A1 (de) * 1991-06-05 1992-12-10 Ant Nachrichtentech Elektronik-baugruppe mit metallgehaeuse
DE4305793A1 (de) * 1993-02-25 1994-09-01 Telefunken Microelectron Leistungsmodul
DE4422216A1 (de) * 1993-06-25 1995-01-05 Fuji Electric Co Ltd Mehrlagige metallische Leiterplatte und gegossener Baustein
DE4338277A1 (de) * 1993-07-17 1995-01-19 Abb Patent Gmbh Flüssigkeitsgekühltes Stromrichtermodul mit Beschaltungsbauelementen für abschaltbare Leistungshalbleiter
DE4329083A1 (de) * 1993-08-30 1995-03-02 Telefunken Microelectron Baugruppe zur Aufnahme elektronischer Bauelemente
DE29515378U1 (de) * 1995-09-26 1995-11-23 Kern Siegfried Dipl Ing Stromversorgungseinheit
US5619012A (en) * 1993-12-10 1997-04-08 Philips Electronics North America Corporation Hinged circuit assembly with multi-conductor framework
DE10129788A1 (de) * 2001-06-20 2003-01-23 Siemens Ag Kunststoffrahmen zur Montage eines elektronischen Starkstrom-Steuergeräts
DE202013104426U1 (de) 2013-09-27 2013-12-03 Markus Kowol Montagesystem und damit montierte Vorrichtung

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3717306A1 (de) * 1987-05-22 1988-12-01 Ruf Kg Wilhelm Verfahren zum herstellen eines elektrischen kontaktes und nach dem verfahren hergestellte leiterbahnplatte
DE3831551A1 (de) * 1987-09-16 1989-04-06 Papst Motoren Gmbh & Co Kg Leiterplatte
DE3831551C2 (de) * 1987-09-16 2001-11-29 Papst Licensing Gmbh & Co Kg Metallkernleiterplatte mit Ausnehmnung zur Aufnahme von Bauelementen
DE4118398A1 (de) * 1991-06-05 1992-12-10 Ant Nachrichtentech Elektronik-baugruppe mit metallgehaeuse
DE4305793A1 (de) * 1993-02-25 1994-09-01 Telefunken Microelectron Leistungsmodul
US5672414A (en) * 1993-06-25 1997-09-30 Fuji Electric Co., Ltd. Multilayered printed board structure
DE4422216A1 (de) * 1993-06-25 1995-01-05 Fuji Electric Co Ltd Mehrlagige metallische Leiterplatte und gegossener Baustein
DE4338277A1 (de) * 1993-07-17 1995-01-19 Abb Patent Gmbh Flüssigkeitsgekühltes Stromrichtermodul mit Beschaltungsbauelementen für abschaltbare Leistungshalbleiter
DE4329083A1 (de) * 1993-08-30 1995-03-02 Telefunken Microelectron Baugruppe zur Aufnahme elektronischer Bauelemente
US6445592B1 (en) 1993-08-30 2002-09-03 Temic Telefunken Microelectronic Gmbh Electronic assembly
US5619012A (en) * 1993-12-10 1997-04-08 Philips Electronics North America Corporation Hinged circuit assembly with multi-conductor framework
DE29515378U1 (de) * 1995-09-26 1995-11-23 Kern Siegfried Dipl Ing Stromversorgungseinheit
DE10129788A1 (de) * 2001-06-20 2003-01-23 Siemens Ag Kunststoffrahmen zur Montage eines elektronischen Starkstrom-Steuergeräts
DE10129788B4 (de) * 2001-06-20 2005-11-10 Siemens Ag Kunststoffrahmen zur Montage eines elektronischen Starkstrom-Steuergeräts
DE202013104426U1 (de) 2013-09-27 2013-12-03 Markus Kowol Montagesystem und damit montierte Vorrichtung

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