DE8600928U1 - - Google Patents
Info
- Publication number
- DE8600928U1 DE8600928U1 DE19868600928 DE8600928U DE8600928U1 DE 8600928 U1 DE8600928 U1 DE 8600928U1 DE 19868600928 DE19868600928 DE 19868600928 DE 8600928 U DE8600928 U DE 8600928U DE 8600928 U1 DE8600928 U1 DE 8600928U1
- Authority
- DE
- Germany
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19868600928 DE8600928U1 (de) | 1986-01-16 | 1986-01-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19868600928 DE8600928U1 (de) | 1986-01-16 | 1986-01-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE8600928U1 true DE8600928U1 (de) | 1987-06-11 |
Family
ID=6790606
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19868600928 Expired DE8600928U1 (de) | 1986-01-16 | 1986-01-16 |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE8600928U1 (de) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3717306A1 (de) * | 1987-05-22 | 1988-12-01 | Ruf Kg Wilhelm | Verfahren zum herstellen eines elektrischen kontaktes und nach dem verfahren hergestellte leiterbahnplatte |
DE3831551A1 (de) * | 1987-09-16 | 1989-04-06 | Papst Motoren Gmbh & Co Kg | Leiterplatte |
DE4118398A1 (de) * | 1991-06-05 | 1992-12-10 | Ant Nachrichtentech | Elektronik-baugruppe mit metallgehaeuse |
DE4305793A1 (de) * | 1993-02-25 | 1994-09-01 | Telefunken Microelectron | Leistungsmodul |
DE4422216A1 (de) * | 1993-06-25 | 1995-01-05 | Fuji Electric Co Ltd | Mehrlagige metallische Leiterplatte und gegossener Baustein |
DE4338277A1 (de) * | 1993-07-17 | 1995-01-19 | Abb Patent Gmbh | Flüssigkeitsgekühltes Stromrichtermodul mit Beschaltungsbauelementen für abschaltbare Leistungshalbleiter |
DE4329083A1 (de) * | 1993-08-30 | 1995-03-02 | Telefunken Microelectron | Baugruppe zur Aufnahme elektronischer Bauelemente |
DE29515378U1 (de) * | 1995-09-26 | 1995-11-23 | Kern Siegfried Dipl Ing | Stromversorgungseinheit |
US5619012A (en) * | 1993-12-10 | 1997-04-08 | Philips Electronics North America Corporation | Hinged circuit assembly with multi-conductor framework |
DE10129788A1 (de) * | 2001-06-20 | 2003-01-23 | Siemens Ag | Kunststoffrahmen zur Montage eines elektronischen Starkstrom-Steuergeräts |
DE202013104426U1 (de) | 2013-09-27 | 2013-12-03 | Markus Kowol | Montagesystem und damit montierte Vorrichtung |
-
1986
- 1986-01-16 DE DE19868600928 patent/DE8600928U1/de not_active Expired
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3717306A1 (de) * | 1987-05-22 | 1988-12-01 | Ruf Kg Wilhelm | Verfahren zum herstellen eines elektrischen kontaktes und nach dem verfahren hergestellte leiterbahnplatte |
DE3831551A1 (de) * | 1987-09-16 | 1989-04-06 | Papst Motoren Gmbh & Co Kg | Leiterplatte |
DE3831551C2 (de) * | 1987-09-16 | 2001-11-29 | Papst Licensing Gmbh & Co Kg | Metallkernleiterplatte mit Ausnehmnung zur Aufnahme von Bauelementen |
DE4118398A1 (de) * | 1991-06-05 | 1992-12-10 | Ant Nachrichtentech | Elektronik-baugruppe mit metallgehaeuse |
DE4305793A1 (de) * | 1993-02-25 | 1994-09-01 | Telefunken Microelectron | Leistungsmodul |
US5672414A (en) * | 1993-06-25 | 1997-09-30 | Fuji Electric Co., Ltd. | Multilayered printed board structure |
DE4422216A1 (de) * | 1993-06-25 | 1995-01-05 | Fuji Electric Co Ltd | Mehrlagige metallische Leiterplatte und gegossener Baustein |
DE4338277A1 (de) * | 1993-07-17 | 1995-01-19 | Abb Patent Gmbh | Flüssigkeitsgekühltes Stromrichtermodul mit Beschaltungsbauelementen für abschaltbare Leistungshalbleiter |
DE4329083A1 (de) * | 1993-08-30 | 1995-03-02 | Telefunken Microelectron | Baugruppe zur Aufnahme elektronischer Bauelemente |
US6445592B1 (en) | 1993-08-30 | 2002-09-03 | Temic Telefunken Microelectronic Gmbh | Electronic assembly |
US5619012A (en) * | 1993-12-10 | 1997-04-08 | Philips Electronics North America Corporation | Hinged circuit assembly with multi-conductor framework |
DE29515378U1 (de) * | 1995-09-26 | 1995-11-23 | Kern Siegfried Dipl Ing | Stromversorgungseinheit |
DE10129788A1 (de) * | 2001-06-20 | 2003-01-23 | Siemens Ag | Kunststoffrahmen zur Montage eines elektronischen Starkstrom-Steuergeräts |
DE10129788B4 (de) * | 2001-06-20 | 2005-11-10 | Siemens Ag | Kunststoffrahmen zur Montage eines elektronischen Starkstrom-Steuergeräts |
DE202013104426U1 (de) | 2013-09-27 | 2013-12-03 | Markus Kowol | Montagesystem und damit montierte Vorrichtung |