AU2001242205A1 - Element and method for connecting constituents of an electronic assembly - Google Patents

Element and method for connecting constituents of an electronic assembly

Info

Publication number
AU2001242205A1
AU2001242205A1 AU2001242205A AU4220501A AU2001242205A1 AU 2001242205 A1 AU2001242205 A1 AU 2001242205A1 AU 2001242205 A AU2001242205 A AU 2001242205A AU 4220501 A AU4220501 A AU 4220501A AU 2001242205 A1 AU2001242205 A1 AU 2001242205A1
Authority
AU
Australia
Prior art keywords
constituents
electronic assembly
electronic
assembly
connecting constituents
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001242205A
Inventor
Walter Schmidt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dyconex Patente AG
Original Assignee
Dyconex Patente AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dyconex Patente AG filed Critical Dyconex Patente AG
Publication of AU2001242205A1 publication Critical patent/AU2001242205A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Multi-Conductor Connections (AREA)
AU2001242205A 2000-03-31 2001-03-30 Element and method for connecting constituents of an electronic assembly Abandoned AU2001242205A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US19337000P 2000-03-31 2000-03-31
US60193370 2000-03-31
PCT/CH2001/000202 WO2001075970A2 (en) 2000-03-31 2001-03-30 Element and method for connecting constituents of an electronic assembly

Publications (1)

Publication Number Publication Date
AU2001242205A1 true AU2001242205A1 (en) 2001-10-15

Family

ID=42830464

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001242205A Abandoned AU2001242205A1 (en) 2000-03-31 2001-03-30 Element and method for connecting constituents of an electronic assembly

Country Status (2)

Country Link
AU (1) AU2001242205A1 (en)
WO (1) WO2001075970A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001217279A (en) * 2000-02-01 2001-08-10 Mitsubishi Electric Corp High density mounter

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0284820A3 (en) * 1987-03-04 1989-03-08 Canon Kabushiki Kaisha Electrically connecting member, and electric circuit member and electric circuit device with the connecting member
EP0501358B1 (en) * 1991-02-25 1997-01-15 Canon Kabushiki Kaisha Connecting method and apparatus for electric circuit components
EP0560072A3 (en) * 1992-03-13 1993-10-06 Nitto Denko Corporation Anisotropic electrically conductive adhesive film and connection structure using the same
US5474458A (en) * 1993-07-13 1995-12-12 Fujitsu Limited Interconnect carriers having high-density vertical connectors and methods for making the same
US6022761A (en) * 1996-05-28 2000-02-08 Motorola, Inc. Method for coupling substrates and structure
US6034437A (en) * 1997-06-06 2000-03-07 Rohm Co., Ltd. Semiconductor device having a matrix of bonding pads

Also Published As

Publication number Publication date
WO2001075970A2 (en) 2001-10-11
WO2001075970A3 (en) 2002-02-28

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