WO2001075970A3 - Element and method for connecting constituents of an electronic assembly - Google Patents

Element and method for connecting constituents of an electronic assembly Download PDF

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Publication number
WO2001075970A3
WO2001075970A3 PCT/CH2001/000202 CH0100202W WO0175970A3 WO 2001075970 A3 WO2001075970 A3 WO 2001075970A3 CH 0100202 W CH0100202 W CH 0100202W WO 0175970 A3 WO0175970 A3 WO 0175970A3
Authority
WO
WIPO (PCT)
Prior art keywords
constituents
openings
layer
assembly
electrically
Prior art date
Application number
PCT/CH2001/000202
Other languages
French (fr)
Other versions
WO2001075970A2 (en
Inventor
Walter Schmidt
Original Assignee
Heinze Dyconex Patente
Walter Schmidt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heinze Dyconex Patente, Walter Schmidt filed Critical Heinze Dyconex Patente
Priority to AU2001242205A priority Critical patent/AU2001242205A1/en
Priority to PCT/CH2001/000202 priority patent/WO2001075970A2/en
Publication of WO2001075970A2 publication Critical patent/WO2001075970A2/en
Publication of WO2001075970A3 publication Critical patent/WO2001075970A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

An interface element (1) for a standardized connecting constituents of an assembly with integrated circuits replaces conventional connecting ICs to Power supply boards by electrically insulating foils or pasted. It may further be used as interface mat between different components of an electrical connecting element, e.g. a foil like PCB/HDI and a hard core serving as heat sink. It comprises a layer (2) of dielectric material with a pattern of regularly arranged through openings, and electrically conducting elements (3) placed in these openings for electrically connecting constituents of an assembly arranged on each side of the layer, the elements forming through connections.
PCT/CH2001/000202 2000-03-31 2001-03-30 Element and method for connecting constituents of an electronic assembly WO2001075970A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2001242205A AU2001242205A1 (en) 2000-03-31 2001-03-30 Element and method for connecting constituents of an electronic assembly
PCT/CH2001/000202 WO2001075970A2 (en) 2000-03-31 2001-03-30 Element and method for connecting constituents of an electronic assembly

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US19337000P 2000-03-31 2000-03-31
US60/193,370 2000-03-31
PCT/CH2001/000202 WO2001075970A2 (en) 2000-03-31 2001-03-30 Element and method for connecting constituents of an electronic assembly

Publications (2)

Publication Number Publication Date
WO2001075970A2 WO2001075970A2 (en) 2001-10-11
WO2001075970A3 true WO2001075970A3 (en) 2002-02-28

Family

ID=42830464

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CH2001/000202 WO2001075970A2 (en) 2000-03-31 2001-03-30 Element and method for connecting constituents of an electronic assembly

Country Status (2)

Country Link
AU (1) AU2001242205A1 (en)
WO (1) WO2001075970A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001217279A (en) * 2000-02-01 2001-08-10 Mitsubishi Electric Corp High density mounter

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0560072A2 (en) * 1992-03-13 1993-09-15 Nitto Denko Corporation Anisotropic electrically conductive adhesive film and connection structure using the same
US5474458A (en) * 1993-07-13 1995-12-12 Fujitsu Limited Interconnect carriers having high-density vertical connectors and methods for making the same
EP0810649A2 (en) * 1996-05-28 1997-12-03 Motorola, Inc. Method for coupling substrates and structure
EP0854506A2 (en) * 1987-03-04 1998-07-22 Canon Kabushiki Kaisha Electrically connecting member and electric circuit member
US6015081A (en) * 1991-02-25 2000-01-18 Canon Kabushiki Kaisha Electrical connections using deforming compression
US6034437A (en) * 1997-06-06 2000-03-07 Rohm Co., Ltd. Semiconductor device having a matrix of bonding pads

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0854506A2 (en) * 1987-03-04 1998-07-22 Canon Kabushiki Kaisha Electrically connecting member and electric circuit member
US6015081A (en) * 1991-02-25 2000-01-18 Canon Kabushiki Kaisha Electrical connections using deforming compression
EP0560072A2 (en) * 1992-03-13 1993-09-15 Nitto Denko Corporation Anisotropic electrically conductive adhesive film and connection structure using the same
US5474458A (en) * 1993-07-13 1995-12-12 Fujitsu Limited Interconnect carriers having high-density vertical connectors and methods for making the same
EP0810649A2 (en) * 1996-05-28 1997-12-03 Motorola, Inc. Method for coupling substrates and structure
US6034437A (en) * 1997-06-06 2000-03-07 Rohm Co., Ltd. Semiconductor device having a matrix of bonding pads

Also Published As

Publication number Publication date
AU2001242205A1 (en) 2001-10-15
WO2001075970A2 (en) 2001-10-11

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