AU2001288487A1 - Electronic assembly comprising solderable thermal interface and methods of manufacture - Google Patents

Electronic assembly comprising solderable thermal interface and methods of manufacture

Info

Publication number
AU2001288487A1
AU2001288487A1 AU2001288487A AU8848701A AU2001288487A1 AU 2001288487 A1 AU2001288487 A1 AU 2001288487A1 AU 2001288487 A AU2001288487 A AU 2001288487A AU 8848701 A AU8848701 A AU 8848701A AU 2001288487 A1 AU2001288487 A1 AU 2001288487A1
Authority
AU
Australia
Prior art keywords
manufacture
methods
thermal interface
electronic assembly
solderable thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001288487A
Inventor
Biswajt Sur
Nagesh Vodrahalli
Thomas Workman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of AU2001288487A1 publication Critical patent/AU2001288487A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
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    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
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    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/151—Die mounting substrate
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    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
AU2001288487A 2000-08-31 2001-08-29 Electronic assembly comprising solderable thermal interface and methods of manufacture Abandoned AU2001288487A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/652,430 US6724078B1 (en) 2000-08-31 2000-08-31 Electronic assembly comprising solderable thermal interface
US09/652,430 2000-08-31
PCT/US2001/026902 WO2002019424A2 (en) 2000-08-31 2001-08-29 Electronic assembly comprising solderable thermal interface and methods of manufacture

Publications (1)

Publication Number Publication Date
AU2001288487A1 true AU2001288487A1 (en) 2002-03-13

Family

ID=24616803

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001288487A Abandoned AU2001288487A1 (en) 2000-08-31 2001-08-29 Electronic assembly comprising solderable thermal interface and methods of manufacture

Country Status (8)

Country Link
US (2) US6724078B1 (en)
EP (2) EP1314199A2 (en)
CN (1) CN1258815C (en)
AU (1) AU2001288487A1 (en)
HK (1) HK1052799A1 (en)
MY (1) MY134807A (en)
TW (1) TW550774B (en)
WO (1) WO2002019424A2 (en)

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US6724078B1 (en) 2004-04-20
CN1258815C (en) 2006-06-07

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