SE8206753L - Identitetskort med en integrerad krets - Google Patents

Identitetskort med en integrerad krets

Info

Publication number
SE8206753L
SE8206753L SE8206753A SE8206753A SE8206753L SE 8206753 L SE8206753 L SE 8206753L SE 8206753 A SE8206753 A SE 8206753A SE 8206753 A SE8206753 A SE 8206753A SE 8206753 L SE8206753 L SE 8206753L
Authority
SE
Sweden
Prior art keywords
card
module
recess
layers
carrier element
Prior art date
Application number
SE8206753A
Other languages
English (en)
Other versions
SE455899B (sv
SE8206753D0 (sv
Inventor
J Hoppe
Y Haghiri-Tehrani
Original Assignee
Gao Ges Automation Org
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gao Ges Automation Org filed Critical Gao Ges Automation Org
Publication of SE8206753D0 publication Critical patent/SE8206753D0/sv
Publication of SE8206753L publication Critical patent/SE8206753L/sv
Publication of SE455899B publication Critical patent/SE455899B/sv

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
    • G01S7/523—Details of pulse systems
    • G01S7/526—Receivers
    • G01S7/529—Gain of receiver varied automatically during pulse-recurrence period
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S283/00—Printed matter
    • Y10S283/904—Credit card

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Structure Of Printed Boards (AREA)
  • Financial Or Insurance-Related Operations Such As Payment And Settlement (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
SE8206753A 1981-12-24 1982-11-26 Identitetskort med en pa ett berelement anordnad integrerad krets samt ett berelement for inbyggnad av en sadan integrerad krets SE455899B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3151408A DE3151408C1 (de) 1981-12-24 1981-12-24 Ausweiskarte mit einem IC-Baustein

Publications (3)

Publication Number Publication Date
SE8206753D0 SE8206753D0 (sv) 1982-11-26
SE8206753L true SE8206753L (sv) 1983-06-25
SE455899B SE455899B (sv) 1988-08-15

Family

ID=6149744

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8206753A SE455899B (sv) 1981-12-24 1982-11-26 Identitetskort med en pa ett berelement anordnad integrerad krets samt ett berelement for inbyggnad av en sadan integrerad krets

Country Status (10)

Country Link
US (2) US4552383A (sv)
JP (1) JPS58125892A (sv)
BE (1) BE895353A (sv)
CH (2) CH659333A5 (sv)
DE (1) DE3151408C1 (sv)
FR (1) FR2519166B1 (sv)
GB (2) GB2112324B (sv)
IT (1) IT1153085B (sv)
NL (1) NL188275C (sv)
SE (1) SE455899B (sv)

Families Citing this family (98)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2512990B1 (fr) * 1981-09-11 1987-06-19 Radiotechnique Compelec Procede pour fabriquer une carte de paiement electronique, et carte realisee selon ce procede
JPS5974639A (ja) * 1982-10-22 1984-04-27 Hitachi Ltd 薄板状集積回路基板の製法
FR2555780B1 (fr) * 1983-11-29 1986-04-11 Flonic Sa Procede de fabrication de cartes a memoire et cartes obtenues suivant ce procede
DE3466108D1 (en) * 1983-06-09 1987-10-15 Flonic Sa Method of producing memory cards, and cards obtained thereby
FR2548409B1 (fr) * 1983-06-29 1985-11-15 Sligos Procede pour la fabrication de cartes a memoire, installation et cartes a memoire obtenues
FR2552252B1 (fr) * 1983-09-21 1987-07-31 Dassault Electronique Lecteur mixte pour cartes a piste magnetique et/ou a puce electronique
JPS60142489A (ja) * 1983-12-28 1985-07-27 Dainippon Printing Co Ltd Ｉｃカ−ド
US5140517A (en) * 1984-03-19 1992-08-18 Omron Tateisi Electronics Co. IC card with keyboard for prestoring transaction data
US4876441A (en) * 1984-03-27 1989-10-24 Casio Computer Co., Ltd. Card-like electronic apparatus
US4754418A (en) * 1984-03-27 1988-06-28 Casio Computer Co., Ltd. Combined electronic calculator and credit card
JPS6112166U (ja) * 1984-06-28 1986-01-24 フジプラ株式会社 カ−ド
JPS6115289A (ja) * 1984-06-29 1986-01-23 Mitsubishi Plastics Ind Ltd メモリ−カ−ド
JPS61123990A (ja) * 1984-11-05 1986-06-11 Casio Comput Co Ltd Ｉｃカ−ド
JPS61133489A (ja) * 1984-12-03 1986-06-20 Mitsubishi Plastics Ind Ltd メモリ−カ−ド
JPH0752461B2 (ja) * 1985-03-04 1995-06-05 カシオ計算機株式会社 Ｉｃカ−ド
FR2581480A1 (fr) * 1985-04-10 1986-11-07 Ebauches Electroniques Sa Unite electronique notamment pour carte a microcircuits et carte comprenant une telle unite
FR2580416B1 (fr) * 1985-04-12 1987-06-05 Radiotechnique Compelec Procede et dispositif pour fabriquer une carte d'identification electronique
JPS61265126A (ja) * 1985-05-20 1986-11-22 浜松ホトニクス株式会社 眼底カメラ装置
FR2584235B1 (fr) * 1985-06-26 1988-04-22 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
US4889980A (en) * 1985-07-10 1989-12-26 Casio Computer Co., Ltd. Electronic memory card and method of manufacturing same
JPH0751390B2 (ja) * 1985-07-10 1995-06-05 カシオ計算機株式会社 Ｉｃカ−ド
DE3525827A1 (de) * 1985-07-19 1987-02-19 Friedrich Uwe Rene Vorrichtung zum softwareschutz
JPH0655555B2 (ja) * 1985-07-27 1994-07-27 大日本印刷株式会社 Ｉｃカ−ドおよびｉｃモジュール
DE3689094T2 (de) 1985-07-27 1994-03-10 Dainippon Printing Co Ltd IC-Karte.
DE3528686A1 (de) * 1985-08-09 1987-02-12 Oldenbourg Graphik R Verfahren und herstellung einer ausweiskarte und ausweiskarte
JPH0530937Y2 (sv) * 1985-10-04 1993-08-09
US4825056A (en) * 1985-11-21 1989-04-25 Kabushiki Kaisha Toshiba Thin-film electromagnetic transducer
DE3624852A1 (de) * 1986-01-10 1987-07-16 Orga Druck Gmbh Elektronische daten- und/oder programmtraeger und verfahren zu seiner herstellung
US4755661A (en) * 1986-01-10 1988-07-05 Ruebsam Herrn H Connection of electronic components in a card
EP0246893A3 (en) * 1986-05-21 1989-03-22 Hitachi, Ltd. Semiconductor device comprising an insulating wiring substrate and method of manufacturing it
JPS6351195A (ja) * 1986-08-20 1988-03-04 イビデン株式会社 Ｉｃカ−ド用プリント配線板
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
JPS63141790A (ja) * 1986-12-03 1988-06-14 菱電化成株式会社 識別カ−ド
JPH0696357B2 (ja) * 1986-12-11 1994-11-30 三菱電機株式会社 Ｉｃカードの製造方法
JPH08479B2 (ja) * 1986-12-11 1996-01-10 三菱電機株式会社 Ｉｃカードの製造方法
US5304513A (en) * 1987-07-16 1994-04-19 Gao Gesellschaft Fur Automation Und Organisation Mbh Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame
FR2620586A1 (fr) * 1987-09-14 1989-03-17 Em Microelectronic Marin Sa Procede de fabrication de modules electroniques, notamment pour cartes a microcircuits
US4931623A (en) * 1987-11-14 1990-06-05 Kabushiki Kaisha Toshiba Portable storage medium
FR2625350B1 (fr) * 1987-12-29 1991-05-24 Bull Cp8 Carte a microcircuits electroniques et procede de fabrication de cette carte
US4921160A (en) * 1988-02-29 1990-05-01 American Telephone And Telegraph Company Personal data card and method of constructing the same
FR2629236B1 (fr) * 1988-03-22 1991-09-27 Schlumberger Ind Sa Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede
JPH039890A (ja) * 1989-06-06 1991-01-17 Toshiba Corp Ｉｃカード
US5155068A (en) * 1989-08-31 1992-10-13 Sharp Kabushiki Kaisha Method for manufacturing an IC module for an IC card whereby an IC device and surrounding encapsulant are thinned by material removal
CA2027823C (en) * 1989-10-31 1994-11-08 Tomoshige Oka Ic card having an integrated circuit module and air discharge opening
JP2687661B2 (ja) * 1990-03-26 1997-12-08 三菱電機株式会社 Ｉｃカードの製造方法
DE4040770C2 (de) * 1990-12-19 1999-11-11 Gao Ges Automation Org Datenträger mit integriertem Schaltkreis
US5272596A (en) * 1991-06-24 1993-12-21 At&T Bell Laboratories Personal data card fabricated from a polymer thick-film circuit
DE4122049A1 (de) * 1991-07-03 1993-01-07 Gao Ges Automation Org Verfahren zum einbau eines traegerelements
DE9113601U1 (de) * 1991-10-31 1993-03-04 Schneider, Edgar, 8057 Günzenhausen Multifunktionaler Schutzschild für mikroelektronische Schaltungen und Sensoren insbesondere für sog. Chip-Karten
US5374818A (en) * 1992-03-09 1994-12-20 Control Module Inc. Identification means with integral memory device
JP3169965B2 (ja) * 1992-08-12 2001-05-28 沖電気工業株式会社 Ｉｃカード
DE4234158A1 (de) * 1992-10-10 1994-04-14 Walter Holzer Duale Datenträgerkarte
US5689136A (en) 1993-08-04 1997-11-18 Hitachi, Ltd. Semiconductor device and fabrication method
DE4337921C2 (de) * 1993-11-06 1998-09-03 Ods Gmbh & Co Kg Kontaktlose Chipkarte mit Antennenspule
DE4343206A1 (de) * 1993-12-17 1995-06-22 Bayer Ag Verfahren zur Herstellung von Rohlingen für Ausweiskarten
DE4403753C1 (de) * 1994-02-08 1995-07-20 Angewandte Digital Elektronik Kombinierte Chipkarte
US5661336A (en) * 1994-05-03 1997-08-26 Phelps, Jr.; Douglas Wallace Tape application platform and processes therefor
DE4424396C2 (de) * 1994-07-11 1996-12-12 Ibm Trägerelement zum Einbau in Chipkarten oder anderen Datenträgerkarten
USD379006S (en) * 1995-05-30 1997-04-29 Solaic (Societe Anonyme) Smart card with m-shaped isolation region
DE19528730A1 (de) * 1995-08-04 1997-02-06 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Datenträgers
US6072698A (en) * 1995-09-27 2000-06-06 Siemens Aktiengesellschaft Chip module with heat insulation for incorporation into a chip card
DE69631829T2 (de) * 1996-12-02 2005-01-13 Swisscom Mobile Ag IC-Karte und Program für IC-Karten
JPH1134553A (ja) * 1997-07-18 1999-02-09 Rohm Co Ltd Ｉｃモジュール、およびその製造方法、ならびにこれを備えたｉｃカード
FR2778769B1 (fr) * 1998-05-15 2001-11-02 Gemplus Sca Carte a circuit integre comportant un bornier d'interface et procede de fabrication d'une telle carte
FR2788882A1 (fr) * 1999-01-27 2000-07-28 Schlumberger Systems & Service Dispositif a circuits integres, module electronique pour carte a puce utilisant le dispositif et procede de fabrication dudit dispositif
US6221545B1 (en) 1999-09-09 2001-04-24 Imation Corp. Adhesives for preparing a multilayer laminate featuring an ink-bearing surface bonded to a second surface
TW449796B (en) * 2000-08-02 2001-08-11 Chiou Wen Wen Manufacturing method for integrated circuit module
TWI249712B (en) * 2001-02-28 2006-02-21 Hitachi Ltd Memory card and its manufacturing method
US6601771B2 (en) * 2001-04-09 2003-08-05 Smart Card Integrators, Inc. Combined smartcard and magnetic-stripe card and reader and associated method
US6851617B2 (en) 2002-04-19 2005-02-08 Avery Dennison Corporation Laser imageable RFID label/tag
US20050165683A1 (en) * 2004-01-13 2005-07-28 Acquenetta Taylor System and method for using a universal payment card for transportation vehicles for hire
KR100643756B1 (ko) 2004-09-10 2006-11-10 삼성전자주식회사 유연소자, 유연압력센서, 및 이들의 제조방법
US20080297341A1 (en) * 2006-09-11 2008-12-04 Mcclanahan James B Real-time passenger identification, passenger onboard inventory, location and safety monitoring system
EP2042576A1 (en) * 2007-09-20 2009-04-01 Agfa-Gevaert Security laminates with interlaminated transparent embossed polymer hologram.
WO2009037332A1 (en) * 2007-09-20 2009-03-26 Agfa-Gevaert N.V. Security laminates with interlaminated transparent embossed polymer hologram
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CN105150656A (zh) * 2008-04-01 2015-12-16 爱克发-格法特公司 具有可通过触摸察觉的安全性特征的安全性层压板
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EP2181858A1 (en) * 2008-11-04 2010-05-05 Agfa-Gevaert N.V. Security document and methods of producing it
EP2199100A1 (en) * 2008-12-22 2010-06-23 Agfa-Gevaert N.V. Security laminates for security documents.
EP2332738B1 (en) 2009-12-10 2012-07-04 Agfa-Gevaert Security document with security feature on edge
PL2335937T3 (pl) 2009-12-18 2013-06-28 Agfa Gevaert Znakowalna laserowo folia zabezpieczająca
EP2335938B1 (en) 2009-12-18 2013-02-20 Agfa-Gevaert Laser markable security film
DE102010011517A1 (de) * 2010-03-15 2011-09-15 Smartrac Ip B.V. Laminataufbau für eine Chipkarte und Verfahren zu dessen Herstellung
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
USD707682S1 (en) * 2012-12-05 2014-06-24 Logomotion, S.R.O. Memory card
US9888283B2 (en) 2013-03-13 2018-02-06 Nagrastar Llc Systems and methods for performing transport I/O
US9647997B2 (en) 2013-03-13 2017-05-09 Nagrastar, Llc USB interface for performing transport I/O
USD758372S1 (en) 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
USD759022S1 (en) * 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
USD729808S1 (en) * 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
USD780763S1 (en) 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
JP1647726S (sv) 2018-02-01 2019-12-09
USD930000S1 (en) 2018-10-12 2021-09-07 Huawei Technologies Co., Ltd. Memory card

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US3831191A (en) * 1973-06-27 1974-08-20 Ibm Double-head configuration for magnetic disk for maximum density recording
JPS522640A (en) * 1975-06-24 1977-01-10 Reiko Sakuma Fat abdominal suit and method of producing same
FR2337381A1 (fr) * 1975-12-31 1977-07-29 Honeywell Bull Soc Ind Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte
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DE2920012C2 (de) * 1979-05-17 1988-09-29 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte
FR2486685B1 (fr) * 1980-07-09 1985-10-31 Labo Electronique Physique Carte de paiement electronique et procede de realisation
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
NL191959B (nl) * 1981-03-24 1996-07-01 Gao Ges Automation Org Identificatiekaart met IC-bouwsteen en dragerelement voor een IC-bouwsteen.
DE3130206A1 (de) * 1981-07-30 1983-02-17 Siemens AG, 1000 Berlin und 8000 München Tragbare karte zur informationsverarbeitung

Also Published As

Publication number Publication date
NL188275B (nl) 1991-12-16
US4603249A (en) 1986-07-29
CH659333A5 (en) 1987-01-15
NL8204485A (nl) 1983-07-18
GB8500067D0 (en) 1985-02-13
CH670008A5 (en) 1989-04-28
IT1153085B (it) 1987-01-14
NL188275C (nl) 1992-05-18
BE895353A (fr) 1983-03-31
SE455899B (sv) 1988-08-15
US4552383A (en) 1985-11-12
FR2519166B1 (fr) 1989-03-03
GB2112324A (en) 1983-07-20
SE8206753D0 (sv) 1982-11-26
GB2150496A (en) 1985-07-03
IT8224333A1 (it) 1984-05-19
GB2112324B (en) 1986-01-02
FR2519166A1 (fr) 1983-07-01
JPH0130149B2 (sv) 1989-06-16
JPS58125892A (ja) 1983-07-27
DE3151408C1 (de) 1983-06-01
GB2150496B (en) 1986-02-12
IT8224333A0 (it) 1982-11-19

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