DK0383435T3 - Bærbart elektronisk rettighedsbevis - Google Patents

Bærbart elektronisk rettighedsbevis

Info

Publication number
DK0383435T3
DK0383435T3 DK90300531.2T DK90300531T DK0383435T3 DK 0383435 T3 DK0383435 T3 DK 0383435T3 DK 90300531 T DK90300531 T DK 90300531T DK 0383435 T3 DK0383435 T3 DK 0383435T3
Authority
DK
Denmark
Prior art keywords
token
components
component
portable electronic
electronic license
Prior art date
Application number
DK90300531.2T
Other languages
English (en)
Inventor
Charles Richard Jarvis
Original Assignee
Gec Avery Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gec Avery Ltd filed Critical Gec Avery Ltd
Application granted granted Critical
Publication of DK0383435T3 publication Critical patent/DK0383435T3/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223—One or more of the layers being plastic
    • B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/34—Moulds or cores; Details thereof or accessories therefor movable, e.g. to or from the moulding station
    • B29C33/36—Moulds or cores; Details thereof or accessories therefor movable, e.g. to or from the moulding station continuously movable in one direction, e.g. in a closed circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/70—Completely encapsulating inserts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
    • B29C67/246—Moulding high reactive monomers or prepolymers, e.g. by reaction injection moulding [RIM], liquid injection moulding [LIM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • Chemical & Material Sciences (AREA)
  • Credit Cards Or The Like (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Lock And Its Accessories (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Developing Agents For Electrophotography (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
DK90300531.2T 1989-01-19 1990-01-18 Bærbart elektronisk rettighedsbevis DK0383435T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB898901189A GB8901189D0 (en) 1989-01-19 1989-01-19 Portable electronic token

Publications (1)

Publication Number Publication Date
DK0383435T3 true DK0383435T3 (da) 1995-08-14

Family

ID=10650286

Family Applications (1)

Application Number Title Priority Date Filing Date
DK90300531.2T DK0383435T3 (da) 1989-01-19 1990-01-18 Bærbart elektronisk rettighedsbevis

Country Status (14)

Country Link
US (1) US5200601A (da)
EP (1) EP0383435B1 (da)
JP (1) JPH03503390A (da)
KR (1) KR910700506A (da)
AT (1) ATE122811T1 (da)
AU (1) AU625340B2 (da)
CA (1) CA2025239A1 (da)
DE (1) DE69019392T2 (da)
DK (1) DK0383435T3 (da)
ES (1) ES2071758T3 (da)
GB (2) GB8901189D0 (da)
IL (1) IL93084A0 (da)
NZ (1) NZ232131A (da)
WO (1) WO1990008365A1 (da)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2051836C (en) * 1990-11-30 1996-07-23 Richard Michael Flynn Personal data card construction
DE9100665U1 (de) * 1991-01-21 1992-07-16 TELBUS Gesellschaft für elektronische Kommunikations-Systeme mbH, 85391 Allershausen Trägerelement für integrierte Halbleiter-Schaltkreise, insbesondere zum Einbau in Chip-Karten
GB2253591A (en) * 1991-03-15 1992-09-16 Gec Avery Ltd Integrated circuit card
US5340968A (en) * 1991-05-07 1994-08-23 Nippondenso Company, Ltd. Information storage medium with electronic and visual areas
FR2686996B1 (fr) * 1992-01-31 1996-02-02 Solaic Sa Procede de fabrication d'une carte a memoire comprenant un micromodule equipe d'un capot, et carte a memoire ainsi obtenue.
GB9313755D0 (en) * 1993-07-02 1993-08-18 Gec Avery Ltd A method of encapsulating components on a printed circuit
GB9313749D0 (en) * 1993-07-02 1993-08-18 Gec Avery Ltd A device comprising a flexible printed circuit
US5689136A (en) * 1993-08-04 1997-11-18 Hitachi, Ltd. Semiconductor device and fabrication method
US5530232A (en) * 1993-12-22 1996-06-25 Datamark Services, Inc. Multi-application data card
CN1054573C (zh) * 1994-09-22 2000-07-19 罗姆股份有限公司 非接触型ic卡及其制造方法
JP3337847B2 (ja) * 1995-02-27 2002-10-28 株式会社東芝 電子部品内蔵カードの製造方法
US5971282A (en) * 1995-09-26 1999-10-26 Intel Corporation Personal token card with sensor
US5817207A (en) 1995-10-17 1998-10-06 Leighton; Keith R. Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards
US5834756A (en) * 1996-06-03 1998-11-10 Motorola, Inc. Magnetically communicative card
SG80077A1 (en) * 1998-10-19 2001-04-17 Sony Corp Semiconductor integrated circuit card manufacturing method, and semiconductor integrated circuit card
US8538801B2 (en) 1999-02-19 2013-09-17 Exxonmobile Research & Engineering Company System and method for processing financial transactions
US6152029A (en) * 1999-10-20 2000-11-28 Webcraft, Inc. Method for making a paper card with printed graphics and magnetically encoded stripe
JP4103653B2 (ja) * 2003-03-27 2008-06-18 株式会社デンソー Ｉｃカード
US7192208B2 (en) * 2003-09-02 2007-03-20 Futurelogic, Inc. Rewritable card printer
US20080153580A1 (en) * 2003-09-12 2008-06-26 Igt Bezel interface for a card loading system
US20080153581A1 (en) * 2003-09-12 2008-06-26 Igt Card loading system for a data card unit
US7494414B2 (en) 2003-09-12 2009-02-24 Igt Gaming device having a card management system for the management of circulating data cards
US8057296B2 (en) * 2003-09-12 2011-11-15 Igt Gaming device including a card processing assembly having vertically-stacked card holders operable with thermally-printable data cards and portable card changeover machines
US7701408B2 (en) * 2004-06-16 2010-04-20 Axalto Sa Shielded contactless electronic document
DE102004056829A1 (de) * 2004-11-24 2006-06-01 Bundesdruckerei Gmbh Trägermaterial sowie Verfahren zur Herstellung eines Wertdokumentes
US8012809B2 (en) 2005-03-23 2011-09-06 Cardxx, Inc. Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces
JP4382802B2 (ja) * 2006-08-10 2009-12-16 富士通株式会社 Ｒｆｉｄタグ
EP1887497B1 (en) * 2006-08-10 2015-05-27 Fujitsu Limited RFID tag
JP2008046668A (ja) * 2006-08-10 2008-02-28 Fujitsu Ltd Ｒｆｉｄタグ
JP2008210032A (ja) * 2007-02-23 2008-09-11 Fujitsu Ltd Ｒｆｉｄタグ
US8197334B2 (en) 2007-10-29 2012-06-12 Igt Circulating data card apparatus and management system
US8030746B2 (en) * 2008-02-08 2011-10-04 Infineon Technologies Ag Integrated circuit package
TWI581942B (zh) * 2015-04-08 2017-05-11 韋僑科技股份有限公司 跨橋裝置與系統及其軟性電路元件跨橋方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3702464A (en) * 1971-05-04 1972-11-07 Ibm Information card
FR2439438A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux
DE2920012C2 (de) * 1979-05-17 1988-09-29 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte
DE3131216C3 (de) * 1981-04-14 1994-09-01 Gao Ges Automation Org Ausweiskarte mit IC-Baustein
US4501960A (en) * 1981-06-22 1985-02-26 Motorola, Inc. Micropackage for identification card
JPS5875285A (ja) * 1981-10-28 1983-05-06 Tokyo Jiki Insatsu Kk Ｉｃ内蔵磁器カ−ドの製造法
JPS58210646A (ja) * 1982-06-02 1983-12-07 Kyodo Printing Co Ltd Ｉｃチツプモ−ルド成形品
DE3235650A1 (de) * 1982-09-27 1984-03-29 Philips Patentverwaltung Gmbh, 2000 Hamburg Informationskarte und verfahren zu ihrer herstellung
JPS59198740A (ja) * 1983-04-25 1984-11-10 Mitsubishi Electric Corp 樹脂封止形半導体複合素子
JPS6145977A (ja) * 1984-08-09 1986-03-06 Takamatsu Electric Works Ltd 配電線の地絡点検出表示方法
JPS6186887A (ja) * 1984-10-04 1986-05-02 Toshiba Corp Ｉｃカ−ド
JPS6195486A (ja) * 1984-10-17 1986-05-14 Hitachi Ltd Ｉｃカ−ド
CH661808A5 (fr) * 1985-01-21 1987-08-14 Lupa Finances Carte munie d'un microprocesseur et/ou d'au moins une memoire electronique.
US4754544A (en) * 1985-01-30 1988-07-05 Energy Conversion Devices, Inc. Extremely lightweight, flexible semiconductor device arrays
JPS61204788A (ja) * 1985-03-08 1986-09-10 Dainippon Printing Co Ltd 携持用電子装置
JPS61214086A (ja) * 1985-03-20 1986-09-22 Hitachi Maxell Ltd Ｉｃカ−ド
FR2581480A1 (fr) * 1985-04-10 1986-11-07 Ebauches Electroniques Sa Unite electronique notamment pour carte a microcircuits et carte comprenant une telle unite
DE3689094T2 (de) * 1985-07-27 1994-03-10 Dainippon Printing Co Ltd IC-Karte.
US4755661A (en) * 1986-01-10 1988-07-05 Ruebsam Herrn H Connection of electronic components in a card
JP2502511B2 (ja) * 1986-02-06 1996-05-29 日立マクセル株式会社 半導体装置の製造方法
JPS62214998A (ja) * 1986-03-17 1987-09-21 三菱電機株式会社 薄型半導体カ−ド
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
JPS63149191A (ja) * 1986-12-15 1988-06-21 日立マクセル株式会社 Ｉｃカ−ド
FR2624635B1 (fr) * 1987-12-14 1991-05-10 Sgs Thomson Microelectronics Support de composant electronique pour carte memoire et produit ainsi obtenu

Also Published As

Publication number Publication date
AU4843590A (en) 1990-08-13
ES2071758T3 (es) 1995-07-01
GB2227209B (en) 1992-06-10
KR910700506A (ko) 1991-03-15
WO1990008365A1 (en) 1990-07-26
IL93084A0 (en) 1990-11-05
AU625340B2 (en) 1992-07-09
JPH03503390A (ja) 1991-08-01
US5200601A (en) 1993-04-06
GB8901189D0 (en) 1989-03-15
EP0383435B1 (en) 1995-05-17
DE69019392T2 (de) 1995-10-05
GB9001191D0 (en) 1990-03-21
ATE122811T1 (de) 1995-06-15
NZ232131A (en) 1992-08-26
EP0383435A1 (en) 1990-08-22
DE69019392D1 (de) 1995-06-22
CA2025239A1 (en) 1990-07-20
GB2227209A (en) 1990-07-25

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