ATE100616T1 - Herstellung von tragbaren elektronischen karten. - Google Patents
Herstellung von tragbaren elektronischen karten.Info
- Publication number
- ATE100616T1 ATE100616T1 AT89306256T AT89306256T ATE100616T1 AT E100616 T1 ATE100616 T1 AT E100616T1 AT 89306256 T AT89306256 T AT 89306256T AT 89306256 T AT89306256 T AT 89306256T AT E100616 T1 ATE100616 T1 AT E100616T1
- Authority
- AT
- Austria
- Prior art keywords
- portable electronic
- manufacture
- electronic cards
- token
- mould
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
- B32B37/223—One or more of the layers being plastic
- B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/34—Moulds or cores; Details thereof or accessories therefor movable, e.g. to or from the moulding station
- B29C33/36—Moulds or cores; Details thereof or accessories therefor movable, e.g. to or from the moulding station continuously movable in one direction, e.g. in a closed circuit
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/68—Release sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/70—Completely encapsulating inserts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
- B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
- B29C67/246—Moulding high reactive monomers or prepolymers, e.g. by reaction injection moulding [RIM], liquid injection moulding [LIM]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Credit Cards Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8814664A GB2219960B (en) | 1988-06-21 | 1988-06-21 | Manufacture of electronic tokens |
GB898901189A GB8901189D0 (en) | 1989-01-19 | 1989-01-19 | Portable electronic token |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE100616T1 true ATE100616T1 (de) | 1994-02-15 |
Family
ID=26294056
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT89306256T ATE100616T1 (de) | 1988-06-21 | 1989-06-21 | Herstellung von tragbaren elektronischen karten. |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0350179B1 (de) |
JP (1) | JPH03500033A (de) |
KR (1) | KR900702481A (de) |
AT (1) | ATE100616T1 (de) |
DE (1) | DE68912426T2 (de) |
WO (1) | WO1989012871A1 (de) |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2659157B2 (fr) * | 1989-05-26 | 1994-09-30 | Lemaire Gerard | Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede. |
DE4038126C2 (de) * | 1990-11-27 | 1993-12-16 | Mannesmann Ag | Verfahren und Vorrichtung zur Herstellung einer dekorierten Chip-Karte |
DE4142408A1 (de) * | 1991-12-20 | 1993-06-24 | Gao Ges Automation Org | Ausweiskarte sowie verfahren und vorrichtung zur herstellung derselben |
FR2691563B1 (fr) * | 1992-05-19 | 1996-05-31 | Francois Droz | Carte comprenant au moins un element electronique et procede de fabrication d'une telle carte. |
FR2702067B1 (fr) * | 1993-02-23 | 1995-04-14 | Schlumberger Ind Sa | Procédé et dispositif de fabrication de cartes à mémoire. |
US5585618A (en) * | 1993-03-18 | 1996-12-17 | Droz; Fran+525 Ois | Method of manufacture of a card comprising at least one electronic element and card obtained by such method |
NL9400119A (nl) * | 1994-01-27 | 1995-09-01 | 3P Licensing Bv | Werkwijze voor het met een hardende kunststof omhullen van een electronische component, electronische componenten met kunststofomhulling verkregen door middel van deze werkwijze en matrijs voor het uitvoeren der werkwijze. |
DE69501632T2 (de) * | 1994-11-21 | 1998-07-23 | Apic Yamada Corp | Harzformmaschine mit Trennfolie |
US5955021A (en) * | 1997-05-19 | 1999-09-21 | Cardxx, Llc | Method of making smart cards |
DE19721058A1 (de) * | 1997-05-20 | 1998-11-26 | Giesecke & Devrient Gmbh | Spritzgußkarte mit Dekorschicht |
US6025054A (en) * | 1997-09-08 | 2000-02-15 | Cardxx, Inc. | Smart cards having glue-positioned electronic components |
US6256873B1 (en) | 1998-03-17 | 2001-07-10 | Cardxx, Inc. | Method for making smart cards using isotropic thermoset adhesive materials |
FR2793577B1 (fr) * | 1999-05-12 | 2001-11-02 | Gemplus Card Int | Procede de fabrication d'une carte sans contact |
FR2805067B1 (fr) | 2000-02-15 | 2003-09-12 | Bourgogne Grasset | Jeton a puce electronique et procedes de fabrication d'un tel jeton |
JP3534042B2 (ja) | 2000-06-21 | 2004-06-07 | オムロン株式会社 | コイン形icタグおよびその製造方法 |
EP1309994A2 (de) | 2000-08-18 | 2003-05-14 | Siemens Aktiengesellschaft | Verkapseltes organisch-elektronisches bauteil, verfahren zu seiner herstellung und seine verwendung |
DE10061299A1 (de) | 2000-12-08 | 2002-06-27 | Siemens Ag | Vorrichtung zur Feststellung und/oder Weiterleitung zumindest eines Umwelteinflusses, Herstellungsverfahren und Verwendung dazu |
DE10226370B4 (de) | 2002-06-13 | 2008-12-11 | Polyic Gmbh & Co. Kg | Substrat für ein elektronisches Bauteil, Verwendung des Substrates, Verfahren zur Erhöhung der Ladungsträgermobilität und Organischer Feld-Effekt Transistor (OFET) |
EP1525630A2 (de) | 2002-07-29 | 2005-04-27 | Siemens Aktiengesellschaft | Elektronisches bauteil mit vorwiegend organischen funktionsmaterialien und herstellungsverfahren dazu |
WO2004021256A1 (de) | 2002-08-23 | 2004-03-11 | Siemens Aktiengesellschaft | Organisches bauelement zum überspannungsschutz und dazugehörige schaltung |
ES2282708T3 (es) | 2002-11-19 | 2007-10-16 | POLYIC GMBH & CO. KG | Componente electronico organico con capa funcional semiconductora estructurada y metodo para producir el mismo. |
DE10302149A1 (de) | 2003-01-21 | 2005-08-25 | Siemens Ag | Verwendung leitfähiger Carbon-black/Graphit-Mischungen für die Herstellung von low-cost Elektronik |
WO2004066197A1 (de) * | 2003-01-21 | 2004-08-05 | Siemens Aktiengesellschaft | Kunststoffprodukt mit integriertem low-cost-chip |
DE10340643B4 (de) | 2003-09-03 | 2009-04-16 | Polyic Gmbh & Co. Kg | Druckverfahren zur Herstellung einer Doppelschicht für Polymerelektronik-Schaltungen, sowie dadurch hergestelltes elektronisches Bauelement mit Doppelschicht |
DE102004040831A1 (de) | 2004-08-23 | 2006-03-09 | Polyic Gmbh & Co. Kg | Funketikettfähige Umverpackung |
US7573048B2 (en) | 2004-10-08 | 2009-08-11 | Patel Gordhanbhai N | Tamper resistant self indicating instant alert radiation dosimeter |
DE102004059464A1 (de) | 2004-12-10 | 2006-06-29 | Polyic Gmbh & Co. Kg | Elektronikbauteil mit Modulator |
DE102004059465A1 (de) | 2004-12-10 | 2006-06-14 | Polyic Gmbh & Co. Kg | Erkennungssystem |
US7432808B2 (en) * | 2004-12-15 | 2008-10-07 | Intel Corporation | Wireless module enabled component carrier for parts inventory and tracking |
DE102004063435A1 (de) | 2004-12-23 | 2006-07-27 | Polyic Gmbh & Co. Kg | Organischer Gleichrichter |
DE102005009819A1 (de) | 2005-03-01 | 2006-09-07 | Polyic Gmbh & Co. Kg | Elektronikbaugruppe |
BRPI0520452A2 (pt) | 2005-03-23 | 2009-05-12 | Cardxx Inc | método para fabricar um cartão inteligente avançado ou dispositivo similar |
US7237724B2 (en) | 2005-04-06 | 2007-07-03 | Robert Singleton | Smart card and method for manufacturing a smart card |
DE102005017655B4 (de) | 2005-04-15 | 2008-12-11 | Polyic Gmbh & Co. Kg | Mehrschichtiger Verbundkörper mit elektronischer Funktion |
DE102005031448A1 (de) | 2005-07-04 | 2007-01-11 | Polyic Gmbh & Co. Kg | Aktivierbare optische Schicht |
US7607249B2 (en) | 2005-07-15 | 2009-10-27 | Innovatier Inc. | RFID bracelet and method for manufacturing a RFID bracelet |
DE102005035589A1 (de) | 2005-07-29 | 2007-02-01 | Polyic Gmbh & Co. Kg | Verfahren zur Herstellung eines elektronischen Bauelements |
DE102005044306A1 (de) | 2005-09-16 | 2007-03-22 | Polyic Gmbh & Co. Kg | Elektronische Schaltung und Verfahren zur Herstellung einer solchen |
BRPI0710244B1 (pt) | 2006-04-10 | 2022-02-08 | Innovatier, Inc | Inlay eletrônico e cartão eletrônico e métodos para fabricar os mesmos |
US8690064B2 (en) | 2009-04-30 | 2014-04-08 | Abnote Usa, Inc. | Transaction card assembly and methods of manufacture |
CN102884871B (zh) * | 2010-04-05 | 2017-06-16 | 因诺瓦蒂尔公司 | 预先层压芯及用于制造电子卡及标签用的预先层压芯的方法 |
CN102039262B (zh) * | 2010-12-31 | 2014-04-02 | 上海众人网络安全技术有限公司 | 一种灌胶的电子口令牌及灌胶工艺方法 |
US9122968B2 (en) | 2012-04-03 | 2015-09-01 | X-Card Holdings, Llc | Information carrying card comprising a cross-linked polymer composition, and method of making the same |
US9594999B2 (en) | 2012-04-03 | 2017-03-14 | X-Card Holdings, Llc | Information carrying card comprising crosslinked polymer composition, and method of making the same |
EP2973236B1 (de) | 2013-03-15 | 2019-01-09 | X-Card Holdings, LLC | Verfahren zur herstellung einer kernschicht für eine informationskarte und in diesem verfahren hergestellte produkte |
CN111819577B (zh) | 2018-03-07 | 2024-08-13 | X卡控股有限公司 | 金属卡 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE461217A (de) * | 1943-12-17 | |||
US4214936A (en) * | 1978-10-24 | 1980-07-29 | E. I. Du Pont De Nemours And Company | Lamination process |
US4378264A (en) * | 1980-05-27 | 1983-03-29 | E. I. Du Pont De Nemours And Company | Integrated laminating process |
DE3029667A1 (de) * | 1980-08-05 | 1982-03-11 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer einen ic-baustein |
DE3130206A1 (de) * | 1981-07-30 | 1983-02-17 | Siemens AG, 1000 Berlin und 8000 München | Tragbare karte zur informationsverarbeitung |
ATE29235T1 (de) * | 1983-07-01 | 1987-09-15 | Roland Melzer | Verfahren zum herstellen von kunststoffkarten. |
JPH074995B2 (ja) * | 1986-05-20 | 1995-01-25 | 株式会社東芝 | Icカ−ド及びその製造方法 |
-
1989
- 1989-06-21 JP JP1507039A patent/JPH03500033A/ja active Pending
- 1989-06-21 WO PCT/GB1989/000693 patent/WO1989012871A1/en unknown
- 1989-06-21 EP EP89306256A patent/EP0350179B1/de not_active Expired - Lifetime
- 1989-06-21 KR KR1019900700341A patent/KR900702481A/ko not_active Application Discontinuation
- 1989-06-21 DE DE89306256T patent/DE68912426T2/de not_active Expired - Fee Related
- 1989-06-21 AT AT89306256T patent/ATE100616T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH03500033A (ja) | 1991-01-10 |
DE68912426T2 (de) | 1994-05-11 |
WO1989012871A1 (en) | 1989-12-28 |
EP0350179B1 (de) | 1994-01-19 |
DE68912426D1 (de) | 1994-03-03 |
EP0350179A1 (de) | 1990-01-10 |
KR900702481A (ko) | 1990-12-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
UEP | Publication of translation of european patent specification | ||
REN | Ceased due to non-payment of the annual fee |