DE68909111D1 - Elektronisches Modul, das Substratelemente enthält. - Google Patents
Elektronisches Modul, das Substratelemente enthält.Info
- Publication number
- DE68909111D1 DE68909111D1 DE89201273T DE68909111T DE68909111D1 DE 68909111 D1 DE68909111 D1 DE 68909111D1 DE 89201273 T DE89201273 T DE 89201273T DE 68909111 T DE68909111 T DE 68909111T DE 68909111 D1 DE68909111 D1 DE 68909111D1
- Authority
- DE
- Germany
- Prior art keywords
- electronic module
- substrate elements
- contains substrate
- elements
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
- G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
- G01R31/318536—Scan chain arrangements, e.g. connections, test bus, analog signals
- G01R31/318538—Topological or mechanical aspects
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL8801362A NL8801362A (nl) | 1988-05-27 | 1988-05-27 | Elektronische module bevattende een eerste substraatelement met een funktioneel deel, alsmede een tweede substraatelement voor het testen van een interkonnektiefunktie, voet bevattende zo een tweede substraatelement, substraatelement te gebruiken als zo een tweede substraatelement en elektronisch apparaat bevattende een plaat met gedrukte bedrading en ten minste twee zulke elektronische modules. |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68909111D1 true DE68909111D1 (de) | 1993-10-21 |
DE68909111T2 DE68909111T2 (de) | 1994-03-31 |
Family
ID=19852363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE89201273T Expired - Fee Related DE68909111T2 (de) | 1988-05-27 | 1989-05-22 | Elektronisches Modul, das Substratelemente enthält. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4967142A (de) |
EP (1) | EP0344834B1 (de) |
JP (1) | JP2857764B2 (de) |
KR (1) | KR0163756B1 (de) |
DE (1) | DE68909111T2 (de) |
NL (1) | NL8801362A (de) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2561164B2 (ja) * | 1990-02-26 | 1996-12-04 | 三菱電機株式会社 | 半導体集積回路 |
US5159598A (en) * | 1990-05-03 | 1992-10-27 | General Electric Company | Buffer integrated circuit providing testing interface |
JPH04212524A (ja) * | 1990-12-06 | 1992-08-04 | Matsushita Electric Ind Co Ltd | 半導体集積回路 |
TW216472B (de) * | 1991-12-18 | 1993-11-21 | Philips Nv | |
US5410551A (en) * | 1992-01-02 | 1995-04-25 | Andahl Corporation | Net verification method and apparatus |
US5260649A (en) * | 1992-01-03 | 1993-11-09 | Hewlett-Packard Company | Powered testing of mixed conventional/boundary-scan logic |
US5448166A (en) * | 1992-01-03 | 1995-09-05 | Hewlett-Packard Company | Powered testing of mixed conventional/boundary-scan logic |
TW253097B (de) * | 1992-03-02 | 1995-08-01 | At & T Corp | |
US5285152A (en) * | 1992-03-23 | 1994-02-08 | Ministar Peripherals International Limited | Apparatus and methods for testing circuit board interconnect integrity |
US5534774A (en) * | 1992-04-23 | 1996-07-09 | Intel Corporation | Apparatus for a test access architecture for testing of modules within integrated circuits |
US5471481A (en) * | 1992-05-18 | 1995-11-28 | Sony Corporation | Testing method for electronic apparatus |
US5809036A (en) * | 1993-11-29 | 1998-09-15 | Motorola, Inc. | Boundary-scan testable system and method |
EP0685074B1 (de) * | 1993-12-16 | 2004-03-17 | Koninklijke Philips Electronics N.V. | Gerät zur prüfung der verbindung zwischen dem ausgang einer schaltung mit fester logischer ausgabe und dem eingang eines weiteren schaltkreises |
US5787098A (en) * | 1996-07-29 | 1998-07-28 | International Business Machines Corporation | Complete chip I/O test through low contact testing using enhanced boundary scan |
US5974578A (en) * | 1996-08-06 | 1999-10-26 | Matsushita Electronics Corporation | Integrated circuit and test method therefor |
US6114870A (en) * | 1996-10-04 | 2000-09-05 | Texas Instruments Incorporated | Test system and process with a microcomputer at each test location |
US6617872B2 (en) * | 1996-10-04 | 2003-09-09 | Texas Instruments Incorporated | Reduced cost, high speed integrated circuit test arrangement |
US6199182B1 (en) * | 1997-03-27 | 2001-03-06 | Texas Instruments Incorporated | Probeless testing of pad buffers on wafer |
US5963464A (en) * | 1998-02-26 | 1999-10-05 | International Business Machines Corporation | Stackable memory card |
GB2344184A (en) | 1998-11-26 | 2000-05-31 | Ericsson Telefon Ab L M | Testing integrated circuits |
JP4887552B2 (ja) * | 2000-07-04 | 2012-02-29 | 富士通セミコンダクター株式会社 | Lsiチップのレイアウト設計方法 |
US6731128B2 (en) | 2000-07-13 | 2004-05-04 | International Business Machines Corporation | TFI probe I/O wrap test method |
WO2002080268A1 (en) * | 2001-03-30 | 2002-10-10 | Infineon Technologies Ag | A substrate for mounting a semiconductor chip |
CN1314975C (zh) * | 2001-04-09 | 2007-05-09 | 皇家菲利浦电子有限公司 | 有电源测试接口的集成电路 |
DE102004014242B4 (de) * | 2004-03-24 | 2014-05-28 | Qimonda Ag | Integrierter Baustein mit mehreren voneinander getrennten Substraten |
JP2006200983A (ja) * | 2005-01-19 | 2006-08-03 | Denso Corp | 半導体集積回路装置およびその試験方法 |
US8991829B2 (en) | 2007-11-20 | 2015-03-31 | The Timken Company | Non-contact labyrinth seal assembly and method of construction thereof |
KR101014965B1 (ko) | 2008-11-03 | 2011-02-16 | 유수엽 | 임베디드 보드 개발 및 교육용 보드유닛 |
JP2013142434A (ja) | 2012-01-10 | 2013-07-22 | Showa Corp | 軸受構造体 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1003048B (it) * | 1972-03-17 | 1976-06-10 | Honeywell Inf Systems | Dispositivo per verificare il cor retto comportamento di unita circui tali integrate sequenziali |
US4145620A (en) * | 1977-10-05 | 1979-03-20 | Serel Corporation | Modular dynamic burn-in apparatus |
US4567432A (en) * | 1983-06-09 | 1986-01-28 | Texas Instruments Incorporated | Apparatus for testing integrated circuits |
EP0174224B1 (de) * | 1984-07-27 | 1990-06-13 | Fujitsu Limited | Integrierte Schaltung vom Chip-auf-Chip-Typ |
FR2569411B1 (fr) * | 1984-08-23 | 1986-11-21 | Charbonnages Ste Chimique | Nouveau procede de fabrication de terpolymeres radicalaires de l'ethylene et de copolymeres radicalaires de l'ethylene |
NL8502476A (nl) * | 1985-09-11 | 1987-04-01 | Philips Nv | Werkwijze voor het testen van dragers met meerdere digitaal-werkende geintegreerde schakelingen, drager voorzien van zulke schakelingen, geintegreerde schakeling geschikt voor het aanbrengen op zo'n drager, en testinrichting voor het testen van zulke dragers. |
JPS63182585A (ja) * | 1987-01-26 | 1988-07-27 | Toshiba Corp | テスト容易化機能を備えた論理回路 |
JPS63286781A (ja) * | 1987-05-19 | 1988-11-24 | Mitsubishi Electric Corp | 回路の試験方法 |
-
1988
- 1988-05-27 NL NL8801362A patent/NL8801362A/nl not_active Application Discontinuation
-
1989
- 1989-04-24 US US07/342,414 patent/US4967142A/en not_active Expired - Lifetime
- 1989-05-22 DE DE89201273T patent/DE68909111T2/de not_active Expired - Fee Related
- 1989-05-22 EP EP89201273A patent/EP0344834B1/de not_active Expired - Lifetime
- 1989-05-24 JP JP1131252A patent/JP2857764B2/ja not_active Expired - Fee Related
- 1989-05-24 KR KR1019890006926A patent/KR0163756B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2857764B2 (ja) | 1999-02-17 |
KR0163756B1 (ko) | 1999-03-20 |
NL8801362A (nl) | 1989-12-18 |
EP0344834A1 (de) | 1989-12-06 |
JPH0225774A (ja) | 1990-01-29 |
DE68909111T2 (de) | 1994-03-31 |
US4967142A (en) | 1990-10-30 |
EP0344834B1 (de) | 1993-09-15 |
KR890017546A (ko) | 1989-12-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: PHILIPS ELECTRONICS N.V., EINDHOVEN, NL |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN, N |
|
8339 | Ceased/non-payment of the annual fee |