DE68923778D1 - Halbleitermodul. - Google Patents
Halbleitermodul.Info
- Publication number
- DE68923778D1 DE68923778D1 DE68923778T DE68923778T DE68923778D1 DE 68923778 D1 DE68923778 D1 DE 68923778D1 DE 68923778 T DE68923778 T DE 68923778T DE 68923778 T DE68923778 T DE 68923778T DE 68923778 D1 DE68923778 D1 DE 68923778D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor module
- semiconductor
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3732—Diamonds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL8802957 | 1988-12-01 | ||
NL8802958 | 1988-12-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68923778D1 true DE68923778D1 (de) | 1995-09-14 |
DE68923778T2 DE68923778T2 (de) | 1996-04-11 |
Family
ID=26646452
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1989623778 Expired - Fee Related DE68923778T2 (de) | 1988-12-01 | 1989-11-27 | Halbleitermodul. |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0376365B1 (de) |
JP (1) | JPH0320069A (de) |
DE (1) | DE68923778T2 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5205353A (en) * | 1989-11-30 | 1993-04-27 | Akzo N.V. | Heat exchanging member |
CA2050091C (en) * | 1990-10-03 | 1999-06-15 | Richard C. Eden | Electronic circuit and method with thermal management |
EP0510734A1 (de) * | 1991-02-20 | 1992-10-28 | Akzo Nobel N.V. | Wärmeaustauschkörper, insbesondere zum Kühlen eines Halbleitermodules |
EP0564027A1 (de) * | 1992-03-31 | 1993-10-06 | Akzo Nobel N.V. | Wärmeaustauscher, Herstellungsverfahren und Anwendungen |
US5592363A (en) * | 1992-09-30 | 1997-01-07 | Hitachi, Ltd. | Electronic apparatus |
GB2276763B (en) * | 1993-03-30 | 1997-05-07 | Thermalloy Inc | Method and apparatus for dissipating thermal energy |
DE4445849A1 (de) * | 1994-12-22 | 1996-06-27 | Sel Alcatel Ag | Vorrichtung zum Abführen von Wärme von einem elektronischen Bauelement |
US6898082B2 (en) | 2002-05-10 | 2005-05-24 | Serguei V. Dessiatoun | Enhanced heat transfer structure with heat transfer members of variable density |
JP4876612B2 (ja) * | 2005-02-22 | 2012-02-15 | 三菱マテリアル株式会社 | 絶縁伝熱構造体及びパワーモジュール用基板 |
JP4457921B2 (ja) * | 2005-03-01 | 2010-04-28 | 三菱マテリアル株式会社 | パワーモジュール用の絶縁回路基板およびパワーモジュール |
US10393409B2 (en) | 2012-10-01 | 2019-08-27 | Forced Physics, Llc | Device and method for temperature control |
CN113035805A (zh) * | 2021-03-04 | 2021-06-25 | 阳光电源股份有限公司 | 液冷板及功率模组 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL202863A (de) * | 1954-12-16 | 1900-01-01 | ||
EP0065686A3 (de) * | 1981-05-21 | 1984-10-10 | General Electric Company | Leistungsanordnung-Modul |
US4765397A (en) * | 1986-11-28 | 1988-08-23 | International Business Machines Corp. | Immersion cooled circuit module with improved fins |
US4768581A (en) * | 1987-04-06 | 1988-09-06 | International Business Machines Corporation | Cooling system for semiconductor modules |
-
1989
- 1989-11-27 EP EP89203004A patent/EP0376365B1/de not_active Expired - Lifetime
- 1989-11-27 DE DE1989623778 patent/DE68923778T2/de not_active Expired - Fee Related
- 1989-12-01 JP JP31081089A patent/JPH0320069A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPH0320069A (ja) | 1991-01-29 |
DE68923778T2 (de) | 1996-04-11 |
EP0376365A1 (de) | 1990-07-04 |
EP0376365B1 (de) | 1995-08-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: FIWIHEX, ALMELO, NL |
|
8328 | Change in the person/name/address of the agent |
Free format text: DERZEIT KEIN VERTRETER BESTELLT |
|
8339 | Ceased/non-payment of the annual fee |