DE68923778D1 - Halbleitermodul. - Google Patents

Halbleitermodul.

Info

Publication number
DE68923778D1
DE68923778D1 DE68923778T DE68923778T DE68923778D1 DE 68923778 D1 DE68923778 D1 DE 68923778D1 DE 68923778 T DE68923778 T DE 68923778T DE 68923778 T DE68923778 T DE 68923778T DE 68923778 D1 DE68923778 D1 DE 68923778D1
Authority
DE
Germany
Prior art keywords
semiconductor module
semiconductor
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68923778T
Other languages
English (en)
Other versions
DE68923778T2 (de
Inventor
Andel Eleonoor Van
Carolina Anna Maria Chri Dirix
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FIWIHEX, ALMELO, NL
Original Assignee
Akzo Nobel NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akzo Nobel NV filed Critical Akzo Nobel NV
Application granted granted Critical
Publication of DE68923778D1 publication Critical patent/DE68923778D1/de
Publication of DE68923778T2 publication Critical patent/DE68923778T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE1989623778 1988-12-01 1989-11-27 Halbleitermodul. Expired - Fee Related DE68923778T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8802957 1988-12-01
NL8802958 1988-12-01

Publications (2)

Publication Number Publication Date
DE68923778D1 true DE68923778D1 (de) 1995-09-14
DE68923778T2 DE68923778T2 (de) 1996-04-11

Family

ID=26646452

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1989623778 Expired - Fee Related DE68923778T2 (de) 1988-12-01 1989-11-27 Halbleitermodul.

Country Status (3)

Country Link
EP (1) EP0376365B1 (de)
JP (1) JPH0320069A (de)
DE (1) DE68923778T2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5205353A (en) * 1989-11-30 1993-04-27 Akzo N.V. Heat exchanging member
CA2050091C (en) * 1990-10-03 1999-06-15 Richard C. Eden Electronic circuit and method with thermal management
EP0510734A1 (de) * 1991-02-20 1992-10-28 Akzo Nobel N.V. Wärmeaustauschkörper, insbesondere zum Kühlen eines Halbleitermodules
EP0564027A1 (de) * 1992-03-31 1993-10-06 Akzo Nobel N.V. Wärmeaustauscher, Herstellungsverfahren und Anwendungen
US5592363A (en) * 1992-09-30 1997-01-07 Hitachi, Ltd. Electronic apparatus
GB2276763B (en) * 1993-03-30 1997-05-07 Thermalloy Inc Method and apparatus for dissipating thermal energy
DE4445849A1 (de) * 1994-12-22 1996-06-27 Sel Alcatel Ag Vorrichtung zum Abführen von Wärme von einem elektronischen Bauelement
US6898082B2 (en) 2002-05-10 2005-05-24 Serguei V. Dessiatoun Enhanced heat transfer structure with heat transfer members of variable density
JP4876612B2 (ja) * 2005-02-22 2012-02-15 三菱マテリアル株式会社 絶縁伝熱構造体及びパワーモジュール用基板
JP4457921B2 (ja) * 2005-03-01 2010-04-28 三菱マテリアル株式会社 パワーモジュール用の絶縁回路基板およびパワーモジュール
US10393409B2 (en) 2012-10-01 2019-08-27 Forced Physics, Llc Device and method for temperature control
CN113035805A (zh) * 2021-03-04 2021-06-25 阳光电源股份有限公司 液冷板及功率模组

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL202863A (de) * 1954-12-16 1900-01-01
EP0065686A3 (de) * 1981-05-21 1984-10-10 General Electric Company Leistungsanordnung-Modul
US4765397A (en) * 1986-11-28 1988-08-23 International Business Machines Corp. Immersion cooled circuit module with improved fins
US4768581A (en) * 1987-04-06 1988-09-06 International Business Machines Corporation Cooling system for semiconductor modules

Also Published As

Publication number Publication date
JPH0320069A (ja) 1991-01-29
DE68923778T2 (de) 1996-04-11
EP0376365A1 (de) 1990-07-04
EP0376365B1 (de) 1995-08-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: FIWIHEX, ALMELO, NL

8328 Change in the person/name/address of the agent

Free format text: DERZEIT KEIN VERTRETER BESTELLT

8339 Ceased/non-payment of the annual fee