DE68917848D1 - Halbleiteranordnung. - Google Patents
Halbleiteranordnung.Info
- Publication number
- DE68917848D1 DE68917848D1 DE68917848T DE68917848T DE68917848D1 DE 68917848 D1 DE68917848 D1 DE 68917848D1 DE 68917848 T DE68917848 T DE 68917848T DE 68917848 T DE68917848 T DE 68917848T DE 68917848 D1 DE68917848 D1 DE 68917848D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25883388 | 1988-10-14 | ||
JP12252689 | 1989-05-16 | ||
JP12252589 | 1989-05-16 | ||
JP1175167A JP2525672B2 (ja) | 1988-10-14 | 1989-07-06 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68917848D1 true DE68917848D1 (de) | 1994-10-06 |
DE68917848T2 DE68917848T2 (de) | 1995-02-02 |
Family
ID=27470862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68917848T Expired - Fee Related DE68917848T2 (de) | 1988-10-14 | 1989-10-12 | Halbleiteranordnung. |
Country Status (3)
Country | Link |
---|---|
US (1) | US5093711A (de) |
EP (1) | EP0365932B1 (de) |
DE (1) | DE68917848T2 (de) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5502315A (en) * | 1989-09-07 | 1996-03-26 | Quicklogic Corporation | Electrically programmable interconnect structure having a PECVD amorphous silicon element |
US5989943A (en) * | 1989-09-07 | 1999-11-23 | Quicklogic Corporation | Method for fabrication of programmable interconnect structure |
US5780323A (en) * | 1990-04-12 | 1998-07-14 | Actel Corporation | Fabrication method for metal-to-metal antifuses incorporating a tungsten via plug |
US5272101A (en) * | 1990-04-12 | 1993-12-21 | Actel Corporation | Electrically programmable antifuse and fabrication processes |
US5541441A (en) * | 1994-10-06 | 1996-07-30 | Actel Corporation | Metal to metal antifuse |
US5404029A (en) * | 1990-04-12 | 1995-04-04 | Actel Corporation | Electrically programmable antifuse element |
US5552627A (en) * | 1990-04-12 | 1996-09-03 | Actel Corporation | Electrically programmable antifuse incorporating dielectric and amorphous silicon interlayers |
US5614756A (en) * | 1990-04-12 | 1997-03-25 | Actel Corporation | Metal-to-metal antifuse with conductive |
EP0480580A3 (en) * | 1990-09-10 | 1992-09-02 | Canon Kabushiki Kaisha | Electrode structure of semiconductor device and method for manufacturing the same |
US5322812A (en) * | 1991-03-20 | 1994-06-21 | Crosspoint Solutions, Inc. | Improved method of fabricating antifuses in an integrated circuit device and resulting structure |
US5701027A (en) * | 1991-04-26 | 1997-12-23 | Quicklogic Corporation | Programmable interconnect structures and programmable integrated circuits |
US5110754A (en) * | 1991-10-04 | 1992-05-05 | Micron Technology, Inc. | Method of making a DRAM capacitor for use as an programmable antifuse for redundancy repair/options on a DRAM |
JP2808965B2 (ja) * | 1992-02-19 | 1998-10-08 | 日本電気株式会社 | 半導体装置 |
EP0558176A1 (de) * | 1992-02-26 | 1993-09-01 | Actel Corporation | Metall-Metall-Antischmelzsicherung mit verbesserter Diffusionsbarriere-Schicht |
US5284788A (en) * | 1992-09-25 | 1994-02-08 | Texas Instruments Incorporated | Method and device for controlling current in a circuit |
US5308795A (en) * | 1992-11-04 | 1994-05-03 | Actel Corporation | Above via metal-to-metal antifuse |
US5581111A (en) * | 1993-07-07 | 1996-12-03 | Actel Corporation | Dielectric-polysilicon-dielectric antifuse for field programmable logic applications |
US5369054A (en) * | 1993-07-07 | 1994-11-29 | Actel Corporation | Circuits for ESD protection of metal-to-metal antifuses during processing |
US5856234A (en) * | 1993-09-14 | 1999-01-05 | Actel Corporation | Method of fabricating an antifuse |
US5592016A (en) * | 1995-04-14 | 1997-01-07 | Actel Corporation | Antifuse with improved antifuse material |
US5789764A (en) * | 1995-04-14 | 1998-08-04 | Actel Corporation | Antifuse with improved antifuse material |
WO1996038861A1 (en) * | 1995-06-02 | 1996-12-05 | Actel Corporation | Raised tungsten plug antifuse and fabrication process |
US5741720A (en) * | 1995-10-04 | 1998-04-21 | Actel Corporation | Method of programming an improved metal-to-metal via-type antifuse |
US5909049A (en) | 1997-02-11 | 1999-06-01 | Actel Corporation | Antifuse programmed PROM cell |
JP3488681B2 (ja) * | 1999-10-26 | 2004-01-19 | シャープ株式会社 | 液晶表示装置 |
WO2001043201A1 (en) * | 1999-12-08 | 2001-06-14 | Koninklijke Philips Electronics N.V. | Semiconductor device with a diode, and method of manufacturing such a device |
US6344669B1 (en) * | 2000-06-13 | 2002-02-05 | United Microelectronics Corp. | CMOS sensor |
US6633182B2 (en) | 2001-09-05 | 2003-10-14 | Carnegie Mellon University | Programmable gate array based on configurable metal interconnect vias |
US7132350B2 (en) * | 2003-07-21 | 2006-11-07 | Macronix International Co., Ltd. | Method for manufacturing a programmable eraseless memory |
US7180123B2 (en) * | 2003-07-21 | 2007-02-20 | Macronix International Co., Ltd. | Method for programming programmable eraseless memory |
US20050035429A1 (en) * | 2003-08-15 | 2005-02-17 | Yeh Chih Chieh | Programmable eraseless memory |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1399163A (en) * | 1972-11-08 | 1975-06-25 | Ferranti Ltd | Methods of manufacturing semiconductor devices |
US4174521A (en) * | 1978-04-06 | 1979-11-13 | Harris Corporation | PROM electrically written by solid phase epitaxy |
CA1136773A (en) * | 1978-08-14 | 1982-11-30 | Norikazu Ohuchi | Semiconductor device |
US4442507A (en) * | 1981-02-23 | 1984-04-10 | Burroughs Corporation | Electrically programmable read-only memory stacked above a semiconductor substrate |
US4424579A (en) * | 1981-02-23 | 1984-01-03 | Burroughs Corporation | Mask programmable read-only memory stacked above a semiconductor substrate |
EP0065916B1 (de) * | 1981-05-15 | 1988-10-12 | Fairchild Semiconductor Corporation | Speicherzellen aus Schottkydioden und aus Widerständen von polykristallinem Silizium |
US4431460A (en) * | 1982-03-08 | 1984-02-14 | International Business Machines Corporation | Method of producing shallow, narrow base bipolar transistor structures via dual implantations of selected polycrystalline layer |
US4590589A (en) * | 1982-12-21 | 1986-05-20 | Zoran Corporation | Electrically programmable read only memory |
US4583106A (en) * | 1983-08-04 | 1986-04-15 | International Business Machines Corporation | Fabrication methods for high performance lateral bipolar transistors |
US4598386A (en) * | 1984-04-18 | 1986-07-01 | Roesner Bruce B | Reduced-area, read-only memory |
JPS62104066A (ja) * | 1985-10-31 | 1987-05-14 | Toshiba Corp | 半導体保護装置 |
US4823181A (en) * | 1986-05-09 | 1989-04-18 | Actel Corporation | Programmable low impedance anti-fuse element |
-
1989
- 1989-10-11 US US07/419,657 patent/US5093711A/en not_active Expired - Lifetime
- 1989-10-12 DE DE68917848T patent/DE68917848T2/de not_active Expired - Fee Related
- 1989-10-12 EP EP89118999A patent/EP0365932B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0365932B1 (de) | 1994-08-31 |
DE68917848T2 (de) | 1995-02-02 |
US5093711A (en) | 1992-03-03 |
EP0365932A1 (de) | 1990-05-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8328 | Change in the person/name/address of the agent |
Free format text: HOFFMANN, E., DIPL.-ING., PAT.-ANW., 82166 GRAEFELFING |
|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |