DE68920767D1 - Halbleiterpackung. - Google Patents

Halbleiterpackung.

Info

Publication number
DE68920767D1
DE68920767D1 DE68920767T DE68920767T DE68920767D1 DE 68920767 D1 DE68920767 D1 DE 68920767D1 DE 68920767 T DE68920767 T DE 68920767T DE 68920767 T DE68920767 T DE 68920767T DE 68920767 D1 DE68920767 D1 DE 68920767D1
Authority
DE
Germany
Prior art keywords
semiconductor package
package
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68920767T
Other languages
English (en)
Other versions
DE68920767T2 (de
Inventor
Akira Tanaka
Kazuji Yamada
Hirokazu Inoue
Hideo Arakawa
Masahide Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE68920767D1 publication Critical patent/DE68920767D1/de
Application granted granted Critical
Publication of DE68920767T2 publication Critical patent/DE68920767T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

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    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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DE1989620767 1988-04-04 1989-04-04 Halbleiterpackung. Expired - Fee Related DE68920767T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8125888A JPH0756887B2 (ja) 1988-04-04 1988-04-04 半導体パッケージ及びそれを用いたコンピュータ

Publications (2)

Publication Number Publication Date
DE68920767D1 true DE68920767D1 (de) 1995-03-09
DE68920767T2 DE68920767T2 (de) 1995-06-01

Family

ID=13741349

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1989620767 Expired - Fee Related DE68920767T2 (de) 1988-04-04 1989-04-04 Halbleiterpackung.

Country Status (4)

Country Link
US (1) US5097318A (de)
EP (1) EP0336359B1 (de)
JP (1) JPH0756887B2 (de)
DE (1) DE68920767T2 (de)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010030370A1 (en) * 1990-09-24 2001-10-18 Khandros Igor Y. Microelectronic assembly having encapsulated wire bonding leads
JP2730304B2 (ja) * 1991-03-13 1998-03-25 日本電気株式会社 半導体装置
US5199164A (en) * 1991-03-30 1993-04-06 Samsung Electronics Co., Ltd. Method of manufacturing semiconductor package
EP0714127B1 (de) * 1991-11-28 2003-01-29 Kabushiki Kaisha Toshiba Halbleitergehäuse
WO1994007264A1 (en) * 1992-09-16 1994-03-31 Clayton James E A thin multichip module
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EP0336359A2 (de) 1989-10-11
JPH01253942A (ja) 1989-10-11
EP0336359B1 (de) 1995-01-25
EP0336359A3 (de) 1991-03-20
DE68920767T2 (de) 1995-06-01
JPH0756887B2 (ja) 1995-06-14
US5097318A (en) 1992-03-17

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