KR910700506A - 휴대형 전자토큰 - Google Patents

휴대형 전자토큰

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Publication number
KR910700506A
KR910700506A KR1019900702074A KR900702074A KR910700506A KR 910700506 A KR910700506 A KR 910700506A KR 1019900702074 A KR1019900702074 A KR 1019900702074A KR 900702074 A KR900702074 A KR 900702074A KR 910700506 A KR910700506 A KR 910700506A
Authority
KR
South Korea
Prior art keywords
portable electronic
electronic token
token
component
tension member
Prior art date
Application number
KR1019900702074A
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English (en)
Inventor
챨스 리챠드 자비스
Original Assignee
질리안 콕카인
더블유 앤드 티 에브리 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 질리안 콕카인, 더블유 앤드 티 에브리 리미티드 filed Critical 질리안 콕카인
Publication of KR910700506A publication Critical patent/KR910700506A/ko

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223—One or more of the layers being plastic
    • B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/34—Moulds or cores; Details thereof or accessories therefor movable, e.g. to or from the moulding station
    • B29C33/36—Moulds or cores; Details thereof or accessories therefor movable, e.g. to or from the moulding station continuously movable in one direction, e.g. in a closed circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/70—Completely encapsulating inserts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
    • B29C67/246—Moulding high reactive monomers or prepolymers, e.g. by reaction injection moulding [RIM], liquid injection moulding [LIM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • Chemical & Material Sciences (AREA)
  • Credit Cards Or The Like (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Lock And Its Accessories (AREA)
  • Developing Agents For Electrophotography (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Abstract

내용 없음.

Description

휴대형 전자토큰
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 크레디트 카아드 사이즈의 치수를 가지는 휴대용 토큰(1)을 도시하는데, 그러한 카드는 집적회로등의 복수의 전자 부품(2)을 구비하며, 그 회로는 일반적으로 마이크로프로세싱 및 메모리 기능을 가지며, 폴리이미드 또는 폴리 에스테르로된 가요성 기판(3)상에 장착된다.
제2도는 도시한 실시예는 유사한 부분에 대해서는 동일한 참조 번호를 사용하였지만 한쌍의 포일(7a,7b)이 프레임(15)으로 대체 된 것이 다른데, 이러한 프레임은 고인장 강철로 이루어지며, 그러한 강철은 부품(2)을 에워싸며, 글로브 탑 수지(11)에 의해 기판(3)에 부착되며, 상기 수지는 또한 보호에 있어 도움이 되도록 부품(2)보다 넓게 연장한다.

Claims (17)

  1. 플라스틱체내에 캡슐화된 복수의 별개의 부품을 가지는 토큰으로서, 상기 부품을 에워싸는 토큰의 영역이 플렉싱으로부터 제약되도록 각 부품과 관련하여 용착된 적어도 하나의 각각의 고인장 부재를 가지며, 상기 각각의 부품은 이웃한 부품 사이의 탄성 힌지 부분을 형성하도록 그 사이에서 연장하는 가요성 기판상에 장착되는 것을 특징으로 하는 휴대형 전자 토큰.
  2. 제1항에 있어서, 상기 토큰의 대향 표면을 형성하는 한쌍의 페이스 부재를 구비하며, 상기 가요성 기판은 상기 한쌍의 페이스 부재 사이에 용착되는 것을 특징으로 하는 휴대형 전자 토큰.
  3. 제1항에 있어서, 상기 페이스 부재를 폴리카보네이트 또는 폴리에스테르인 것을 특징으로 하는 휴대형 전자 토큰.
  4. 제1항에 있어서, 상기 인장 부재는 상기 부품과 기판 위, 아래의 용착부에서 각 부품과 결합되는 것을 특징으로 하는 휴대형 전자 토큰.
  5. 제4항에 있어서, 각 부품과 결합된 상기 연장부재중 하나는 기판과 일체로 되는 것을 특징으로 하는 휴대용 전자 토큰.
  6. 제1항에 있어서, 하나의 인장부재는 하나의 부품을 에워싸는 것을 특징으로 하는 휴대형 전자 토큰.
  7. 제6항에 있어서, 상기 인장 부재는 내부에 개구를 가지는 환형 또는 다각형 플레이트인 것을 특징으로 하는 휴대형 전자 토큰.
  8. 제1항에 있어서, 각각의 부품은 경 글로브 탑 수지 물질내에 캡슐화되는 것을 특징으로 하는 휴대형 전자 토큰.
  9. 제1항에 있어서, 상기 인장 부재는 금속박인 것을 특징으로 휴대형 전자 토큰.
  10. 제9항에 있어서, 상기 금속박은 니켈, 스테인레스강 또는 고인장 강인 것을 특징으로 하는 휴대형 전자 토큰.
  11. 제1항에 있어서, 상기 인장 부재는 하드 성형 수지로 형성되는 것을 특징으로 하는 휴대용 전자 토큰.
  12. 제11항에 있어서, 상기 수지는 상기 기판상에 직접적으로 성형되는 것을 특징으로 하는 휴대용 전자 토큰.
  13. 제11항에 있어서, 상기 수지는 글로브 탑 수지인 것을 특징으로 하는 휴대형 전자 토큰.
  14. 제1항에 있어서, 데이타를 전송 및 수신하도록 외부의 판독/기입 유니트와 상호 작용하는 처리수단, 메모리수단, 유도 입/출력수단을 구비하는 것을 특징으로 하는 휴대형 전자 토큰.
  15. 제7항에 있어서, 치수가 8.5×5.4×0.07cm이며, 전 가요성 특성을 가지는 것을 특징으로 하는 휴대형 전자 토큰.
  16. 제3항에 있어서, 페이스 부재는 라벨로서 작용하는 것을 특징으로 하는 휴대형 전자 토큰.
  17. 제16항에 있어서, 라벨의 그래픽 화상은 페이스 부재는 내부 표면상에 있는 것을 특징으로 하는 휴대형 전자 토큰.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900702074A 1989-01-19 1990-01-18 휴대형 전자토큰 KR910700506A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB8901189.4 1989-01-19
GB898901189A GB8901189D0 (en) 1989-01-19 1989-01-19 Portable electronic token
PCT/GB1990/000081 WO1990008365A1 (en) 1989-01-19 1990-01-18 Portable electronic token

Publications (1)

Publication Number Publication Date
KR910700506A true KR910700506A (ko) 1991-03-15

Family

ID=10650286

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900702074A KR910700506A (ko) 1989-01-19 1990-01-18 휴대형 전자토큰

Country Status (14)

Country Link
US (1) US5200601A (ko)
EP (1) EP0383435B1 (ko)
JP (1) JPH03503390A (ko)
KR (1) KR910700506A (ko)
AT (1) ATE122811T1 (ko)
AU (1) AU625340B2 (ko)
CA (1) CA2025239A1 (ko)
DE (1) DE69019392T2 (ko)
DK (1) DK0383435T3 (ko)
ES (1) ES2071758T3 (ko)
GB (2) GB8901189D0 (ko)
IL (1) IL93084A0 (ko)
NZ (1) NZ232131A (ko)
WO (1) WO1990008365A1 (ko)

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GB2253591A (en) * 1991-03-15 1992-09-16 Gec Avery Ltd Integrated circuit card
US5340968A (en) * 1991-05-07 1994-08-23 Nippondenso Company, Ltd. Information storage medium with electronic and visual areas
FR2686996B1 (fr) * 1992-01-31 1996-02-02 Solaic Sa Procede de fabrication d'une carte a memoire comprenant un micromodule equipe d'un capot, et carte a memoire ainsi obtenue.
GB9313749D0 (en) * 1993-07-02 1993-08-18 Gec Avery Ltd A device comprising a flexible printed circuit
GB9313755D0 (en) * 1993-07-02 1993-08-18 Gec Avery Ltd A method of encapsulating components on a printed circuit
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EP0383435A1 (en) 1990-08-22
AU4843590A (en) 1990-08-13
GB2227209A (en) 1990-07-25
GB8901189D0 (en) 1989-03-15
NZ232131A (en) 1992-08-26
GB9001191D0 (en) 1990-03-21
ES2071758T3 (es) 1995-07-01
US5200601A (en) 1993-04-06
AU625340B2 (en) 1992-07-09
ATE122811T1 (de) 1995-06-15
IL93084A0 (en) 1990-11-05
CA2025239A1 (en) 1990-07-20
JPH03503390A (ja) 1991-08-01
DE69019392D1 (de) 1995-06-22
GB2227209B (en) 1992-06-10
DK0383435T3 (da) 1995-08-14
DE69019392T2 (de) 1995-10-05
EP0383435B1 (en) 1995-05-17
WO1990008365A1 (en) 1990-07-26

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