FR2662505B1 - Puce de circuit integre a semiconducteurs possedant un circuit d'identification a l'interieur. - Google Patents

Puce de circuit integre a semiconducteurs possedant un circuit d'identification a l'interieur.

Info

Publication number
FR2662505B1
FR2662505B1 FR909010474A FR9010474A FR2662505B1 FR 2662505 B1 FR2662505 B1 FR 2662505B1 FR 909010474 A FR909010474 A FR 909010474A FR 9010474 A FR9010474 A FR 9010474A FR 2662505 B1 FR2662505 B1 FR 2662505B1
Authority
FR
France
Prior art keywords
semiconductors
integrated circuit
identification
circuit chip
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR909010474A
Other languages
English (en)
Other versions
FR2662505A1 (fr
Inventor
Dong-Su Jeon
Yong-Sik Seok
Jeon Dong-Su
Seok Yong-Sik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of FR2662505A1 publication Critical patent/FR2662505A1/fr
Application granted granted Critical
Publication of FR2662505B1 publication Critical patent/FR2662505B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203—Particular design considerations for integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/006—Identification
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1015—Read-write modes for single port memories, i.e. having either a random port or a serial port
    • G11C7/1045—Read-write mode select circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C2029/4402—Internal storage of test result, quality data, chip identification, repair information
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H01L2223/5444—Marks applied to semiconductor devices or parts containing identification or tracking information for electrical read out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
FR909010474A 1990-05-23 1990-08-20 Puce de circuit integre a semiconducteurs possedant un circuit d'identification a l'interieur. Expired - Lifetime FR2662505B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019900007481A KR920007535B1 (ko) 1990-05-23 1990-05-23 식별회로를 구비한 반도체 집적회로 칩

Publications (2)

Publication Number Publication Date
FR2662505A1 FR2662505A1 (fr) 1991-11-29
FR2662505B1 true FR2662505B1 (fr) 1994-09-09

Family

ID=19299365

Family Applications (1)

Application Number Title Priority Date Filing Date
FR909010474A Expired - Lifetime FR2662505B1 (fr) 1990-05-23 1990-08-20 Puce de circuit integre a semiconducteurs possedant un circuit d'identification a l'interieur.

Country Status (12)

Country Link
US (1) US5103166A (fr)
JP (2) JPH079753B2 (fr)
KR (1) KR920007535B1 (fr)
CN (1) CN1025261C (fr)
DE (1) DE4026326C2 (fr)
FR (1) FR2662505B1 (fr)
GB (1) GB2244339B (fr)
HK (1) HK21896A (fr)
IT (1) IT1242519B (fr)
NL (1) NL194814C (fr)
RU (1) RU2034306C1 (fr)
SE (1) SE508000C2 (fr)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5332973A (en) * 1992-05-01 1994-07-26 The University Of Manitoba Built-in fault testing of integrated circuits
US5363134A (en) * 1992-05-20 1994-11-08 Hewlett-Packard Corporation Integrated circuit printhead for an ink jet printer including an integrated identification circuit
US5787174A (en) * 1992-06-17 1998-07-28 Micron Technology, Inc. Remote identification of integrated circuit
JP3659981B2 (ja) * 1992-07-09 2005-06-15 アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド ダイ特定情報に特徴付けられるダイ上の集積回路を含む装置
US7158031B2 (en) 1992-08-12 2007-01-02 Micron Technology, Inc. Thin, flexible, RFID label and system for use
US5426375A (en) * 1993-02-26 1995-06-20 Hitachi Micro Systems, Inc. Method and apparatus for optimizing high speed performance and hot carrier lifetime in a MOS integrated circuit
US5440230A (en) * 1993-04-02 1995-08-08 Heflinger; Bruce L. Combinatorial signature for component identification
US5686759A (en) * 1995-09-29 1997-11-11 Intel Corporation Integrated circuit package with permanent identification of device characteristics and method for adding the same
US5818251A (en) * 1996-06-11 1998-10-06 National Semiconductor Corporation Apparatus and method for testing the connections between an integrated circuit and a printed circuit board
US5867505A (en) * 1996-08-07 1999-02-02 Micron Technology, Inc. Method and apparatus for testing an integrated circuit including the step/means for storing an associated test identifier in association with integrated circuit identifier for each test to be performed on the integrated circuit
US5927512A (en) * 1997-01-17 1999-07-27 Micron Technology, Inc. Method for sorting integrated circuit devices
US6100486A (en) 1998-08-13 2000-08-08 Micron Technology, Inc. Method for sorting integrated circuit devices
US6072574A (en) 1997-01-30 2000-06-06 Micron Technology, Inc. Integrated circuit defect review and classification process
US5844803A (en) 1997-02-17 1998-12-01 Micron Technology, Inc. Method of sorting a group of integrated circuit devices for those devices requiring special testing
US5915231A (en) 1997-02-26 1999-06-22 Micron Technology, Inc. Method in an integrated circuit (IC) manufacturing process for identifying and redirecting IC's mis-processed during their manufacture
US5856923A (en) 1997-03-24 1999-01-05 Micron Technology, Inc. Method for continuous, non lot-based integrated circuit manufacturing
US5959912A (en) * 1997-04-30 1999-09-28 Texas Instruments Incorporated ROM embedded mask release number for built-in self-test
US5984190A (en) * 1997-05-15 1999-11-16 Micron Technology, Inc. Method and apparatus for identifying integrated circuits
US5907492A (en) 1997-06-06 1999-05-25 Micron Technology, Inc. Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs
US7120513B1 (en) 1997-06-06 2006-10-10 Micron Technology, Inc. Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs
US6339385B1 (en) 1997-08-20 2002-01-15 Micron Technology, Inc. Electronic communication devices, methods of forming electrical communication devices, and communication methods
US6049624A (en) 1998-02-20 2000-04-11 Micron Technology, Inc. Non-lot based method for assembling integrated circuit devices
KR100261223B1 (ko) 1998-05-04 2000-07-01 윤종용 식별 회로를 구비하는 반도체장치 및 그 기능 식별방법
US6265232B1 (en) * 1998-08-21 2001-07-24 Micron Technology, Inc. Yield based, in-line defect sampling method
US6268228B1 (en) 1999-01-27 2001-07-31 International Business Machines Corporation Electrical mask identification of memory modules
US6351116B1 (en) * 1999-09-30 2002-02-26 Rockwell Automation Technologies, Inc. System and method for on-line hall sensor programming
US6791157B1 (en) 2000-01-18 2004-09-14 Advanced Micro Devices, Inc. Integrated circuit package incorporating programmable elements
US6430016B1 (en) 2000-02-11 2002-08-06 Micron Technology, Inc. Setpoint silicon controlled rectifier (SCR) electrostatic discharge (ESD) core clamp
US6772356B1 (en) 2000-04-05 2004-08-03 Advanced Micro Devices, Inc. System for specifying core voltage for a microprocessor by selectively outputting one of a first, fixed and a second, variable voltage control settings from the microprocessor
DE10018356B4 (de) * 2000-04-13 2005-05-04 Siemens Ag Verfahren zum Identifizieren eines elektronischen Steuergeräts und dafür geeignetes Steuergerät
JPWO2002050910A1 (ja) * 2000-12-01 2004-04-22 株式会社日立製作所 半導体集積回路装置の識別方法と半導体集積回路装置の製造方法及び半導体集積回路装置
GB2374426B (en) * 2001-02-07 2003-10-29 Samsung Electronics Co Ltd Apparatus for recognizing chip identification and semiconductor device comprising the apparatus
KR100393214B1 (ko) 2001-02-07 2003-07-31 삼성전자주식회사 패드의 수를 최소화하기 위한 칩 식별 부호 인식 장치 및이를 내장한 반도체 장치
US7188261B1 (en) 2001-05-01 2007-03-06 Advanced Micro Devices, Inc. Processor operational range indicator
JP3941620B2 (ja) * 2001-08-31 2007-07-04 株式会社デンソーウェーブ Ｉｄタグ内蔵電子機器
US7573159B1 (en) 2001-10-22 2009-08-11 Apple Inc. Power adapters for powering and/or charging peripheral devices
DE10241141B4 (de) * 2002-09-05 2015-07-16 Infineon Technologies Ag Halbleiter-Bauelement-Test-Verfahren für ein Halbleiter-Bauelement-Test-System mit reduzierter Anzahl an Test-Kanälen
US7319935B2 (en) * 2003-02-12 2008-01-15 Micron Technology, Inc. System and method for analyzing electrical failure data
JP4272968B2 (ja) * 2003-10-16 2009-06-03 エルピーダメモリ株式会社 半導体装置および半導体チップ制御方法
KR100688518B1 (ko) * 2005-01-12 2007-03-02 삼성전자주식회사 개별 칩들의 디바이스 정보를 직접 판독할 수 있는시그너처 식별 장치를 갖는 멀티 칩 패키지
GB0617697D0 (en) * 2006-09-08 2006-10-18 Algotronix Ltd Method of actively tagging electronic designs and intellectual property cores
KR101161966B1 (ko) * 2010-07-09 2012-07-04 에스케이하이닉스 주식회사 칩 어드레스 회로를 포함하는 멀티 칩 패키지 장치
US10155698B2 (en) 2010-12-02 2018-12-18 Frosty Cold, Llc Cooling agent for cold packs and food and beverage containers
US9879897B2 (en) 2010-12-02 2018-01-30 Frosty Cold, Llc Cooling agent for cold packs and food and beverage containers
CN104228347B (zh) * 2013-06-18 2016-08-17 研能科技股份有限公司 喷墨头芯片
JP6091393B2 (ja) * 2013-10-01 2017-03-08 三菱電機株式会社 半導体装置
US20160065334A1 (en) * 2014-08-29 2016-03-03 R&D Circuits, Inc Structure and Implementation Method for implementing an embedded serial data test loopback, residing directly under the device within a printed circuit board
JP7305934B2 (ja) * 2018-08-02 2023-07-11 富士電機株式会社 差動増幅回路を備える装置

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE756139A (fr) * 1969-09-15 1971-02-15 Rca Corp Circuit intermediaire integre pour le couplage d'un circuit de commandea impedance de sortie faible a une charge a impedance d'entree elevee
US4020365A (en) * 1976-03-22 1977-04-26 Intersil Incorporated Integrated field-effect transistor switch
US4055802A (en) * 1976-08-12 1977-10-25 Bell Telephone Laboratories, Incorporated Electrical identification of multiply configurable circuit array
US4150331A (en) * 1977-07-29 1979-04-17 Burroughs Corporation Signature encoding for integrated circuits
US4301403A (en) * 1978-12-21 1981-11-17 Measurement Technology Ltd. Electrical circuit testing
DE3002894C2 (de) * 1980-01-28 1982-03-18 Siemens AG, 1000 Berlin und 8000 München Monolithisch integrierte Halbleiterschaltung mit Transistoren
JPS57191896A (en) * 1981-05-21 1982-11-25 Mitsubishi Electric Corp Semiconductor integrated circuit
US4480199A (en) * 1982-03-19 1984-10-30 Fairchild Camera & Instrument Corp. Identification of repaired integrated circuits
US4465973A (en) * 1982-05-17 1984-08-14 Motorola, Inc. Pad for accelerated memory test
JPS59112499A (ja) * 1982-12-18 1984-06-28 Mitsubishi Electric Corp 半導体メモリ装置
JPS59129999A (ja) * 1983-01-17 1984-07-26 Mitsubishi Electric Corp 半導体メモリ装置
JPS59157900A (ja) * 1983-02-25 1984-09-07 Nec Corp 冗長ビツト使用の検出回路を有するメモリ装置
US4510673A (en) * 1983-06-23 1985-04-16 International Business Machines Corporation Laser written chip identification method
US4595875A (en) * 1983-12-22 1986-06-17 Monolithic Memories, Incorporated Short detector for PROMS
GB8428405D0 (en) * 1984-11-09 1984-12-19 Membrain Ltd Automatic test equipment
US4719418A (en) * 1985-02-19 1988-01-12 International Business Machines Corporation Defect leakage screen system
JPH0782746B2 (ja) * 1985-03-25 1995-09-06 株式会社日立製作所 ダイナミツク型ｒａｍ
JPS61265829A (ja) * 1985-05-20 1986-11-25 Fujitsu Ltd 半導体集積回路
DE3526485A1 (de) * 1985-07-24 1987-02-05 Heinz Krug Schaltungsanordnung zum pruefen integrierter schaltungseinheiten
US4698589A (en) * 1986-03-21 1987-10-06 Harris Corporation Test circuitry for testing fuse link programmable memory devices
US4970454A (en) * 1986-12-09 1990-11-13 Texas Instruments Incorporated Packaged semiconductor device with test circuits for determining fabrication parameters
US4779043A (en) * 1987-08-26 1988-10-18 Hewlett-Packard Company Reversed IC test device and method
US4853628A (en) * 1987-09-10 1989-08-01 Gazelle Microcircuits, Inc. Apparatus for measuring circuit parameters of a packaged semiconductor device
JPH0175400U (fr) * 1987-11-09 1989-05-22
GB2220272B (en) * 1988-06-29 1992-09-30 Texas Instruments Ltd Improvements in or relating to integrated circuits
JPH0291898A (ja) * 1988-09-27 1990-03-30 Nec Corp 半導体記憶装置
JP2705142B2 (ja) * 1988-10-13 1998-01-26 日本電気株式会社 半導体集積回路装置
US4942358A (en) * 1988-11-02 1990-07-17 Motorola, Inc. Integrated circuit option identification circuit and method

Also Published As

Publication number Publication date
KR920007535B1 (ko) 1992-09-05
JP3343345B2 (ja) 2002-11-11
SE508000C2 (sv) 1998-08-10
IT9021274A1 (it) 1991-11-24
GB2244339B (en) 1994-04-27
JPH0428088A (ja) 1992-01-30
DE4026326C2 (de) 1995-07-27
JP2001135796A (ja) 2001-05-18
FR2662505A1 (fr) 1991-11-29
HK21896A (en) 1996-02-09
SE9002701L (sv) 1991-11-24
IT9021274A0 (it) 1990-08-14
KR910020883A (ko) 1991-12-20
RU2034306C1 (ru) 1995-04-30
NL194814B (nl) 2002-11-01
SE9002701D0 (sv) 1990-08-20
GB2244339A (en) 1991-11-27
NL194814C (nl) 2003-03-04
IT1242519B (it) 1994-05-16
NL9001837A (nl) 1991-12-16
CN1025261C (zh) 1994-06-29
CN1056770A (zh) 1991-12-04
GB9017779D0 (en) 1990-09-26
DE4026326A1 (de) 1991-11-28
US5103166A (en) 1992-04-07
JPH079753B2 (ja) 1995-02-01

Similar Documents

Publication Publication Date Title
FR2662505B1 (fr) Puce de circuit integre a semiconducteurs possedant un circuit d'identification a l'interieur.
DE69015154D1 (de) Kontaktlose integrierte Schaltungskarte.
FR2660092B1 (fr) Procede de fabrication d'une carte a circuit integre.
DE69100052D1 (de) Integrierte schaltung fuer verbesserten zugang.
DE69123887D1 (de) Integrierte Schaltungskarte
FR2661761B1 (fr) Carte a circuit integre.
DE69020077D1 (de) Integrierte Schaltungskarte.
DE398605T1 (de) Integrierter schaltungschip mit metallzwischenverbindungen.
DE69013267D1 (de) Integrierte Halbleiterschaltungsanordnung.
DE69023565T2 (de) Integrierte Halbleiterschaltung.
FR2678753B1 (fr) Fabrication de cartes a puce a module autodetachable.
DE69012194T2 (de) Integrierter Halbleiterschaltkreis.
DE69121288T2 (de) Karte mit Mikroschaltkreis
FR2669468B1 (fr) Circuit integre a semiconducteur multicouche.
NL194417B (nl) Ge´ntegreerde halfgeleiderschakeling.
DE69011038D1 (de) Integrierte Halbleiterschaltung.
DE69111528D1 (de) Integrierter Halbleiterschaltkreis.
DE69021273T2 (de) Integrierte Speicherschaltung mit einem Leseverstärker.
FR2669452B1 (fr) Lecteur enregistreur de cartes a puce.
DE69019333T2 (de) Logische Halbleiterschaltung.
DE69012848D1 (de) Integrierte Halbleiterschaltungsanordnungen.
DE69021775D1 (de) Integrierte Speicherschaltung mit einem Leseverstärker.
DE69023612T2 (de) Integrierte Schaltung.
DE69112476D1 (de) Integrierter Halbleiterschaltkreis.
DE69023728D1 (de) Integrierte Halbleiterschaltungsanordnung.