FR2661761B1 - Carte a circuit integre. - Google Patents

Carte a circuit integre.

Info

Publication number
FR2661761B1
FR2661761B1 FR919105596A FR9105596A FR2661761B1 FR 2661761 B1 FR2661761 B1 FR 2661761B1 FR 919105596 A FR919105596 A FR 919105596A FR 9105596 A FR9105596 A FR 9105596A FR 2661761 B1 FR2661761 B1 FR 2661761B1
Authority
FR
France
Prior art keywords
integrated circuit
circuit card
card
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR919105596A
Other languages
English (en)
Other versions
FR2661761A1 (fr
Inventor
Kodai Shojiro
Ochi Katsunori
Murakami Osamu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2661761A1 publication Critical patent/FR2661761A1/fr
Application granted granted Critical
Publication of FR2661761B1 publication Critical patent/FR2661761B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
FR919105596A 1990-05-07 1991-05-07 Carte a circuit integre. Expired - Fee Related FR2661761B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2117984A JP2602343B2 (ja) 1990-05-07 1990-05-07 Ｉｃカード

Publications (2)

Publication Number Publication Date
FR2661761A1 FR2661761A1 (fr) 1991-11-08
FR2661761B1 true FR2661761B1 (fr) 1993-04-23

Family

ID=14725140

Family Applications (1)

Application Number Title Priority Date Filing Date
FR919105596A Expired - Fee Related FR2661761B1 (fr) 1990-05-07 1991-05-07 Carte a circuit integre.

Country Status (3)

Country Link
US (1) US5173840A (fr)
JP (1) JP2602343B2 (fr)
FR (1) FR2661761B1 (fr)

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US6036099A (en) * 1995-10-17 2000-03-14 Leighton; Keith Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom
US5817207A (en) * 1995-10-17 1998-10-06 Leighton; Keith R. Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards
US6091605A (en) * 1996-04-26 2000-07-18 Ramey; Samuel C. Memory card connector and cover apparatus and method
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JP3883652B2 (ja) * 1997-06-23 2007-02-21 大日本印刷株式会社 板状枠体付きｉｃキャリアとその製造方法
FR2769130B1 (fr) * 1997-09-30 2001-06-08 Thomson Csf Procede d'enrobage d'une puce electronique et carte electronique comportant au moins une puce enrobee selon ce procede
US6128195A (en) * 1997-11-18 2000-10-03 Hestia Technologies, Inc. Transfer molded PCMCIA standard cards
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US6215671B1 (en) 1998-12-10 2001-04-10 Garmin Corporation Method and apparatus for connecting circuit boards
US6250553B1 (en) 1998-12-30 2001-06-26 Garmin Corporation Data card having a retractable handle
FR2803434A1 (fr) * 1999-12-30 2001-07-06 Schlumberger Systems & Service Procede de protection d'un circuit integre dispose dans une cavite d'un corps de carte et outil correspondant
US6923378B2 (en) * 2000-12-22 2005-08-02 Digimarc Id Systems Identification card
AT410728B (de) * 2001-02-09 2003-07-25 Pollmann Austria Ohg Verfahren zum einbetten zumindest einer flexiblen leiterbahnfolie in kunststoff, leiterbahneneinheitsowie einbettungseinheit hiefür
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US6956284B2 (en) 2001-10-26 2005-10-18 Staktek Group L.P. Integrated circuit stacking system and method
US7656678B2 (en) 2001-10-26 2010-02-02 Entorian Technologies, Lp Stacked module systems
US7202555B2 (en) 2001-10-26 2007-04-10 Staktek Group L.P. Pitch change and chip scale stacking system and method
US7081373B2 (en) 2001-12-14 2006-07-25 Staktek Group, L.P. CSP chip stack with flex circuit
ATE509326T1 (de) 2001-12-18 2011-05-15 L 1 Secure Credentialing Inc Mehrfachbildsicherheitsmerkmale zur identifikation von dokumenten und verfahren zu ihrer herstellung
US7815124B2 (en) 2002-04-09 2010-10-19 L-1 Secure Credentialing, Inc. Image processing techniques for printing identification cards and documents
WO2003055638A1 (fr) 2001-12-24 2003-07-10 Digimarc Id Systems, Llc Elements de securite grave au laser destines a des documents d'identification et procedes de fabrication de ces elements
EP1459246B1 (fr) 2001-12-24 2012-05-02 L-1 Secure Credentialing, Inc. Procede du marquage au laser en couleur de documents d' identification
US7728048B2 (en) 2002-12-20 2010-06-01 L-1 Secure Credentialing, Inc. Increasing thermal conductivity of host polymer used with laser engraving methods and compositions
US7694887B2 (en) 2001-12-24 2010-04-13 L-1 Secure Credentialing, Inc. Optically variable personalized indicia for identification documents
ATE552120T1 (de) 2001-12-24 2012-04-15 L 1 Secure Credentialing Inc Verdeckte variableninformationen auf id- dokumenten und verfahren zu ihrer herstellung
US7824029B2 (en) 2002-05-10 2010-11-02 L-1 Secure Credentialing, Inc. Identification card printer-assembler for over the counter card issuing
AU2003298731A1 (en) 2002-11-26 2004-06-18 Digimarc Id Systems Systems and methods for managing and detecting fraud in image databases used with identification documents
WO2004095348A2 (fr) 2003-04-16 2004-11-04 Digimarc Corporation Stockage de donnees en trois dimensions
JP5146711B2 (ja) * 2003-05-29 2013-02-20 アイシン精機株式会社 樹脂封止品製造方法及びケース
US7579687B2 (en) 2004-09-03 2009-08-25 Entorian Technologies, Lp Circuit module turbulence enhancement systems and methods
US20060050492A1 (en) 2004-09-03 2006-03-09 Staktek Group, L.P. Thin module system and method
US7446410B2 (en) 2004-09-03 2008-11-04 Entorian Technologies, Lp Circuit module with thermal casing systems
US7443023B2 (en) 2004-09-03 2008-10-28 Entorian Technologies, Lp High capacity thin module system
US7606040B2 (en) 2004-09-03 2009-10-20 Entorian Technologies, Lp Memory module system and method
US7511968B2 (en) 2004-09-03 2009-03-31 Entorian Technologies, Lp Buffered thin module system and method
US7606049B2 (en) 2004-09-03 2009-10-20 Entorian Technologies, Lp Module thermal management system and method
US7606050B2 (en) 2004-09-03 2009-10-20 Entorian Technologies, Lp Compact module system and method
US7289327B2 (en) 2006-02-27 2007-10-30 Stakick Group L.P. Active cooling methods and apparatus for modules
US7468893B2 (en) 2004-09-03 2008-12-23 Entorian Technologies, Lp Thin module system and method
US7616452B2 (en) 2004-09-03 2009-11-10 Entorian Technologies, Lp Flex circuit constructions for high capacity circuit module systems and methods
US7542297B2 (en) 2004-09-03 2009-06-02 Entorian Technologies, Lp Optimized mounting area circuit module system and method
US7423885B2 (en) 2004-09-03 2008-09-09 Entorian Technologies, Lp Die module system
US7522421B2 (en) 2004-09-03 2009-04-21 Entorian Technologies, Lp Split core circuit module
US7760513B2 (en) 2004-09-03 2010-07-20 Entorian Technologies Lp Modified core for circuit module system and method
US7324352B2 (en) 2004-09-03 2008-01-29 Staktek Group L.P. High capacity thin module system and method
US7908080B2 (en) 2004-12-31 2011-03-15 Google Inc. Transportation routing
US7033861B1 (en) 2005-05-18 2006-04-25 Staktek Group L.P. Stacked module systems and method
US7378301B2 (en) * 2005-06-10 2008-05-27 Kingston Technology Corporation Method for molding a small form factor digital memory card
US7601563B2 (en) * 2005-06-10 2009-10-13 Kingston Technology Corporation Small form factor molded memory card and a method thereof
JP2007026421A (ja) * 2005-06-15 2007-02-01 Toshiba Corp 携帯型記憶装置
US7663214B2 (en) * 2005-07-25 2010-02-16 Kingston Technology Corporation High-capacity memory card and method of making the same
US7608469B2 (en) * 2005-08-25 2009-10-27 Kingston Technology Corporation Method of fabricating a chip
JP2007157763A (ja) * 2005-11-30 2007-06-21 Mitsumi Electric Co Ltd 回路モジュール
US7511969B2 (en) 2006-02-02 2009-03-31 Entorian Technologies, Lp Composite core circuit module system and method
DE102007008487A1 (de) * 2007-02-19 2008-08-21 Smartrac Ip B.V. Verfahren und Halbzeug zur Herstellung eines Inlays
FR2913808B1 (fr) * 2007-03-16 2009-04-24 Siemens Vdo Automotive Sas Procede d'entancheisation d'un capteur electronique de forme complexe par injection basse pression de resine reactive
CN102076189B (zh) 2010-02-02 2015-09-09 苹果公司 电子设备部件、电子设备和相关方法
US8576561B2 (en) 2010-02-02 2013-11-05 Apple Inc. Handheld device enclosure
DE102014206565A1 (de) * 2014-04-04 2015-10-08 Robert Bosch Gmbh Verfahren zum Herstellen einer dreidimensionalen Schaltungsanordnung und Schaltungsanordnung
FR3061406B1 (fr) * 2016-12-23 2019-05-31 Idemia France Procede de fabrication d'une couche centrale d'une carte a microcircuit
CN106961800B (zh) * 2017-03-21 2019-03-29 奥士康精密电路（惠州）有限公司 一种pcb上双排ic夹线制作方法

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Also Published As

Publication number Publication date
JPH0414497A (ja) 1992-01-20
US5173840A (en) 1992-12-22
JP2602343B2 (ja) 1997-04-23
FR2661761A1 (fr) 1991-11-08

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Legal Events

Date Code Title Description
D6 Patent endorsed licences of rights
ST Notification of lapse