FR2575567B1 - Carte a circuit integre - Google Patents

Carte a circuit integre

Info

Publication number
FR2575567B1
FR2575567B1 FR8519336A FR8519336A FR2575567B1 FR 2575567 B1 FR2575567 B1 FR 2575567B1 FR 8519336 A FR8519336 A FR 8519336A FR 8519336 A FR8519336 A FR 8519336A FR 2575567 B1 FR2575567 B1 FR 2575567B1
Authority
FR
France
Prior art keywords
integrated circuit
circuit card
card
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR8519336A
Other languages
English (en)
Other versions
FR2575567A1 (fr
Inventor
Yoshihiko Nakahara
Masao Muramatsu
Kouichi Ueno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyodo Printing Co Ltd
Original Assignee
Kyodo Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyodo Printing Co Ltd filed Critical Kyodo Printing Co Ltd
Publication of FR2575567A1 publication Critical patent/FR2575567A1/fr
Application granted granted Critical
Publication of FR2575567B1 publication Critical patent/FR2575567B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
FR8519336A 1984-12-29 1985-12-27 Carte a circuit integre Expired - Lifetime FR2575567B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59277734A JPS61157990A (ja) 1984-12-29 1984-12-29 Ｉｃカ−ド

Publications (2)

Publication Number Publication Date
FR2575567A1 FR2575567A1 (fr) 1986-07-04
FR2575567B1 true FR2575567B1 (fr) 1991-05-17

Family

ID=17587579

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8519336A Expired - Lifetime FR2575567B1 (fr) 1984-12-29 1985-12-27 Carte a circuit integre

Country Status (4)

Country Link
US (1) US4682017A (fr)
JP (1) JPS61157990A (fr)
DE (1) DE3546272A1 (fr)
FR (1) FR2575567B1 (fr)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6238035A (ja) * 1985-08-12 1987-02-19 Nissan Motor Co Ltd 薄板型携帯機
JPH0615273B2 (ja) * 1986-01-20 1994-03-02 株式会社アイテイテイキャノン Ｉｃカード
JPS62201295A (ja) * 1986-02-28 1987-09-04 松下電器産業株式会社 Ｉｃカ−ドおよびその製造方法
JPH0696356B2 (ja) * 1986-03-17 1994-11-30 三菱電機株式会社 薄型半導体カード
JPS62227796A (ja) * 1986-03-31 1987-10-06 松下電器産業株式会社 Ｉｃカ−ド
JPS62227797A (ja) * 1986-03-31 1987-10-06 松下電器産業株式会社 Ｉｃカ−ド
JPS63149191A (ja) * 1986-12-15 1988-06-21 日立マクセル株式会社 Ｉｃカ−ド
FR2617666B1 (fr) * 1987-07-02 1989-10-27 Bull Cp8 Carte a microcircuits electroniques et son procede de fabrication
US5282113A (en) * 1990-03-05 1994-01-25 Hitachi Maxell, Ltd. Memory card with a plurality of contact spaces
JP2602343B2 (ja) * 1990-05-07 1997-04-23 三菱電機株式会社 Ｉｃカード
JPH05294093A (ja) * 1991-03-22 1993-11-09 Toshiba Corp 携帯可能記憶媒体
SE470149B (sv) 1991-05-10 1993-11-15 Televerket Anordning för åtkomst av tjänster via telefonapparat
GB2279611A (en) * 1993-07-02 1995-01-11 Gec Avery Ltd An integrated circuit or smart card.
SE508930C2 (sv) * 1995-01-24 1998-11-16 Eco Card Sweden Ab Kort bestående av träskikt med olika fiberriktningar, förfarande för tillverkning samt användning av kortet
WO1996028629A1 (fr) * 1995-03-16 1996-09-19 Medeco Security Locks, Inc. Appareil universel a utiliser avec des dispositifs de commande d'acces electroniques et/ou mecaniques
AU722265B2 (en) * 1995-04-13 2000-07-27 Dainippon Printing Co. Ltd. IC card and IC module
DE29515521U1 (de) * 1995-09-28 1996-01-18 TELBUS Gesellschaft für elektronische Kommunikations-Systeme mbH, 85391 Allershausen Multi-Chip-Modul
DE19611237A1 (de) * 1996-03-21 1997-09-25 Siemens Ag Multichipkarte
US5708419A (en) * 1996-07-22 1998-01-13 Checkpoint Systems, Inc. Method of wire bonding an integrated circuit to an ultraflexible substrate
FR2756954B1 (fr) * 1996-12-05 1999-01-15 Solaic Sa Carte a circuit integre comportant une couche de rigidification
DE19959364A1 (de) * 1999-12-09 2001-06-13 Orga Kartensysteme Gmbh Chipkarte
FR2846446B1 (fr) * 2002-10-28 2005-02-18 Oberthur Card Syst Sa Carte a puce comportant un composant debouchant et un procede de fabrication
EP2633744A1 (fr) * 2010-10-29 2013-09-04 Linxens Holding Circuits imprimés souples
JP6331723B2 (ja) * 2014-06-05 2018-05-30 凸版印刷株式会社 Ｉｃカード

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5329260B2 (fr) * 1972-08-25 1978-08-19
US4004133A (en) * 1974-12-30 1977-01-18 Rca Corporation Credit card containing electronic circuit
US4216577A (en) * 1975-12-31 1980-08-12 Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card
DE2920012C2 (de) * 1979-05-17 1988-09-29 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
DE3111516A1 (de) * 1981-03-24 1982-12-23 GAO Gesellschaft für Automation und Organisation mbH, 8000 München "ausweiskarte mit ic-baustein"
NL191959B (nl) * 1981-03-24 1996-07-01 Gao Ges Automation Org Identificatiekaart met IC-bouwsteen en dragerelement voor een IC-bouwsteen.
JPS5892597A (ja) * 1981-11-28 1983-06-01 大日本印刷株式会社 Ｉｃカ−ドの製造方法
FR2520541A1 (fr) * 1982-01-22 1983-07-29 Flonic Sa Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede
FR2541018A1 (fr) * 1983-02-16 1984-08-17 Radiotechnique Compelec Procede de dissipation thermique, appareil de lecture-ecriture, et carte electronique a dissipation thermique elevee
DE3420051A1 (de) * 1984-05-29 1985-12-05 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit ic-baustein und verfahren zur herstellung eines derartigen datentraegers
JPS6182285A (ja) * 1984-09-29 1986-04-25 Toshiba Corp Ｉｃカ−ド

Also Published As

Publication number Publication date
DE3546272A1 (de) 1986-07-03
JPS61157990A (ja) 1986-07-17
FR2575567A1 (fr) 1986-07-04
US4682017A (en) 1987-07-21

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