DE29515521U1 - Multi-Chip-Modul - Google Patents

Multi-Chip-Modul

Info

Publication number
DE29515521U1
DE29515521U1 DE29515521U DE29515521U DE29515521U1 DE 29515521 U1 DE29515521 U1 DE 29515521U1 DE 29515521 U DE29515521 U DE 29515521U DE 29515521 U DE29515521 U DE 29515521U DE 29515521 U1 DE29515521 U1 DE 29515521U1
Authority
DE
Germany
Prior art keywords
chip module
chip
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29515521U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TELBUS GES fur ELEKTRONISCHE
Original Assignee
TELBUS GES fur ELEKTRONISCHE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TELBUS GES fur ELEKTRONISCHE filed Critical TELBUS GES fur ELEKTRONISCHE
Priority to DE29515521U priority Critical patent/DE29515521U1/de
Publication of DE29515521U1 publication Critical patent/DE29515521U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
DE29515521U 1995-09-28 1995-09-28 Multi-Chip-Modul Expired - Lifetime DE29515521U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE29515521U DE29515521U1 (de) 1995-09-28 1995-09-28 Multi-Chip-Modul

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29515521U DE29515521U1 (de) 1995-09-28 1995-09-28 Multi-Chip-Modul

Publications (1)

Publication Number Publication Date
DE29515521U1 true DE29515521U1 (de) 1996-01-18

Family

ID=8013563

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29515521U Expired - Lifetime DE29515521U1 (de) 1995-09-28 1995-09-28 Multi-Chip-Modul

Country Status (1)

Country Link
DE (1) DE29515521U1 (de)

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH623183A5 (en) * 1976-11-26 1981-05-15 Nitto Electric Ind Co Circuit board and method for its production
DE3535791A1 (de) * 1984-11-05 1986-05-07 Casio Computer Co., Ltd., Tokio/Tokyo Karte mit eingebautem chip
DE3546272A1 (de) * 1984-12-29 1986-07-03 Kyodo Printing Co., Ltd., Tokio/Tokyo Ic-karte
US4780791A (en) * 1986-04-08 1988-10-25 Fujisoku Electric Co., Ltd. Card-shaped memory having an IC module
US4868713A (en) * 1987-03-31 1989-09-19 Mitsubishi Denki Kabushiki Kaisha Memory card housing a smiconductor device
US4958258A (en) * 1987-12-22 1990-09-18 Thomson-Csf Modular hybrid microelectronic structures with high density of integration
DE3934453A1 (de) * 1989-10-14 1991-04-18 Standard Elektrik Lorenz Ag Spritzgegossene leiterplatte
US5083189A (en) * 1987-03-31 1992-01-21 Kabushiki Kaisha Toshiba Resin-sealed type IC device
DE9113498U1 (de) * 1991-09-19 1992-02-27 Export-Contor Aussenhandelsgesellschaft Mbh, 8500 Nuernberg, De
DE9112597U1 (de) * 1991-10-10 1992-06-11 Buch Elektronik Gmbh, 3257 Springe, De
DE9210198U1 (de) * 1992-07-30 1992-10-15 Meyerhoff, Dieter, 4010 Hilden, De
US5264730A (en) * 1990-01-06 1993-11-23 Fujitsu Limited Resin mold package structure of integrated circuit
DE4225154A1 (de) * 1992-07-30 1994-02-03 Meyerhoff Dieter Chip-Modul
US5355102A (en) * 1990-04-05 1994-10-11 General Electric Company HDI impedance matched microwave circuit assembly
DE4337921A1 (de) * 1993-11-06 1995-05-11 Manfred Dr Michalk Kontaktlose Chipkarte mit Antennenspule und Verfahren zu ihrer Herstellung
DE4340583A1 (de) * 1993-11-29 1995-06-01 Krautkraemer Gmbh Temperaturstabilisierter Hybridschaltkreis
US5484689A (en) * 1992-04-02 1996-01-16 Nippon Paper Industries Co., Ltd. Optical recording material comprising a bis-dithiobenzilnickel complex

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH623183A5 (en) * 1976-11-26 1981-05-15 Nitto Electric Ind Co Circuit board and method for its production
DE3535791A1 (de) * 1984-11-05 1986-05-07 Casio Computer Co., Ltd., Tokio/Tokyo Karte mit eingebautem chip
DE3546272A1 (de) * 1984-12-29 1986-07-03 Kyodo Printing Co., Ltd., Tokio/Tokyo Ic-karte
US4780791A (en) * 1986-04-08 1988-10-25 Fujisoku Electric Co., Ltd. Card-shaped memory having an IC module
US4868713A (en) * 1987-03-31 1989-09-19 Mitsubishi Denki Kabushiki Kaisha Memory card housing a smiconductor device
US5083189A (en) * 1987-03-31 1992-01-21 Kabushiki Kaisha Toshiba Resin-sealed type IC device
US4958258A (en) * 1987-12-22 1990-09-18 Thomson-Csf Modular hybrid microelectronic structures with high density of integration
DE3934453A1 (de) * 1989-10-14 1991-04-18 Standard Elektrik Lorenz Ag Spritzgegossene leiterplatte
US5264730A (en) * 1990-01-06 1993-11-23 Fujitsu Limited Resin mold package structure of integrated circuit
US5355102A (en) * 1990-04-05 1994-10-11 General Electric Company HDI impedance matched microwave circuit assembly
DE9113498U1 (de) * 1991-09-19 1992-02-27 Export-Contor Aussenhandelsgesellschaft Mbh, 8500 Nuernberg, De
DE9112597U1 (de) * 1991-10-10 1992-06-11 Buch Elektronik Gmbh, 3257 Springe, De
US5484689A (en) * 1992-04-02 1996-01-16 Nippon Paper Industries Co., Ltd. Optical recording material comprising a bis-dithiobenzilnickel complex
DE9210198U1 (de) * 1992-07-30 1992-10-15 Meyerhoff, Dieter, 4010 Hilden, De
DE4225154A1 (de) * 1992-07-30 1994-02-03 Meyerhoff Dieter Chip-Modul
DE4337921A1 (de) * 1993-11-06 1995-05-11 Manfred Dr Michalk Kontaktlose Chipkarte mit Antennenspule und Verfahren zu ihrer Herstellung
DE4340583A1 (de) * 1993-11-29 1995-06-01 Krautkraemer Gmbh Temperaturstabilisierter Hybridschaltkreis

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP 4-112560 A.,In: Patents Abstracts of Japan, E-1243,Aug. 4,1992,Vol.16,No.360 *
THOMPSON,Patrick. MCM-L Product Development Process for Low-Cost MCM's. In: IEEE Transactions On Components, Packaging, And Manufacturing Technology, Part B, Vol.18, No.1, Feb. 1995, S.9-12 *

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 19960229

R163 Identified publications notified

Effective date: 19960301

R156 Lapse of ip right after 3 years

Effective date: 19990701