DE19680505T1 - Peltier-Modul - Google Patents
Peltier-ModulInfo
- Publication number
- DE19680505T1 DE19680505T1 DE19680505T DE19680505T DE19680505T1 DE 19680505 T1 DE19680505 T1 DE 19680505T1 DE 19680505 T DE19680505 T DE 19680505T DE 19680505 T DE19680505 T DE 19680505T DE 19680505 T1 DE19680505 T1 DE 19680505T1
- Authority
- DE
- Germany
- Prior art keywords
- peltier module
- peltier
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12869395A JP3951315B2 (ja) | 1995-05-26 | 1995-05-26 | ペルチェモジュール |
PCT/JP1996/001421 WO1996037918A1 (fr) | 1995-05-26 | 1996-05-27 | Module de peltier |
Publications (2)
Publication Number | Publication Date |
---|---|
DE19680505T1 true DE19680505T1 (de) | 1997-07-31 |
DE19680505C2 DE19680505C2 (de) | 2001-10-31 |
Family
ID=14991091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19680505T Expired - Fee Related DE19680505C2 (de) | 1995-05-26 | 1996-05-27 | Peltier-Effekt-Modul und Verfahren zu seiner Herstellung |
Country Status (6)
Country | Link |
---|---|
US (1) | US5841064A (de) |
JP (1) | JP3951315B2 (de) |
CN (1) | CN1107985C (de) |
DE (1) | DE19680505C2 (de) |
TW (1) | TW342086U (de) |
WO (1) | WO1996037918A1 (de) |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI104919B (fi) * | 1997-01-23 | 2000-04-28 | Laijoki Puska Ritva | Menetelmä ja laitteisto tilateoksessa |
US7133726B1 (en) * | 1997-03-28 | 2006-11-07 | Applera Corporation | Thermal cycler for PCR |
CN1236488A (zh) * | 1997-08-25 | 1999-11-24 | 时至准钟表股份有限公司 | 热电装置 |
JP3298532B2 (ja) * | 1998-12-25 | 2002-07-02 | 日本電気株式会社 | 半導体レーザモジュール |
US6378311B1 (en) | 2000-05-18 | 2002-04-30 | Raytheon Company | Thermoelectric dehumidifier |
US6530231B1 (en) | 2000-09-22 | 2003-03-11 | Te Technology, Inc. | Thermoelectric assembly sealing member and thermoelectric assembly incorporating same |
CN1228864C (zh) * | 2001-04-24 | 2005-11-23 | 顶级制冷股份有限公司 | 电冷却装置 |
US6716036B2 (en) * | 2002-05-15 | 2004-04-06 | Ormet Circuits, Inc. | Method of attaching circuitry to a modular jack connector using electrically conductive paste |
AU2002349276A1 (en) * | 2002-10-05 | 2004-05-04 | Johann Geiger | Peltier element |
US20060107986A1 (en) * | 2004-01-29 | 2006-05-25 | Abramov Vladimir S | Peltier cooling systems with high aspect ratio |
JP4528571B2 (ja) * | 2004-07-16 | 2010-08-18 | 株式会社東芝 | 熱−電気直接変換装置 |
JP4521236B2 (ja) * | 2004-08-31 | 2010-08-11 | 株式会社東芝 | 熱電変換装置及び熱電変換装置の製造方法 |
US8063298B2 (en) * | 2004-10-22 | 2011-11-22 | Nextreme Thermal Solutions, Inc. | Methods of forming embedded thermoelectric coolers with adjacent thermally conductive fields |
US20060157102A1 (en) * | 2005-01-12 | 2006-07-20 | Showa Denko K.K. | Waste heat recovery system and thermoelectric conversion system |
JP2006237547A (ja) * | 2005-01-27 | 2006-09-07 | Kyocera Corp | 熱電変換モジュール、これを用いた発電装置及び冷却装置 |
US20060179849A1 (en) * | 2005-02-14 | 2006-08-17 | Abramov Vladimir S | Peltier based heat transfer systems |
JP4274134B2 (ja) * | 2005-02-15 | 2009-06-03 | ヤマハ株式会社 | 熱電モジュールおよびその製造方法 |
JP4901350B2 (ja) * | 2005-08-02 | 2012-03-21 | 株式会社東芝 | 熱電変換装置及びその製造方法 |
US20070101737A1 (en) | 2005-11-09 | 2007-05-10 | Masao Akei | Refrigeration system including thermoelectric heat recovery and actuation |
US7310953B2 (en) | 2005-11-09 | 2007-12-25 | Emerson Climate Technologies, Inc. | Refrigeration system including thermoelectric module |
JP2008108976A (ja) * | 2006-10-26 | 2008-05-08 | Ube Ind Ltd | 熱電変換モジュール及びその製造方法 |
TWI338390B (en) * | 2007-07-12 | 2011-03-01 | Ind Tech Res Inst | Flexible thermoelectric device and manufacturing method thereof |
DE102007035931A1 (de) * | 2007-07-31 | 2009-02-05 | Bayerische Motoren Werke Aktiengesellschaft | Anordnung für einen thermoelektrischen Generator |
JP2010109132A (ja) * | 2008-10-30 | 2010-05-13 | Yamaha Corp | 熱電モジュールを備えたパッケージおよびその製造方法 |
US20120047912A1 (en) * | 2008-12-11 | 2012-03-01 | Lamos Inc. | Split thermo-electric cycles for simultaneous cooling, heating, and temperature control |
WO2010067367A2 (en) * | 2008-12-11 | 2010-06-17 | Lamos Inc. | Split-thermo-electric structures |
TWI395354B (zh) * | 2009-03-05 | 2013-05-01 | Ind Tech Res Inst | 熱電轉換裝置 |
DE102009025033A1 (de) * | 2009-06-10 | 2010-12-16 | Behr Gmbh & Co. Kg | Thermoelektrische Vorrichtung und Verfahren zum Herstellen einer thermoelektrischen Vorrichtung |
CN101752496B (zh) * | 2009-07-14 | 2011-11-30 | 郭建国 | 外加电场型温差发电热电堆电池及其制冷装置 |
DE102010022968A1 (de) * | 2010-06-08 | 2011-12-08 | A. Raymond Et Cie S.C.S. | Vorrichtung zum thermoelektrischen Erzeugen von elektrischer Energie |
WO2012037099A2 (en) * | 2010-09-13 | 2012-03-22 | Ferrotec (Usa) Corporation | Thermoelectric modules and assemblies with stress reducing structure |
DE102011005246A1 (de) * | 2011-03-08 | 2012-09-13 | Behr Gmbh & Co. Kg | Verfahren zur Herstellung eines thermoelektrischen Moduls |
DE102011075661A1 (de) * | 2011-03-29 | 2012-10-04 | Micropelt Gmbh | Thermoelektrische Anordnung und Verfahren zum Herstelleneiner thermoelektrischen Anordnung |
JP2013008736A (ja) * | 2011-06-22 | 2013-01-10 | Toyota Industries Corp | 熱電変換モジュールと該熱電変換モジュールの製造方法 |
JP6017906B2 (ja) * | 2011-10-19 | 2016-11-02 | 株式会社Kelk | 温調装置 |
US9337409B2 (en) | 2011-11-22 | 2016-05-10 | Furukawa Co., Ltd. | Thermoelectric conversion module |
RU2511274C1 (ru) * | 2012-10-15 | 2014-04-10 | Юрий Максимович Белов | Термоэлектрический модуль |
DE102013202785A1 (de) | 2013-02-20 | 2014-08-21 | Behr Gmbh & Co. Kg | Thermoelektrisches Modul |
US9679753B2 (en) | 2013-03-14 | 2017-06-13 | University Of Massachusetts | Peltier-cooled cryogenic laser ablation cell |
US9303902B2 (en) * | 2013-03-15 | 2016-04-05 | Laird Technologies, Inc. | Thermoelectric assembly |
DE102013208764A1 (de) * | 2013-05-13 | 2014-11-13 | Behr Gmbh & Co. Kg | Thermoelektrisches Modul |
DE102014208433A1 (de) * | 2014-05-06 | 2015-11-26 | MAHLE Behr GmbH & Co. KG | Thermoelektrische Vorrichtung, insbesondere für ein Kraftfahrzeug |
DE102014216974A1 (de) * | 2014-08-26 | 2016-03-03 | Mahle International Gmbh | Thermoelektrisches Modul |
FR3040239B1 (fr) * | 2015-08-21 | 2018-08-03 | Universite De Lorraine | Element thermoelectrique ameliore et convertisseur thermoelectrique comportant un tel element. |
DE102016202435A1 (de) * | 2016-02-17 | 2017-08-17 | Mahle International Gmbh | Wärmeübertrager |
US11768017B2 (en) | 2016-08-12 | 2023-09-26 | Te Technology, Inc. | Thermoelectric assembly sealing member with vapor barrier |
US10808971B2 (en) | 2016-08-12 | 2020-10-20 | Te Technology, Inc. | Thermoelectric assembly sealing member with metal vapor barrier |
KR102511769B1 (ko) * | 2018-09-11 | 2023-03-21 | 엘지이노텍 주식회사 | 열전모듈 |
JP2022099385A (ja) * | 2020-12-23 | 2022-07-05 | 株式会社Kelk | 熱電発電装置 |
US20230272948A1 (en) * | 2022-02-25 | 2023-08-31 | Laird Thermal Systems, Inc. | Thermoelectric Assemblies with Plastic Moisture Barriers |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2289152A (en) * | 1939-06-13 | 1942-07-07 | Westinghouse Electric & Mfg Co | Method of assembling thermoelectric generators |
DE1034669B (de) * | 1957-01-30 | 1958-07-24 | Siemens Ag | Thermoelektrische Kuehleinrichtung |
US3040539A (en) * | 1960-04-27 | 1962-06-26 | Gen Motors Corp | Refrigerating apparatus |
US3090206A (en) * | 1960-06-23 | 1963-05-21 | Frank W Anders | Thermoelectric devices and circuits therefor |
US3339002A (en) * | 1961-11-01 | 1967-08-29 | Johns Manville | Integral molding method of making a thermoelectric generator |
US3225549A (en) * | 1962-04-18 | 1965-12-28 | Thore M Elfving | Thermoelectric cooling device |
US3240628A (en) * | 1962-06-14 | 1966-03-15 | Carrier Corp | Thermoelectric panel |
US3325312A (en) * | 1962-06-14 | 1967-06-13 | Carrier Corp | Thermoelectric panels |
US3208877A (en) * | 1962-06-14 | 1965-09-28 | Carrier Corp | Thermoelectric panels |
US3261079A (en) * | 1962-09-10 | 1966-07-19 | Texas Instruments Inc | Fabrication of thermoelectric apparatus |
DE1196261B (de) * | 1962-11-09 | 1965-07-08 | Thore Martin Elfving | Thermoelektrische Waermepumpe |
US3411955A (en) * | 1962-11-13 | 1968-11-19 | Gen Motors Corp | Thermoelectric device |
US3279955A (en) * | 1963-01-08 | 1966-10-18 | Gen Motors Corp | Method of forming electroplated thermoelectric junction and resultant article |
US3266944A (en) * | 1963-12-03 | 1966-08-16 | Spira George | Hermetically sealed thermoelectric generator |
JPS4912708Y1 (de) * | 1969-07-23 | 1974-03-28 | ||
JPS535008B2 (de) * | 1972-05-15 | 1978-02-23 | ||
US4149025A (en) * | 1977-11-16 | 1979-04-10 | Vasile Niculescu | Method of fabricating thermoelectric power generator modules |
US4497973A (en) * | 1983-02-28 | 1985-02-05 | Ecd-Anr Energy Conversion Company | Thermoelectric device exhibiting decreased stress |
US4493939A (en) * | 1983-10-31 | 1985-01-15 | Varo, Inc. | Method and apparatus for fabricating a thermoelectric array |
JPS62158850A (ja) * | 1985-12-28 | 1987-07-14 | Mitsubishi Alum Co Ltd | 熱交換器用Al合金フイン材 |
JPH0410703Y2 (de) * | 1986-03-28 | 1992-03-17 | ||
JP2685531B2 (ja) * | 1988-09-21 | 1997-12-03 | 株式会社日立製作所 | ノズル用超音波探傷装置 |
JPH02139976A (ja) * | 1988-11-21 | 1990-05-29 | Matsushita Electric Ind Co Ltd | 熱電変換モジュール |
DE4006861A1 (de) * | 1990-03-03 | 1991-09-05 | Peltron Gmbh | Aufbau von peltier-elementen mit zerteilten abdeckplatten |
JPH04123475A (ja) * | 1990-09-14 | 1992-04-23 | Hitachi Ltd | 熱電変換モジュール |
JP3451107B2 (ja) * | 1992-10-05 | 2003-09-29 | 株式会社エコ・トゥエンティーワン | 電子冷却装置 |
JPH06294562A (ja) * | 1993-02-10 | 1994-10-21 | Matsushita Electric Works Ltd | 電子加熱冷却装置 |
-
1995
- 1995-05-26 JP JP12869395A patent/JP3951315B2/ja not_active Expired - Fee Related
-
1996
- 1996-05-27 DE DE19680505T patent/DE19680505C2/de not_active Expired - Fee Related
- 1996-05-27 US US08/776,186 patent/US5841064A/en not_active Expired - Lifetime
- 1996-05-27 WO PCT/JP1996/001421 patent/WO1996037918A1/ja active Application Filing
- 1996-05-27 CN CN96190794.0A patent/CN1107985C/zh not_active Expired - Fee Related
- 1996-08-27 TW TW086208733U patent/TW342086U/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JPH08321637A (ja) | 1996-12-03 |
WO1996037918A1 (fr) | 1996-11-28 |
JP3951315B2 (ja) | 2007-08-01 |
DE19680505C2 (de) | 2001-10-31 |
TW342086U (en) | 1998-10-01 |
US5841064A (en) | 1998-11-24 |
CN1166891A (zh) | 1997-12-03 |
CN1107985C (zh) | 2003-05-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8607 | Notification of search results after publication | ||
8607 | Notification of search results after publication | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |
Effective date: 20131203 |