KR920008954A - 반도체 장치 - Google Patents

반도체 장치 Download PDF

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Publication number
KR920008954A
KR920008954A KR1019910017212A KR910017212A KR920008954A KR 920008954 A KR920008954 A KR 920008954A KR 1019910017212 A KR1019910017212 A KR 1019910017212A KR 910017212 A KR910017212 A KR 910017212A KR 920008954 A KR920008954 A KR 920008954A
Authority
KR
South Korea
Prior art keywords
semiconductor substrate
semiconductor devices
mold resin
stress buffer
semiconductor device
Prior art date
Application number
KR1019910017212A
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English (en)
Other versions
KR950001366B1 (ko
Inventor
에쓰시 아시다데
히로쓰지 아시다루
히로 노소미쓰기
Original Assignee
시기 모리야
미쓰비시 뎅끼 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 시기 모리야, 미쓰비시 뎅끼 가부시끼가이샤 filed Critical 시기 모리야
Publication of KR920008954A publication Critical patent/KR920008954A/ko
Application granted granted Critical
Publication of KR950001366B1 publication Critical patent/KR950001366B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165—Reinforcing structures
    • H01L2224/02166—Collar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

내용없음.

Description

반도체 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 1실시예에 관한 반도체 장치의 단면도.
제2a~제2d도는 제1도에 표시하는 반도체 장치의 제조공정을 단면도로 표시한 것.
제3a도는 종래의 반도체 장치의 평면도.
제3b도는 제3a도에 있어 ⅢB-ⅢB선에 따른 단면도.
제4a~제4f도는 타의 종래예에 관한 반도체 장치의 제조공정을 표시하는 단면도.
* 도면의 주요부분에 대한 부호의 설명
1 : 반도체 기판 2 : 트랜지스터
6 : 올가노 실리콘라더 포리마 9 : 몰드수지
더욱 각 도면중 동일부호는 동일 또는 상당부분을 표시한다.

Claims (1)

  1. 몰드수지로 봉하여 막은 반도체 장치이고, 소자가 형성된 반도체 기판과, 상기 반도체 기판상에 설치된 응력완충막과, 상기 응력완충막 및 상기 반도체 기판을 봉하여 막기 위해서의 몰드수지를 구비하여 상기 응력완충막은 그의 말단에 수산기를 가지는 올가노 실리콘라더 포리마를 포함하는 반도체 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910017212A 1990-10-01 1991-10-01 반도체 장치 KR950001366B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2264674A JP2613128B2 (ja) 1990-10-01 1990-10-01 半導体装置
JP90-264674 1990-10-01

Publications (2)

Publication Number Publication Date
KR920008954A true KR920008954A (ko) 1992-05-28
KR950001366B1 KR950001366B1 (ko) 1995-02-17

Family

ID=17406628

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910017212A KR950001366B1 (ko) 1990-10-01 1991-10-01 반도체 장치

Country Status (5)

Country Link
US (1) US5278451A (ko)
EP (1) EP0479127B1 (ko)
JP (1) JP2613128B2 (ko)
KR (1) KR950001366B1 (ko)
DE (1) DE69114808T2 (ko)

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JPH04233732A (ja) * 1990-08-16 1992-08-21 Motorola Inc 半導体の製造工程で使用するスピン・オン誘電体
JPH04261049A (ja) * 1991-01-31 1992-09-17 Mitsubishi Electric Corp 半導体装置およびその製造方法
JPH0799271A (ja) * 1993-06-16 1995-04-11 Mitsubishi Electric Corp 半導体装置
EP0720223B1 (en) * 1994-12-30 2003-03-26 STMicroelectronics S.r.l. Process for the production of a semiconductor device having better interface adhesion between dielectric layers
US5600151A (en) * 1995-02-13 1997-02-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device comprising a semiconductor substrate, an element formed thereon, and a stress-buffering film made of a silicone ladder resin
JPH0955425A (ja) * 1995-08-10 1997-02-25 Mitsubishi Electric Corp 多層Ａｌ配線構造を有する半導体装置およびその製造方法
JP3398004B2 (ja) * 1997-03-24 2003-04-21 ローム株式会社 パッケージ型半導体装置の構造
US6413576B1 (en) * 1998-10-05 2002-07-02 Kulicke & Soffa Investments, Inc. Semiconductor copper bond pad surface protection
US6704113B1 (en) * 2000-03-28 2004-03-09 Juliusz W. Adamczuk Non-destructive surface inspection and profiling
US7031935B1 (en) 2000-07-31 2006-04-18 J.P. Morgan Advisory Services Inc. Method and system for computing path dependent probabilities of attaining financial goals
BRPI0101486B1 (pt) * 2001-04-17 2017-09-19 Cristália Produtos Químicos Farmacêuticos Ltda. Pharmaceutical composition for topic use containing heparin for the treatment of skin or mucosal injuries caused by burns
US7091131B2 (en) * 2002-03-21 2006-08-15 Micron Technology, Inc. Method of forming integrated circuit structures in silicone ladder polymer
WO2004032587A1 (en) * 2002-10-03 2004-04-15 Poly-Products Ind. Co. Ltd. Electrical with a water-tight housing and method of making same
JP2010095595A (ja) * 2008-10-15 2010-04-30 Seiko Epson Corp 接合方法および接合体
US8450770B2 (en) * 2010-05-11 2013-05-28 Advanced Semiconductor Engineering, Inc. Light emitting package structure
US9525308B1 (en) 2013-03-15 2016-12-20 Overhead Door Corporation Emergency door release with backup power
JP6197118B2 (ja) 2013-12-09 2017-09-13 スリーエム イノベイティブ プロパティズ カンパニー 硬化性シルセスキオキサンポリマー、組成物、物品、及び方法
US10370564B2 (en) 2014-06-20 2019-08-06 3M Innovative Properties Company Adhesive compositions comprising a silsesquioxane polymer crosslinker, articles and methods
US10392538B2 (en) 2014-06-20 2019-08-27 3M Innovative Properties Company Adhesive compositions comprising a silsesquioxane polymer crosslinker, articles and methods
KR20170063735A (ko) 2014-09-22 2017-06-08 쓰리엠 이노베이티브 프로퍼티즈 캄파니 실세스퀴옥산 중합체 코어와 실세스퀴옥산 중합체 외층, 및 반응성 기를 포함하는 경화성 중합체
US9957416B2 (en) 2014-09-22 2018-05-01 3M Innovative Properties Company Curable end-capped silsesquioxane polymer comprising reactive groups

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Also Published As

Publication number Publication date
EP0479127B1 (en) 1995-11-22
EP0479127A3 (en) 1993-05-12
DE69114808T2 (de) 1996-05-23
JPH04142069A (ja) 1992-05-15
EP0479127A2 (en) 1992-04-08
DE69114808D1 (de) 1996-01-04
JP2613128B2 (ja) 1997-05-21
KR950001366B1 (ko) 1995-02-17
US5278451A (en) 1994-01-11

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