DE69114808D1 - Harzummantelte Halbleiteranordnung. - Google Patents

Harzummantelte Halbleiteranordnung.

Info

Publication number
DE69114808D1
DE69114808D1 DE69114808T DE69114808T DE69114808D1 DE 69114808 D1 DE69114808 D1 DE 69114808D1 DE 69114808 T DE69114808 T DE 69114808T DE 69114808 T DE69114808 T DE 69114808T DE 69114808 D1 DE69114808 D1 DE 69114808D1
Authority
DE
Germany
Prior art keywords
resin
semiconductor device
coated semiconductor
coated
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69114808T
Other languages
English (en)
Other versions
DE69114808T2 (de
Inventor
Etsushi Adachi
Hiroshi Adachi
Hiroshi Mochizuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of DE69114808D1 publication Critical patent/DE69114808D1/de
Publication of DE69114808T2 publication Critical patent/DE69114808T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165—Reinforcing structures
    • H01L2224/02166—Collar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE69114808T 1990-10-01 1991-09-26 Harzummantelte Halbleiteranordnung. Expired - Fee Related DE69114808T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2264674A JP2613128B2 (ja) 1990-10-01 1990-10-01 半導体装置

Publications (2)

Publication Number Publication Date
DE69114808D1 true DE69114808D1 (de) 1996-01-04
DE69114808T2 DE69114808T2 (de) 1996-05-23

Family

ID=17406628

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69114808T Expired - Fee Related DE69114808T2 (de) 1990-10-01 1991-09-26 Harzummantelte Halbleiteranordnung.

Country Status (5)

Country Link
US (1) US5278451A (de)
EP (1) EP0479127B1 (de)
JP (1) JP2613128B2 (de)
KR (1) KR950001366B1 (de)
DE (1) DE69114808T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04233732A (ja) * 1990-08-16 1992-08-21 Motorola Inc 半導体の製造工程で使用するスピン・オン誘電体
JPH04261049A (ja) * 1991-01-31 1992-09-17 Mitsubishi Electric Corp 半導体装置およびその製造方法
JPH0799271A (ja) * 1993-06-16 1995-04-11 Mitsubishi Electric Corp 半導体装置
EP0720223B1 (de) * 1994-12-30 2003-03-26 STMicroelectronics S.r.l. Herstellungsverfahren für Halbleiteranordnung mit besserer Haftung zwischen dielektrischen Lagen
US5600151A (en) * 1995-02-13 1997-02-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device comprising a semiconductor substrate, an element formed thereon, and a stress-buffering film made of a silicone ladder resin
JPH0955425A (ja) * 1995-08-10 1997-02-25 Mitsubishi Electric Corp 多層Ａｌ配線構造を有する半導体装置およびその製造方法
JP3398004B2 (ja) * 1997-03-24 2003-04-21 ローム株式会社 パッケージ型半導体装置の構造
WO2000021126A1 (en) * 1998-10-05 2000-04-13 Kulicke & Soffa Investments, Inc. Semiconductor copper bond pad surface protection
US6704113B1 (en) * 2000-03-28 2004-03-09 Juliusz W. Adamczuk Non-destructive surface inspection and profiling
US7031935B1 (en) 2000-07-31 2006-04-18 J.P. Morgan Advisory Services Inc. Method and system for computing path dependent probabilities of attaining financial goals
BRPI0101486B1 (pt) * 2001-04-17 2017-09-19 Cristália Produtos Químicos Farmacêuticos Ltda. Pharmaceutical composition for topic use containing heparin for the treatment of skin or mucosal injuries caused by burns
US7091131B2 (en) * 2002-03-21 2006-08-15 Micron Technology, Inc. Method of forming integrated circuit structures in silicone ladder polymer
WO2004032587A1 (en) * 2002-10-03 2004-04-15 Poly-Products Ind. Co. Ltd. Electrical with a water-tight housing and method of making same
JP2010095595A (ja) * 2008-10-15 2010-04-30 Seiko Epson Corp 接合方法および接合体
US8450770B2 (en) * 2010-05-11 2013-05-28 Advanced Semiconductor Engineering, Inc. Light emitting package structure
US9525308B1 (en) 2013-03-15 2016-12-20 Overhead Door Corporation Emergency door release with backup power
US10066123B2 (en) 2013-12-09 2018-09-04 3M Innovative Properties Company Curable silsesquioxane polymers, compositions, articles, and methods
US10370564B2 (en) 2014-06-20 2019-08-06 3M Innovative Properties Company Adhesive compositions comprising a silsesquioxane polymer crosslinker, articles and methods
US10392538B2 (en) 2014-06-20 2019-08-27 3M Innovative Properties Company Adhesive compositions comprising a silsesquioxane polymer crosslinker, articles and methods
US9957416B2 (en) 2014-09-22 2018-05-01 3M Innovative Properties Company Curable end-capped silsesquioxane polymer comprising reactive groups
JP2017528577A (ja) 2014-09-22 2017-09-28 スリーエム イノベイティブ プロパティズ カンパニー シルセスキオキサンポリマーコア、シルセスキオキサンポリマー外層、及び反応性基を含む硬化性ポリマー

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3975757A (en) * 1974-05-31 1976-08-17 National Semiconductor Corporation Molded electrical device
US4395527A (en) * 1978-05-17 1983-07-26 M & T Chemicals Inc. Siloxane-containing polymers
JPS6058592B2 (ja) * 1978-10-06 1985-12-20 株式会社日立製作所 半導体装置
JPS55111148A (en) * 1979-02-21 1980-08-27 Hitachi Ltd Semiconductor device
DE3065150D1 (en) * 1979-06-21 1983-11-10 Fujitsu Ltd Improved electronic device having multilayer wiring structure
GB2101148B (en) * 1981-04-14 1984-10-24 Hitachi Ltd Composition of protective coating material
JPS63213347A (ja) * 1987-02-27 1988-09-06 Mitsubishi Electric Corp 半導体装置
JPH0192224A (ja) * 1987-04-20 1989-04-11 Mitsubishi Electric Corp 高純度フェニルシリコーンラダーポリマーの製造法
US5030699A (en) * 1988-06-07 1991-07-09 Showa Denko K.K. Ladder silicone oligomer composition

Also Published As

Publication number Publication date
JP2613128B2 (ja) 1997-05-21
EP0479127A3 (en) 1993-05-12
DE69114808T2 (de) 1996-05-23
KR950001366B1 (ko) 1995-02-17
EP0479127B1 (de) 1995-11-22
KR920008954A (ko) 1992-05-28
EP0479127A2 (de) 1992-04-08
JPH04142069A (ja) 1992-05-15
US5278451A (en) 1994-01-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee