DE69016527D1 - Halbleiteranordnung. - Google Patents
Halbleiteranordnung.Info
- Publication number
- DE69016527D1 DE69016527D1 DE69016527T DE69016527T DE69016527D1 DE 69016527 D1 DE69016527 D1 DE 69016527D1 DE 69016527 T DE69016527 T DE 69016527T DE 69016527 T DE69016527 T DE 69016527T DE 69016527 D1 DE69016527 D1 DE 69016527D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL8902018A NL8902018A (nl) | 1989-08-07 | 1989-08-07 | Halfgeleiderinrichting. |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69016527D1 true DE69016527D1 (de) | 1995-03-16 |
DE69016527T2 DE69016527T2 (de) | 1995-08-31 |
Family
ID=19855147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69016527T Expired - Fee Related DE69016527T2 (de) | 1989-08-07 | 1990-08-03 | Halbleiteranordnung. |
Country Status (6)
Country | Link |
---|---|
US (1) | US5043793A (de) |
EP (1) | EP0412608B1 (de) |
JP (1) | JP2558172B2 (de) |
KR (1) | KR0185383B1 (de) |
DE (1) | DE69016527T2 (de) |
NL (1) | NL8902018A (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3223246B2 (ja) * | 1997-07-25 | 2001-10-29 | 東レ・ダウコーニング・シリコーン株式会社 | 半導体装置 |
US6621173B1 (en) | 1998-07-23 | 2003-09-16 | Dow Corning Toray Silicone Co., Ltd. | Semiconductor device having an adhesive and a sealant |
US6204557B1 (en) | 1999-09-13 | 2001-03-20 | Integrated Device Technology, Inc. | Reduction of topside movement during temperature cycles |
US7071559B2 (en) * | 2004-07-16 | 2006-07-04 | International Business Machines Corporation | Design of beol patterns to reduce the stresses on structures below chip bondpads |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5748252A (en) * | 1980-09-08 | 1982-03-19 | Nec Corp | Semiconductor device and manufacture thereof |
JPS60206153A (ja) * | 1984-03-30 | 1985-10-17 | Toshiba Corp | 半導体装置 |
JPS6110243A (ja) * | 1984-06-26 | 1986-01-17 | Nec Corp | 半導体装置 |
JPS61230344A (ja) * | 1985-04-05 | 1986-10-14 | Toray Silicone Co Ltd | 樹脂封止型半導体装置 |
EP0275588B1 (de) * | 1986-12-19 | 1993-11-10 | Koninklijke Philips Electronics N.V. | Verfahren zum Herstellen einer Halbleitervorrichtung mit vermindertem Verpackungsdruck |
-
1989
- 1989-08-07 NL NL8902018A patent/NL8902018A/nl not_active Application Discontinuation
-
1990
- 1990-07-17 US US07/554,631 patent/US5043793A/en not_active Expired - Lifetime
- 1990-08-03 JP JP2206660A patent/JP2558172B2/ja not_active Expired - Fee Related
- 1990-08-03 DE DE69016527T patent/DE69016527T2/de not_active Expired - Fee Related
- 1990-08-03 EP EP90202114A patent/EP0412608B1/de not_active Expired - Lifetime
- 1990-08-06 KR KR1019900011993A patent/KR0185383B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR910005404A (ko) | 1991-03-30 |
KR0185383B1 (ko) | 1999-04-15 |
EP0412608A1 (de) | 1991-02-13 |
EP0412608B1 (de) | 1995-02-01 |
DE69016527T2 (de) | 1995-08-31 |
JPH0377354A (ja) | 1991-04-02 |
NL8902018A (nl) | 1991-03-01 |
JP2558172B2 (ja) | 1996-11-27 |
US5043793A (en) | 1991-08-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3850855T2 (de) | Halbleitervorrichtung. | |
DE68917848D1 (de) | Halbleiteranordnung. | |
DE68921421T2 (de) | Halbleitervorrichtung. | |
DE69022537D1 (de) | Halbleiterspeicheranordnung. | |
DE69017518T2 (de) | Halbleiterspeicheranordnung. | |
DE3889354T2 (de) | Halbleiteranordnung. | |
DE69009626T2 (de) | Masterslice-Halbleitervorrichtung. | |
DE69021904D1 (de) | Zusammengesetzte Halbleitervorrichtung. | |
DE68917971D1 (de) | Halbleitervorrichtung. | |
DE69033794D1 (de) | Halbleiteranordnung | |
DE59003052D1 (de) | Halbleiterbauelement. | |
DE69031609T2 (de) | Halbleiteranordnung | |
DE69016577T2 (de) | Halbleiterspeicheranordnung. | |
DE69029226D1 (de) | Halbleiteranordnung | |
DE68914885T2 (de) | Halbleitervorrichtung. | |
DE69027586D1 (de) | Halbleiteranordnung | |
DE69025825D1 (de) | Halbleiteranordnung | |
KR900012356A (ko) | 반도체장치 | |
KR900015287A (ko) | 반도체장치 | |
DE69016527T2 (de) | Halbleiteranordnung. | |
DE69022508D1 (de) | Halbleiterspeicheranordnung. | |
DE69023625D1 (de) | Halbleitervorrichtung. | |
DE69012814D1 (de) | Lichtemittierende halbleitervorrichtung. | |
KR900019258A (ko) | 반도체장치 | |
KR910013564A (ko) | 반도체장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN, N |
|
8320 | Willingness to grant licences declared (paragraph 23) | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: VOLMER, G., DIPL.-ING., PAT.-ANW., 52066 AACHEN |
|
8339 | Ceased/non-payment of the annual fee |