KR900008701A - 반도체 장치의 제조방법 - Google Patents

반도체 장치의 제조방법 Download PDF

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Publication number
KR900008701A
KR900008701A KR1019890015978A KR890015978A KR900008701A KR 900008701 A KR900008701 A KR 900008701A KR 1019890015978 A KR1019890015978 A KR 1019890015978A KR 890015978 A KR890015978 A KR 890015978A KR 900008701 A KR900008701 A KR 900008701A
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South Korea
Prior art keywords
semiconductor chip
light transmitting
transmitting window
liquid
liquid agent
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KR1019890015978A
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English (en)
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KR920010318B1 (ko
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고우지 시노미야
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시기 모리야
미쓰비시 뎅끼 가부시끼가이샤
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Publication of KR900008701A publication Critical patent/KR900008701A/ko
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Publication of KR920010318B1 publication Critical patent/KR920010318B1/ko

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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract

내용 없음.

Description

반도체 장치의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 제3도까지는 각각의 발명의 1실시예에 관한 반도체장치의 제조방법을 공정순으로 표시하는 단면도.

Claims (1)

  1. 수광소자를 상면에 비치한 반도체칩의 상기 상면에 상기 수광소자를 에워싸도록 2액 혼합형 접착제의 일방의 액제를 도포하고, 광투과용창의 하면에 상기 반도체칩의 상면에 도포한 상기 일방의 액제(液制)에 대응케하여 상기 2액 혼합형 접착제의 타방의 액제를 도포하고, 상기 반도체칩의 상면에 도포된 상기 일방의 액제와 상기 광투과용창의 하면에 도포된 상기 타방의 액제를 접촉하게함으로서 상기 반도체 칩과 상기 광투과용창을 고착하고, 상기 광투과용창의 상면이 노출하도록 상기 반도체칩 및 상기 광투과용창의 일부를 수지몰드하는 것을 특징으로 하는 반도체장치의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890015978A 1988-11-25 1989-11-04 반도체장치의 제조방법 KR920010318B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP88-295996 1988-11-25
JP63295996A JPH02143466A (ja) 1988-11-25 1988-11-25 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
KR900008701A true KR900008701A (ko) 1990-06-04
KR920010318B1 KR920010318B1 (ko) 1992-11-26

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KR1019890015978A KR920010318B1 (ko) 1988-11-25 1989-11-04 반도체장치의 제조방법

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US (1) US4957882A (ko)
JP (1) JPH02143466A (ko)
KR (1) KR920010318B1 (ko)
DE (1) DE3937996A1 (ko)

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US4957882A (en) 1990-09-18

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