JPS6425428A - Connection of element - Google Patents

Connection of element

Info

Publication number
JPS6425428A
JPS6425428A JP18094287A JP18094287A JPS6425428A JP S6425428 A JPS6425428 A JP S6425428A JP 18094287 A JP18094287 A JP 18094287A JP 18094287 A JP18094287 A JP 18094287A JP S6425428 A JPS6425428 A JP S6425428A
Authority
JP
Japan
Prior art keywords
solder
board
sphere
infrared ray
drum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18094287A
Other languages
Japanese (ja)
Inventor
Hiroshi Ohira
Masayuki Saito
Akira Niitsuma
Chiaki Tanuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP18094287A priority Critical patent/JPS6425428A/en
Publication of JPS6425428A publication Critical patent/JPS6425428A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/10165—Alignment aids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H01L2224/8114—Guiding structures outside the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H01L2224/81815—Reflow soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81909—Post-treatment of the bump connector or bonding area
    • H01L2224/8193—Reshaping
    • H01L2224/81935—Reshaping by heating means, e.g. reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Abstract

PURPOSE:To absorb thermal expansion difference between a semiconductor element and a wiring board and to prevent a connection from disconnecting due to a thermal hysteresis by increasing the length of a solder post for bonding the element to the board. CONSTITUTION:A metal layer 12 disposed at four corners of a semiconductor element 11 is dipped in a melted eutectic solder bath to form a solder semisphere 13. The sphere 13 is also formed in the same manner as before on the copper foil pattern 14 of a wiring board 15. Then, the board 15 faces oppositely the element 11, the substrate is heated and held at 150 deg.C, the sphere 13 is melted by irradiating an infrared ray from the element side to form a drum-like solder 13. Thereafter, the element is raised to control an interval between the element and the board to stop the irradiation of the infrared ray, air-cooled to prepare a solder post 13 exhibiting slender and thick drum-like columnar state.
JP18094287A 1987-07-22 1987-07-22 Connection of element Pending JPS6425428A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18094287A JPS6425428A (en) 1987-07-22 1987-07-22 Connection of element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18094287A JPS6425428A (en) 1987-07-22 1987-07-22 Connection of element

Publications (1)

Publication Number Publication Date
JPS6425428A true JPS6425428A (en) 1989-01-27

Family

ID=16091971

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18094287A Pending JPS6425428A (en) 1987-07-22 1987-07-22 Connection of element

Country Status (1)

Country Link
JP (1) JPS6425428A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4957882A (en) * 1988-11-25 1990-09-18 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing semiconductor device
WO1997002596A1 (en) * 1995-06-30 1997-01-23 Kabushiki Kaisha Toshiba Electronic component and method of production thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4957882A (en) * 1988-11-25 1990-09-18 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing semiconductor device
WO1997002596A1 (en) * 1995-06-30 1997-01-23 Kabushiki Kaisha Toshiba Electronic component and method of production thereof
US6262513B1 (en) 1995-06-30 2001-07-17 Kabushiki Kaisha Toshiba Electronic component and method of production thereof
US6628043B2 (en) 1995-06-30 2003-09-30 Kabushiki Kaisha Toshiba Electronic component and method of production thereof
US6754950B2 (en) 1995-06-30 2004-06-29 Kabushiki Kaisha Toshiba Electronic component and method of production thereof

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