JPS5649549A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5649549A
JPS5649549A JP12411279A JP12411279A JPS5649549A JP S5649549 A JPS5649549 A JP S5649549A JP 12411279 A JP12411279 A JP 12411279A JP 12411279 A JP12411279 A JP 12411279A JP S5649549 A JPS5649549 A JP S5649549A
Authority
JP
Japan
Prior art keywords
solder
substrate
devices
stud
wick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12411279A
Other languages
Japanese (ja)
Inventor
Kanji Otsuka
Shinji Onishi
Takehisa Nitta
Tamotsu Usami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12411279A priority Critical patent/JPS5649549A/en
Publication of JPS5649549A publication Critical patent/JPS5649549A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To ensure the fining of electrodes and raise heat radiation effect through the process consisting of providing multilayer wiring on one surface of a substrate, fitting a lead-out pin and a semiconductor device beside the wiring and fastening a heat radiating stud on the other surface so that the stud may face with the device. CONSTITUTION:A multilayer wiring layer 2 of Al and Au with a given pattern is formed and input and output signal pins 6 are set up using a solder 8 on one surface of a base-insulated substrate 1 made of silica glass or sapphire. Further, similarly, a plurality of semiconductor devices 3 are fastened using a solder ball 4 and the surfaces thereof are protected by a silicon jelly 7. Next, a recess 12 is formed on the other surface of the substrate 1 to face with the devices 3 and a heat radiating stud whose surface is wrapped with a gauze ring or wick 10 closely to the devices 3 is fitted therein and fastened to the substrate 1 using a solder 9. Thereafter, Freon gas is filled in the wick 10 for bettering heat radiation and a hole 11 is sealed using a solder 11'.
JP12411279A 1979-09-28 1979-09-28 Semiconductor device Pending JPS5649549A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12411279A JPS5649549A (en) 1979-09-28 1979-09-28 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12411279A JPS5649549A (en) 1979-09-28 1979-09-28 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5649549A true JPS5649549A (en) 1981-05-06

Family

ID=14877213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12411279A Pending JPS5649549A (en) 1979-09-28 1979-09-28 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5649549A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57183749U (en) * 1981-05-19 1982-11-20
JPH03100172U (en) * 1990-01-26 1991-10-18

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57183749U (en) * 1981-05-19 1982-11-20
JPH03100172U (en) * 1990-01-26 1991-10-18

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