JPS5636157A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5636157A
JPS5636157A JP11041279A JP11041279A JPS5636157A JP S5636157 A JPS5636157 A JP S5636157A JP 11041279 A JP11041279 A JP 11041279A JP 11041279 A JP11041279 A JP 11041279A JP S5636157 A JPS5636157 A JP S5636157A
Authority
JP
Japan
Prior art keywords
chip
film
insulating film
final protective
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11041279A
Other languages
Japanese (ja)
Inventor
Yasunobu Osa
Takeo Yoshimi
Toshimasa Kihara
Hiroki Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11041279A priority Critical patent/JPS5636157A/en
Publication of JPS5636157A publication Critical patent/JPS5636157A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Element Separation (AREA)
  • Non-Volatile Memory (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE:To eliminate local electrification on the surface of a chip whereon a semiconductor integrated circuit is provided, by manufacturing a thin electroconductive film on a final protective insulating film on the surface of the chip. CONSTITUTION:Wirings 3 are made from an n<+> type diffusion layer on an Si semiconductor substrate (chip) 2. An insulator layer 4 is made of a layer insulating film such as PSG and a final protective insulating film on the surface of the chip 2. A thin transparent electroconductive film 6 such as a nesa glass film (SnO2) produced by a CVD method is provided on almost all the surface of the final protective film.
JP11041279A 1979-08-31 1979-08-31 Semiconductor device Pending JPS5636157A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11041279A JPS5636157A (en) 1979-08-31 1979-08-31 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11041279A JPS5636157A (en) 1979-08-31 1979-08-31 Semiconductor device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP19714886A Division JPS6276564A (en) 1986-08-25 1986-08-25 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5636157A true JPS5636157A (en) 1981-04-09

Family

ID=14535116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11041279A Pending JPS5636157A (en) 1979-08-31 1979-08-31 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5636157A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122776A (en) * 1982-01-14 1983-07-21 Fujitsu Ltd Semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5353973A (en) * 1976-10-26 1978-05-16 Nec Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5353973A (en) * 1976-10-26 1978-05-16 Nec Corp Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122776A (en) * 1982-01-14 1983-07-21 Fujitsu Ltd Semiconductor device
JPH0412035B2 (en) * 1982-01-14 1992-03-03 Fujitsu Ltd

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