JPS5771152A - Integrated circuit package - Google Patents

Integrated circuit package

Info

Publication number
JPS5771152A
JPS5771152A JP14717280A JP14717280A JPS5771152A JP S5771152 A JPS5771152 A JP S5771152A JP 14717280 A JP14717280 A JP 14717280A JP 14717280 A JP14717280 A JP 14717280A JP S5771152 A JPS5771152 A JP S5771152A
Authority
JP
Japan
Prior art keywords
package
constitution
attained
main part
reverse direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14717280A
Other languages
Japanese (ja)
Inventor
Tsugio Tawara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP14717280A priority Critical patent/JPS5771152A/en
Publication of JPS5771152A publication Critical patent/JPS5771152A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/0651—Wire or wire-like electrical connections from device to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06582—Housing for the assembly, e.g. chip scale package [CSP]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To reduce a mounting space through high integration of circuits by a method wherein on a main part of the first package, a main part of the second package, which are supplied with IC chips individually, is palced to take a reverse direction individually, and they are combined by adhesive agent. CONSTITUTION:A package 6 which has an IC chip 2 attached on a ceramic substrate 1 and connected to a lead wire 3 with a wire 4, and a package of the same constitution are laid in layers in reverse direction individually, and inserted into a high temperature atomosphere. After a fusible adhesive glass 5 on each upper surface of the package is fused, it is cooled to a normal temperature, glass 5 is hardened, and a package assembly containig a pair of ICs through both parts jointed hermetically is completed. By this constitution a doubly integrated package can be attained, and a mounting space is reduced to a half value. And because no lid is required on a package, reduction of a price can be attained.
JP14717280A 1980-10-20 1980-10-20 Integrated circuit package Pending JPS5771152A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14717280A JPS5771152A (en) 1980-10-20 1980-10-20 Integrated circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14717280A JPS5771152A (en) 1980-10-20 1980-10-20 Integrated circuit package

Publications (1)

Publication Number Publication Date
JPS5771152A true JPS5771152A (en) 1982-05-01

Family

ID=15424204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14717280A Pending JPS5771152A (en) 1980-10-20 1980-10-20 Integrated circuit package

Country Status (1)

Country Link
JP (1) JPS5771152A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100575590B1 (en) * 2003-12-17 2006-05-03 삼성전자주식회사 Thermal emission type stack package and modules mounting the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100575590B1 (en) * 2003-12-17 2006-05-03 삼성전자주식회사 Thermal emission type stack package and modules mounting the same

Similar Documents

Publication Publication Date Title
CA2159243A1 (en) Method of Manufacturing Chip-Size Package-Type Semiconductor Device
GB2088635B (en) Encapsulation for semiconductor integrated circuit chip
JPS5731166A (en) Semiconductor device
JPS55146944A (en) Method of fabricating monolithic integrated microelectronic semiconductor circuit
EP0361825A3 (en) Semiconductor chip and method of manufacturing it
EP0355955A3 (en) Connection for semiconductor devices or integrated circuits by coated wires and method of manufacturing the same
JPS5771152A (en) Integrated circuit package
JPS57197838A (en) Semiconductor flip chip element
JPS57126154A (en) Lsi package
JPS6459947A (en) Semiconductor device
JPS54104286A (en) Integrated circuit device
JPS6473753A (en) Semiconductor integrated circuit device
JPS57115850A (en) Chip carrier for semiconductor ic
JPS5640268A (en) Semiconductor device
JPS647645A (en) Semiconductor device and manufacture thereof
JPS61136249A (en) Hybrid ic
JPS55165662A (en) Semiconductor device
JPS56146256A (en) Hybrid ic device
KR860001486A (en) Chip-on-chip semiconductor integrated circuit
JPS5718348A (en) Integrated circuit device
JPS56120147A (en) Integrated circuit package
JPS644053A (en) Semiconductor device
JPS6482656A (en) Sealing structure for hybrid integrated circuit
JPS5649549A (en) Semiconductor device
JPS61284951A (en) Semiconductor device